Effects of various fillers on sintering,microstructures and properties of Ca-Ba-Al-B-Si-O glass/ceramic composites简

Low-temperature sintering and properties of LTCC （low temperature co-fired ceramics） materials based on CaO-BaO-Al2O3-B2O3-SiO2 glass and various fillers such as Al2O3, silica glass, christobalite, AlN, ZrO2, MgO-SiO2, TiO2 were investigated. The results show that densification, crystallization, microstructures and dielectric properties of the composites are found to strongly depend on the type of filler. The densification process of glass/ceramic composites with various fillers is mainly from 600 ℃ to 925 ℃, and the initial compacting temperature of samples is 600 ℃. The initial rapid densification of samples starts at its glass softening temperature. LTCC compositions containing Al2O3, silica glass, AlN and MgO-SiO2 fillers start to have the crystallization peaks at 890, 903, 869 and 844 ℃, respectively. The crystallization peaks are believed as correlated to the crystallization of CaAl2SiO8, β-SiO2, Ca2Al2SiO7 and β-SiO2. The composite ceramic with Al2O3, silica glass and TiO2 ceramic have a better dense structure and better smooth fracture surface. Sample for Al2O3 has the lowest dielectric loss tanδ value of 0.00091, whereas the sample for MgO.SiO, has the highest dielectric loss tanδ value of 0.02576. The sample for TiO2 has the highest dielectric constant value of 14.46, whereas the sample for AIN has the lowest dielectric constant value of 4.61.     

CaB_2O_4/CBS复相陶瓷的制备及性能

研究了偏硼酸钙(CaB2O4)与钙硼硅(CBS)玻璃按不同比例制备的CaB2O4/CBS复相陶瓷的相组成、显微结构、介电性能和热膨胀系数等。在200～500℃时,复相陶瓷的热膨胀系数为10×10–6 K–1。当添加w(CBS)为20%,CaB2O4/CBS复相陶瓷经过930℃保温2 h后,试样主要由CaB2O4晶相和少量的β-CaSiO3晶相所构成。微观结构致密,气孔率低,晶粒尺寸为5μm左右。在10 MHz下,εr为7.18,tanδ为1.2×10–4。     

粉料特性对CBS微晶玻璃结构与性能的影响

利用不同快速球磨时间的CaO-B2O3-SiO2(CBS)玻璃粉料,制备了低温烧结的CBS玻璃陶瓷.利用X线衍射仪(XRD)和电子显微镜(SEM),分析粉料特性与 CBS玻璃陶瓷结构的关系,系统研究了粉料特性对CBS玻璃陶瓷的烧结性能、介电性能(10 GHz)及热学性能的影响.结果表明,减小粉料粒径能在较低的烧成温度下实现烧结,并有效提高致密度,有利于降低介电常数和介电损耗.热膨胀系数显著增大,其原因是随着粉料粒径的减小,生成了大量的具有低介电常数、高膨胀系数的石英相.球磨2 h试样在850 ℃的烧结密度为2.615 g·cm-3,吸水率为0.16%,9.98 GHz下的介电常数和损耗分别为6.16和1.98×10-3.     

低介电常数微波介质陶瓷的研究进展

介绍了四种典型的相对介电常数在10-15之间的低介微波介质陶瓷系列(Al2O3系、Mg4Nb2O9系、Mg5(Nb,Ta)4O15系、R2BacuO5系)的晶体结构和微波介电性能,并指出其目前存在的普遍问题和解决的方法.     

Microstructure and microwave dielectric properties of CaO-B2O3-SiO2 glass ceramics with various B2O3 contents

The effects of B2O3 addition on both the sintering behavior and microwave dielectric properties of CaO-B2O3-SiO2 (CBS) glass ceramics were investigated by Fourier transform infrared spectroscopy (FTIR),X-ray diffractometry (XRD) and scanning electron microscopy (SEM).The results show that the increasing amount of B2O3 causes the increase of the contents of [BO3],[BO4] and [SiO4],which deduces the increase of CaB2O4 and α-SiO2 and the decrease of CaSiO3 correspondingly.No new phase is observed throughout the...     

