LiFe2/3Mn1/3PO4/C composite was prepared by the rheological phase reaction using LiH2PO4, Li2CO3, FePO4, Mn(Ac)2·4H2O and ascorbic acid as starting materials. The crystal structure and morphology of as-synthesized sample were characterized by X-ray diffraction (XRD) and scanning electron microscopy (SEM). The analysis of XRD results showed that the obtained sample was single-phase with orthorhombic olivine-type structure (Pnma space group). SEM micrographs revealed that the sample was aggregates, with an irregular morphology. The initial discharge capacity was 166.9, 149.1, 139.6, 112.8, 82.93 mAh g??1 at the rate of 0.1, 0.5, 1, 2, and 10 C, respectively. And when the rate was 0.1, 0.5, 1, 2, and 10 C, the capacity retention was 92.2%, 90%, 92.9%, 97.6%, 91.5% after 50, 100, 200, 200, 500 cycles, respectively.
Low‐melting liquid metal is a hugely promising material for flexible conductive patterns due to its excellent conductivity and supercompliance, especially low‐cost and environmental liquid processing technology. However, the ever‐present fluidity characteristic greatly limits the stable shape and reliability of prepared liquid metal conductive electronics. Herein, a novel solidification strategy of liquid GaIn alloys by Ni doping and heat treatment is first reported, which can efficiently create a solid phase in the liquid metal and provide an effective solution for practical applications. Particularly, the liquid characteristic is preserved for conveniently fabricating different flexible electronic circuits, and then the solidification is carried out on prepared conductive patterns by heat treatment. The solidification mechanism is revealed by the interface chemical reaction between Ni and GaIn, creating the solid phase of intermetallic compound (Ga4Ni3 and InNi3) during heat treatment. Moreover, a biphasic GaInNi can be obtained by regulating the atomic ratio of gallium, indium, and nickel. As a result, the obtained GaInNi possesses extremely low sheet resistance (15 ± 4.5 to 135 ± 2.5 mΩ sq?1) and the variation of ΔR/R0 exhibits low level (0–2) when strained up to 100%, which offers a promising strategy to prepare stretchable and reliable liquid metal electronics. 相似文献
??The tensile creep of HT9 steel was measured at 700 and 800?? with different stress levels. Stress exponent was fitted by power law relation. Rupture time vs. minimum creep rate of HT9 steel was fitted by M- G relationship and modified M- G relationship. The fracture morphology after creeping and the creep mechanism and damage mechanism were analyzed by scanning electron microscopy, transmission electron microscopy and X- ray diffraction. The results showed that the minimum creep rate and creep rupture time of HT9 steel obeyed a linear relationship with the stress in double logarithmic coordinates, which could be described by M- G and modified M- G relationship. The stress exponent increased with the temperature. The dislocations bypassed the second phase particles during the creep process according to the Orowan mechanism. The fracture had a distinct dimple structure, and some of the second phase particles coarsened. The oxidation of HT9 steel was obvious during the creep at 800??. The main precipitates were M23C6 during the creep, which showed different forms, with significant differences in the size of the precipitated phases. The damage mechanism of HT9 steel included external cross- sectional area loss, material microstructure degradation, environmental damage, etc. There may also be internal sectional area loss. 相似文献