GaN基MSM结构紫外探测器光响应特性

在求解一维电流连续性方程和传输方程的同时考虑表面态陷阱的作用,获得了GaN基MSM结构紫外探测器在稳态光照下的电流随电压变化的解析解,从而导出了其光响应特性主要参数,并解释了电流和响应度随偏压变化的原因和光增益现象.将该模型应用于具体器件,实验测得饱和临界偏压约6 V,稳态电流6×10-8A,响应率0.085 7 A/W,与理论计算较吻合.     

GaN基发光二极管的可靠性研究进展

高效高亮度GaN基发光二极管(LED)在图像显示、信号指示、照明以及基础研究等方面有着极为广阔的应用前景,器件的可靠性是实现其广泛应用的保证.本文从封装材料退化、金属的电迁移、p型欧姆接触退化、深能级与非辐射复合中心增加等方面介绍了GaN基LED的退化机理以及提高器件可靠性的措施,并对GaN基LED的应用前景进行了展望.     

氮化镓干法刻蚀研究进展

对比了RIE,ECR,ICP等几种GaN干法刻蚀方法的特点.回顾了GaN干法刻蚀领域的研究进展.以ICP刻蚀GaN和AlGaN材料为例,通过工艺参数的优化,得到了高刻蚀速率和理想的选择比及形貌.在优化后的刻蚀工艺条件下GaN材料刻蚀速率达到340nm/min,侧墙倾斜度大于80°且刻蚀表面均方根粗糙度小于3nm.对引起干法刻蚀损伤的因素进行了讨论,并介绍了几种减小刻蚀损伤的方法.     

一种新的AlGaN/GaN HEMT半经验直流特性模型

在EEHEMT1模型的基础上给出一种新的A1GaN/GaN HEMT半经验直流特性模型,考虑了栅源电压对膝点电压的影响,得到描述AlGaN/GaN HEMT器件I-Ⅴ特性的方程.此模型可以应用于蓝宝石和SiC两种不同衬底AlGaN/GaN HEMT器件的I-Ⅴ特性模拟.仿真结果和实验测量结果拟合误差小于3%.     

AlGaN/GaN异质结构的欧姆接触

通过改变Ti/Al的结构及退火条件,研究了AlGaN/GaN异质结构上Ti/Al/Ni/Au金属体系所形成的欧姆接触.结果表明,Ti/Al/Ni/Au金属厚度分别为20,120,55和45nm,退火条件为高纯N2气氛中850℃、30s时在AlGaN/GaN异质结构上获得了良好的欧姆接触,其比接触电阻率为3.30×10-6Ω·cm2.SEM分析表明该条件下的欧姆接触具有良好的表面形貌,可以很好地满足高性能AlGaN/GaN高电子迁移率晶体管制造的要求.     

半导体GaN功率开关器件灵敏度测试技术

测试半导体GaN功率开关器件灵敏度对掌握器件性能具有重要意义,提出一种新的半导体GaN功率开关器件灵敏度测试技术。通过分析半导体GaN功率开关器件的导通电阻与击穿电压关系、空穴电流与栅极电流关系掌握功率开关器件击穿机理,在此基础上,测试半导体GaN功率开关器件灵敏度;根据灵敏度测试原理与微频通道衰减值周期检查原理,测量功率开关器件微频信号功率和微频通道衰减值,汇总微频通道衰减值和最后一次开关灵敏时的衰减值,得到半导体GaN功率开关器件灵敏度。实验结果表明：所提测试技术测量半导体GaN功率开关器件灵敏度过程中,平均测试误差为0.03 dB,仅平均花费9.42ms,是一种高效、可靠的半导体GaN功率开关器件灵敏度测试技术。     

应用于微型成像的氮化镓超透镜设计

为了实现可见光入射时亚波长尺度内的聚焦,设计了以氮化镓(GaN)纳米柱为基本晶胞的超透镜,该透镜能够改进传统成像系统的笨重低效,可应用于微型成像系统。超透镜表面由宽度渐变高度不变的GaN纳米柱阵列构成,分析GaN在亚波长尺度内对相位的调控能力和机理,并基于时域有限差分法模拟仿真了在蓝光波长为460nm入射时透射场的高效率聚焦,对比超透镜尺寸为3.75μm×3.75μm、6.75μm×6.75μm、8.75μm×8.75μm、10.75μm×10.75μm时超透镜的聚焦能力,得出聚焦后透射场焦点处的半峰全宽分别为1,0.8,0.5,0.3μm,给出了强度分布、聚焦光斑等仿真模拟结果,发现实际焦距与设计值存在偏差,且随超透镜尺寸的变化而变化。文中所设计的超透镜能够在微米级别实现聚焦,有效降低了传统成像系统的复杂度。     

Dislocation luminescence in GaN single crystals under nanoindentation

This work presents an experimental study on the dislocation luminescence in GaN by nanoindentation, cathodoluminescence, and Raman. The dislocation luminescence peaking at 3.12 eV exhibits a series of special properties in the cathodoluminescence measurements, and it completely disappears after annealing at 500°C. Raman spectroscopy shows evidence for existence of vacancies in the indented region. A comprehensive investigation encompassing cathodoluminescence, Raman, and annealing experiments allow the assignment of dislocation luminescence to conduction-band-acceptor transition involving Ga vacancies. The nanoscale plasticity of GaN can be better understood by considering the dislocation luminescence mechanism.     

Low-temperature ECR-PEMOCVD deposition of high-quality crystalline gallium nitride films: A comparative study of intermediate layers for growth on amorphous glass substrates

A low temperature growth method based on an electron cyclotron resonance plasma-enhanced metal organic chemical vapor deposition system (ECR-PEMOCVD) was proposed for the growth of GaN (Gallium nitride) films on ordinary amorphous soda-lime glass substrates. To alleviate the large lattice mismatch between GaN film and glass substrate and improve the heat dissipation performance for potential optoelctrical device application, five intermediate layers (Cu, Ni, Ti, Ag, and ITO) were deposited on the glass substrate before the growth of GaN. A comparative study was performed through structural analysis of the as-grown GaN films with various intermediate layers investigated by means of in-situ reflection high energy electron diffraction (RHEED), X-ray diffraction (XRD), and atomic force microscopy (AFM). The results indicate that the Ti intermediate layer has a great advantage over other intermediate layers in view of crystalline quality and smooth surface, therefore is more suitable and preferred for the potential application in optoelectronic devices.     

Recent progress of physical failure analysis of GaN HEMTs

Gallium nitride (GaN)-based high-electron mobility transistors (HEMTs) are widely used in high power and high frequency application fields,due to the outstanding physical and chemical properties of the GaN material.However,GaN HEMTs suffer from degradations and even failures during practical applications,making physical analyses of post-failure devices extremely significant for reliability improvements and further device optimizations.In this paper,common physical characterization techniques for post failure analyses are introduced,several failure mechanisms and corresponding failure phenomena are reviewed and summarized,and finally device optimization methods are discussed.