中性硅酮建筑密封胶

本文着重介绍了建筑和装璜用脱醇型中性硅酮密封胶的设计制作原理，性能及其影响因素和施工使用方法。     

硅酮结构密封胶技术与市场的现状和发展

重点分析了建筑用硅酮结构密封胶生产及应用技术和市场的现状，论述国家取消对该产品行政审批后的市场发展趋势。     

耐高温低毒性防腐蚀涂料

介绍了耐高温低毒性防腐蚀涂料的成膜物质—有机硅中间体改性有机树脂的制备工艺原则、性能比较，有机硅中间体改性丙烯酸酯树脂的制备方法，主要原材料选择与要求，涂料配制，涂料性能指标及应用。     

玻璃幕墙用硅酮结构密封胶系列产品

重点介绍了与MF881双组分硅酮结构密封胶相配套的MF899单组分硅酮结构密封胶和MF889单组分硅酮耐候密封胶系列产品的配方研究、基本性能、工艺性能及使用要求等。     

《建筑用硅酮结构密封胶》标准05版97版的区别

比较了GB16776《建筑用硅酮结构密封胶》标准05版与97版的区别：指出05版标准更能体现产品的性能，在具体执行中可操作性更强；同时提出了05版标准中可以探讨的几个问题。     

IGBT器件封装用有机硅凝胶宽频介电特性与温度影响

有机硅凝胶材料作为IGBT器件封装用绝缘材料,在器件的运行工况下,器件承受着重复性导通关断电压,对应频谱宽,且器件损耗将引起温度升高。为了能够准确分析器件内部电场特性,运用频域介电谱技术对有机硅凝胶在宽频、宽温度范围内的介电特性进行研究,利用叉指电极,实现对有机硅凝胶在不同温度下的宽频介电谱测试。采用Cole-Cole介电模型对实验数据进行拟合,并分析温度对Cole-Cole模型特征参量的影响规律。研究结果表明：频率和温度对有机硅凝胶的介电特性均有较大影响,在低频高温下,有机硅凝胶材料相对复介电常数的实部、虚部都显著增加。在所提取的Cole-Cole介电模型的特征参量中,直流电导率σ₀及特征参量Δε₁与温度之间的关系都满足Arrhenius方程,热活化能分别为0.233 eV与0.691 eV;弛豫时间τ₁和τ₂随温度的变化规律有所不同,但在高温时都明显增加。对半导体器件封装用有机硅凝胶材料介电特性的认知可以为器件内部电场分析和绝缘设计提供基础数据支撑。     

Understanding Electrical Performance and Microstructure of Water Tree Aged Cables after Silicone Injection during Electrical-Thermal Accelerated Aging

To further understand the long-term effect of rejuvenation fluid on water tree aged cross-linked polyethylene (XLPE) cables after silicone injection, electrical performance and microstructure of water tree aged cables were investigated during an electrical-thermal accelerated aging experiment. Two groups of treated and untreated water tree aged cable samples were subjected to electrical-thermal aging for 2 weeks. The results of the dielectric loss factor showed that the electrical performance of the treated samples was significantly better than that of untreated samples after electrical-thermal aging. Microobservation results showed that the overall water tree sizes of the treated samples were much smaller than those of the untreated samples after electrical-thermal aging. Furthermore, there was a second growth of water trees in the original water tree region during electrical-thermal aging in both groups of samples. Using scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS), rejuvenation fillers were observed tightly embedded in water tree voids after electrical-thermal aging. The infrared (IR) spectroscopy analysis results showed that the concentration of rejuvenation fluid increased from the outer layer to the inner layer of insulation. Based on the results, due to the improvement of the electric field at the water tree tip and the diffusion of silicone fluid in the insulation layer, both the second growth in the original water tree region and continuing growth at the water tree tip can be effectively inhibited.     

道路有机硅密封胶的性能评价与技术要求

为了评价道路有机硅密封胶的性能,分析了国内外的各种技术标准,根据路用性能要求,提出了表干时间、固化时间、流平性、流值、弹性(复原)率以及低温拉伸这6个评价指标.分别对4种有机硅密封胶(2种进口材料和2种国产材料)进行试验,试验证实这些材料均为自流平材料,表干时间不超过90 min,固化时间为2～3周,弹性(复原)率均超过90％,90℃流值均为0 mm,-30℃下至少可通过100％拉伸量的3次循环.结果表明:有机硅密封胶是高弹性材料,具有开放交通快、施工方便等优点,且具有优越的高低温性能.另外还根据试验结果提出了相应的技术要求.     

高硅氧烷自乳化硅丙乳液制备与性能研究

报道了以四甲基四乙烯基环四硅氧烷和乙烯基三甲氧基硅烷为有机硅单体,在无乳化剂情况下,利用甲基丙烯酸甲酯、甲基丙烯酸(钠)和烯丙基羟乙基醚共聚物替代乳化剂制备自乳化硅丙乳液的方法。通过L9(3)4正交试验进行配方优化,结果表明当体系pH=5±0.5,引发剂为K2S2O8:NaHSO3=2:1,用量为单体总量0.5%时,最佳配方为MAA:AOE:YDH:V4:MMA=8:9:4:20:59,凝胶率0.18%,通过红外光谱分析得知环硅烷已开环,且所有单体均已参加共聚反应;热重分析结果表明无皂硅丙乳液热稳定性好,最大热分解温度为449℃;通过TEM和SEM对乳液及胶膜微观形貌进行表征,乳液平均粒径158nm,PDI=0.031,Zeta=-53.9mV,粒径分布窄,具有单分散性,乳液成膜性好,胶膜平整细腻,适于制备建筑涂料。     

补强型透明电子灌封胶的制备及性能

为了改善透明电子灌封胶的力学性能,采用加成反应制备了补强型室温固化透明电子灌封胶。首先,通过开环聚合制备乙烯基封端的聚硅氧烷;以硅氢基封端的聚硅氧烷为交联剂,在铂配合物的催化作用下,制备得到可室温固化的透明型灌封基胶。采用MQ硅树脂对基胶进行补强,研究了MQ硅树脂的含量对灌封胶透光性、力学和绝缘性能的影响。结果表明,MQ硅树脂在含量15份时,补强型灌封胶的可见光透过率、电阻率、拉伸强度分别达到84%、2.77×1014Ω·cm、5.2 MPa;MQ硅树脂的适量加入有效提高了灌封胶的力学性能;试样在热老化和湿热老化之后仍保持优良的光学、力学和绝缘性能。