Semiconductive polymer shielding layers of power cable require stable volume resistivity to protect the insulation layer from stress enhancements when carbon black (CB)/polymer composite undergoes thermal cycles. For the CB-filled polymer composites, CB would often re-aggregate when temperature is close to the melting point of polymer matrix, so that the conductive network would be destroyed. Re-distribution of CB and re-formation of conductive CB network under thermal cycles might be the main reason for the instability of volume resistivity. In this work, the re-aggregation of CB in the CB/polymer composites was disclosed. Besides, a small amount of multi-walled carbon nanotubes (MWNTs) was employed as cofiller with CB to improve the stability of volume resistivity of the polymer composites under thermal cycles. The total weight fraction of conductive fillers (CB or CB cofilled with MWNTs) was set as 35 wt%. Compared with the polymer composites loaded with CB solely, the volume resistivity of the composites filled with CB-MWNTs was much more stable with changing temperature. This can be attributed to the enhancement of conductive networks when the MWNTs are employed as second conductive filler. 相似文献
The dataflow architecture, which is characterized by a lack of a redundant unified control logic, has been shown to have an advantage over the control-flow architecture as it improves the computational performance and power efficiency, especially of applications used in high-performance computing (HPC). Importantly, the high computational efficiency of systems using the dataflow architecture is achieved by allowing program kernels to be activated in a simultaneous manner. Therefore, a proper acknowledgment mechanism is required to distinguish the data that logically belongs to different contexts. Possible solutions include the tagged-token matching mechanism in which the data is sent before acknowledgments are received but retried after rejection, or a handshake mechanism in which the data is only sent after acknowledgments are received. However, these mechanisms are characterized by both inefficient data transfer and increased area cost. Good performance of the dataflow architecture depends on the efficiency of data transfer. In order to optimize the efficiency of data transfer in existing dataflow architectures with a minimal increase in area and power cost, we propose a Look-Ahead Acknowledgment (LAA) mechanism. LAA accelerates the execution ow by speculatively acknowledging ahead without penalties. Our simulation analysis based on a handshake mechanism shows that our LAA increases the average utilization of computational units by 23.9%, with a reduction in the average execution time by 17.4% and an increase in the average power efficiency of dataflow processors by 22.4%. Crucially, our novel approach results in a relatively small increase in the area and power consumption of the on-chip logic of less than 0.9%. In conclusion, the evaluation results suggest that Look-Ahead Acknowledgment is an effective improvement for data transfer in existing dataflow architectures.
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