含钪Al-Cu-Li-Zr合金的热处理制度

通过显微组织观察和室温拉伸实验,研究了固溶热处理制度和时效制度对含Sc的Al-Cu-Li-Zr合金拉伸力学性能与显微组织的影响。结果表明,适当提高固溶温度或延长固溶时间可以促进合金中过剩相的溶解,提高合金的强度和塑性;合金适宜的固溶-时效处理制度为530℃×1 h水淬＋160℃×40 h时效,在此条件下,合金的抗拉强度、屈服强度和伸长率分别为490MPa、416 MPa和9.8%。T1相是合金的主要时效强化相。     

ECAP法制备细晶ZK60镁合金的微观组织与力学性能

利用等通道转角挤压法(ECAP)制备出了细晶ZK60合金,通过金相组织观察,拉伸性能测试,EBSD和透射电镜(TEM)研究了不同挤压温度和挤压道次对合金组织与性能的影响.结果表明:ZK60镁合金在210～240℃温度范围内进行ECAP挤压能获得较好的晶粒细化效果;在240℃进行ECAP挤压时,随着挤压道次的增加,合金晶...     

等通道角挤压制备细晶ZK60镁合金的组织与力学性能

利用两种等通道角挤压(ECAP)方法(普通单步ECAP和两步ECAP)制备细晶ZK60合金。采用金相显微镜、扫描电镜、透射电镜和X射线衍射仪对合金的组织和织构进行观察,通过拉伸试验研究不同ECAP方法对合金力学性能的影响。结果表明:与单步ECAP变形相比,两步ECAP变形,由于降低了变形温度,晶粒细化效果更好;经过(240℃,4道次)+(180℃,4道次)两步ECAP变形后,合金晶粒细化至约0.8μm;合金的力学性能与材料的织构密切相关,由于存在织构软化效应,与挤压态相比,经单步ECAP变形后合金的强度有所降低,而伸长率明显提高;但经两步ECAP变形后,由于细晶强化和亚结构强化的作用,合金的强度得到提高。     

含Sc超高强Al-Zn-Cu-Mg-Zr合金的热变形行为和微观组织

采用热模拟实验对含Sc超高强Al-Zn-Cu-Mg-Zr合金在应变速率为0.001～10s-1、变形温度为380～470℃的条件下进行了热压缩实验.研究了实验合金的流变应力行为和微观组织演变.结果表明:流变应力随变形温度升高而下降;随应变速率增加峰值应力也相应增加.随变形温度升高和应变速率降低,合金动态再结晶的程度加深,亚晶尺寸变大.含Sc超高强Al-Zn-Cu-Mg-Zr合金,形成了Al3Sc弥散相,该相可强烈抑制再结晶.合金主要软化机制为动态回复伴随动态再结晶.     

含Sc超高强Al-Zn-Cu-Mg-Sc-Zr合金的热压缩变形流变应力

采用Gleeblel500热模拟机在应变速率为0.001～10/s、温度为380～470℃、真应变为0～0.7的条件下,研究了实验合金的流变应力行为.结果表明:该合金热压缩变形时存在较明显的稳态流变特征,当ε<1/s时,流变应力开始随应变增加而增加,达到峰值后趋于平稳,呈动态回复特征;当ε≥1/s时,流变应力均出现了明显的峰值应力,为连续动态再结晶特征.带Zener-Hollomon参数的双曲正弦函数可描述合金高温变形时的流变应力,σ解析表达式中A、α和n值分别为5.952×108/s、0.021 MPa-1和5.397:热变形激活能Q为157.9kJ/mol.     