钙铝硼硅/氧化铝系玻璃-陶瓷致密化过程及介电性能

通过DSC、XRD、SEM、EDS等测试手段,研究了钙铝硼硅/氧化铝系玻璃-陶瓷一个典型组成的致密化过程,并讨论了在这过程中物相、微观结构以及介电性能的变化规律。研究结果表明:在800～900℃烧成范围内,材料先致密化后析晶;825℃时,材料已烧结致密化,介电常数达到其最大值;850℃时,玻璃中析出钙长石晶体,介电损耗大幅下降;随着温度的进一步提高,材料结构变得松散,介电损耗略有增大。1 MHz下,850℃所烧试样介电常数为7.9,介电损耗小于1×10~(-3),是一种性能优良的LTCC材料。     

二次烧成对CaO-B_2O_3-SiO_2系微晶玻璃结构和性能的影响

研究一次和二次烧成对CaO-B2O3-SiO2(CBS)微晶玻璃的烧结性能与介电性能的影响。用X线衍射(XRD)、扫描电镜(SEM)等分析探讨二次烧成对CBS微晶玻璃的微观结构与介电性能的关系。结果表明:与一次烧成相比,二次烧成能够促进玻璃体中的小晶粒生长,试样的收缩率和体积密度有所增加,有利于介电常数提高和介质损耗的降低,且体系中没有出现新的晶相;875℃烧结的试样,X/Y轴收缩率均为14.33%,体积密度达到2.46 g/cm3,10MHz介电常数和损耗相应为6.21和3.5×10-3,热膨胀系数为11.86×10-6/℃,抗折强度为157.36MPa。     

LTCC基片流延浆料流变性能研究

流延法制备LTCC基片过程中,有机添加剂对流延浆料流变性能有很大的影响。采用NDJ—11旋转式黏度计测定浆料的流变性能。结果表明:混合溶剂二甲苯/正丁醇对粉料的湿润性能最好,浆料的黏度随剪切速率增加而下降,呈剪切变稀的流变学特性,随着固相体积分数的增加,浆料的最佳分散剂用量也相应增加;浆料的黏度随着增塑剂与粘结剂比值R值的增加而急剧降低,流变性能得到明显改善。     

Tape casting of borosilicate glass/Al2O3 composites for LTCC substrate with various relative molecular masses of PVB

The dispersion, stabilization and rheological properties of the slurry with various relative molecular masses of PVB were studied. The sintering properties, microstructure and dielectric properties of borosilicate glass/Al2O3 composites were also investigated. The intensities of the typical vibrating bands decrease with the decrease of the relative molecular mass of PVB, which demonstrates that the content of butyral groups in PVB binders decreases correspondingly, leading to a rapid decrease in the viscosity of the mixed slurry. The solid content of samples increases with the decrease of the relative molecular mass of PVB, and this further leads to the increase of tape thickness, bulk density and dried-shrinkage coefficient of tapes. The bulk density, relative density, three-point strength and dielectric constant of sintered samples increase with the increase of the solid content, and the shrinkage and dielectric loss decrease. By contrast, samples for PVB-5s exhibit better properties of a bulk density of 3.10g/cm3 , a relative density of 98.1%, a three-point strength of 208 MPa, a ε r value of 8.01, a tanδ value of 7.6×10-4 at 10 MHz and a well matching with Ag electrodes.     

聚四氟乙烯/陶瓷/玻璃纤维复合介质的性能研究

采用热压工艺制得聚四氟乙烯/陶瓷/玻璃纤维复合介质材料。复合介质材料的介电常数随着PTFE和玻璃纤维含量的增加而减小;当复合介质中不含玻璃纤维时,随着陶瓷粉料的质量分数从40%增加到65%时,材料的弹性模量先减小后增加;加入玻璃纤维可以增加材料的弹性模量,对于PTFE的质量分数为40%的复合介质,玻璃纤维加入的质量分数不应大于15%,聚四氟乙烯/陶瓷/玻璃纤维复合介质的微观结构致密、形成了完整的一体。