Al-20% Sn-4.5% Cu合金在高能球磨和烧结中的组织

利用机械合金化方法制备Al-20%Sn-4.5%Cu合金粉末,将之压制成型后进行烧结.用X射线衍射仪(XRD)、扫描电镜(SEM)和差示扫描量热仪(DSC)分析了Al-20%Sn-4.5%Cu合金在高能球磨和烧结过程中的组织变化.结果表明,该合金粉末经40 h球磨后,可以获得纳米级Sn颗粒均匀弥散分布在Al基体上的组织,并且形成了Al(Cu)过饱和固溶体;在随后的烧结过程中,Sn相尺寸仍保持在200 mm左右,Al(Cu)过饱和固溶体则以CuAl2相的形式脱溶析出.     

高性能Al-Sn-Cu轴瓦合金热膨胀性能的研究

对三种常见的铝锡铜合金AlSn6Cu、AlSn20Cu、AlSn30Cu的热膨胀性能进行了研究，结果表明，随着合金中Sn含量的增加，组织中β（Sn）增加，膨胀系数减小，高熔点的Cu元素固溶于α（Al）相中，使α（Al）晶格常数下降，能有效抑制合金膨胀系数随温度的急剧变化。     

基于正交试验的液态模锻Al-Sn-Cu轴套中Sn的宏观偏析

采用正交试验法分析了液态模锻Al-Sn-Cu轴套中Sn的宏观偏析规律。结果表明:液态模锻Al-Sn-Cu轴套不可避免的产生Sn的宏观偏析,铸件中同时存在着正偏析和逆偏析,正偏析出现在浇铸中心的近端,逆偏析主要存在于浇铸中心的远端;铸件凝固后期,低熔点液相被强制挤压至热节位置,形成粗晶区和细晶区相间的双峰组织,细晶区Sn的质量分数明显较高。液态模锻工艺参数对铸件宏观偏析产生较大影响,对Sn偏析影响由大到小依次是浇注温度、模具温度、保压时间及比压;本次实验条件下,当浇注温度为700℃,模具温度为240℃,比压为80 MPa,保压时间为5 s时,轴套铸件中Sn元素分布较均匀,Sn元素的宏观偏析得到减轻。     

Effect of closed-couple gas atomization pressure on the performances of Al-20Sn-1 Cu powders

Al-20Sn-1 Cu powders were prepared by gas atomization in an argon atmosphere with atomizing pressures of 1.1 and 1.6 MPa.The characteristics of the powders are determined by means of dry sieving,scanning electron microscopy (SEM),optical microscopy (OM),and X-ray diffractometry (XRD).The results show that the powders exhibit a bimodal size distribution and a higher gas pressure results in a broad size distribution.All particles in both cases are spherical or nearly spherical and satellites form on the surface of coarse particles.Dendritic and cellular structures coexist in the particle.With decreasing particle diameter,the secondary dendrite arm spacing (SDAS) decreases and the cooling rate increases.The particles processed under high gas atomization pressure (1.6 MPa) exhibit a lower SDAS value and a higher cooling rate than those of the same size under low gas atomization pressure (1.1 MPa).The XRD results show that the Sn content increases with decreasing particle size.