热处理对2124铝合金热轧厚板组织与性能的影响

通过室温拉伸性能测试和DSC、TEM分析, 对2124铝合金40 mm厚板的热处理制度进行了研究。研究结果表明, 合金主要强化相为S'和θ'过渡相; 合金的适宜固溶温度为495～500 ℃, 固溶时间为80～100 min; 适当提高固溶温度或延长固溶时间, 合金中过剩相的溶解程度增大, 提高了合金的固溶程度, 从而提高合金的强度; 合金适宜的时效温度为185 ℃, 时效时间为12 h。     

时效对含Sc的Al-Cu-Li-Zr合金腐蚀行为的影响

研究了一种含Sc的Al-Cu-Li-Zr合金在不同时效状态下的晶间腐蚀和剥落腐蚀行为.结果表明：不同时效温度下峰时效态合金的晶间腐蚀和剥落腐蚀倾向随着时效温度的升高而增加；在160℃下时效，合金的晶间腐蚀和剥落腐蚀倾向随着时效时间的延长而增加.含Sc的Al-Cu-Li-Zr合金在EXCO溶液中进行的极化曲线测试结果也表现出相同的腐蚀趋势.微观组织观察分析表明，T1（Al2CuLi）相和无沉淀析出带（PFZ）是引起合金腐蚀敏感性增加的主要因素.     

含钪Al-Cu-Li-Zr合金的热处理

通过显微组织观察和室温拉伸实验，研究了固溶处理制度和时效前预变形对含Sc的Al-Cu-Li-Zr合金力学性能与显微组织的影响。结果表明：适当提高固溶温度或延长固溶时间可以促进合金中过剩相的溶解，提高合金的强度和塑性；时效前适量的预变形促进T1相的大量弥散、细小析出，显著提高合金强度。过大的预变形量使T1相变得粗大且分布不均匀，合金强度降低。合金适宜的固溶制度为530℃，保温60min，适宜的预变形量为3．5％。     

Microstructures and properties of Sn-Ag-Cu lead-flee solder alloys containing La

Trace amounts of La were utilized to improve the melting behaviors, microstructures, tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior of Sn-3.0Ag-0.5Cu alloy according to the differential thermal analysis （DTA） tests. The X-ray diffraction （XRD） patterns show that β-Sn, Ag3Sn and Cu6Sn5 coexist in the as-cast solder alloys and LaSn3 phases emerge when adding 0.4% La. The microstructures modified by La are more uniform and much finer than that of baseline alloy, and the coarse LaSn3 particles with complex dendrites are observed by optical microscopy （OM） and scanning electron microscopy （SEM） when the addition of La is up to 0.4%. The composition of the LaSn3 phases is identified by energy-dispersive spectroscopy （EDS）. There are considerable improvements in mechanical properties with 0.05% and 0.1% addition, but degenerations by adding 0.4%La. The Vickers microhardness of β-Sn and eutectic area are both enhanced with the addition of La and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area.     

Flow stress behavior of Al-Cu-Li-Zr alloy containing Sc during hot compression deformation

The flow stress behavior of Al-3.5Cu-1.5Li-0.25（Sc＋Zr） alloy during hot compression deformation was studied by isothermal compression test using Gleeble-1500 thermal-mechanical simulator. Compression tests were preformed in the temperature range of 653-773 K and in the strain rate range of 0.001-10 s^-1 up to a true plastic strain of 0.7. The results indicate that the flow stress of the alloy increases with increasing strain rate at a given temperature,and decreases with increasing temperature at a given imposed strain rate. The relationship between the flow stress and the strain rate and the temperature was derived by analyzing the experimental data. The flow stress is in a hyperbolic sine relationship with the strain rate,and in an Arrhenius relationship with the temperature,which imply that the process of plastic deformation at an elevated temperature for this material is thermally activated. The flow stress of the alloy during the elevated temperature deformation can be represented by a Zener-Hollomon parameter with the inclusion of the Arrhenius term. The values of n,α and A in the analytical expressions of flow stress σ are fitted to be 5.62,0.019 MPa^-1 and 1.51×10^16 s^-1,respectively. The hot deformation activation energy is 240.85 kJ/mol.