用于电弧检测的电力专用SoC设计

针对传统的电弧电路故障检测结果不准确的问题,设计用于电弧检测的SoC系统,并且在55nm工艺下进行流片验证。采用包含两种结构的模数转换器的片上电压源,设计了锁相环以及复位电路,精度最高可达8.67 bit。验证结果表明,本设计可提高电弧检测的准确性。     

吸湿凉爽机织物的结构设计与性能

为研究织物组织结构与复合纱线线密度对织物凉爽性能的影响,将线密度为7.4和9.8 tex涤纶分别与线密度为7.8 tex锦纶反向加捻、并线后作为纬纱,以8.3 tex涤纶/竹浆纤维50/50混纺纱作经纱,设计平纹、二上一下斜纹和透孔组织织物.测试织物的瞬间接触凉感、热湿舒适性能及织物干、湿态升温曲线,并采用凉爽温度指数对织物的综合凉爽性能进行评价.研究结果表明:6种设计织物的瞬间接触凉感均高于标准,且平纹织物最好,纬纱粗细对瞬间接触凉感影响不显著;透孔织物透气性最好,且在人体出汗的状态下具有较好的导湿散热性能.平纹织物凉爽温度指数最高,最大凉爽温度为2.8℃,综合凉爽性能最好.     

基于VMD和BSA-KELM的高陡边坡位移预测模型研究

边坡位移的时间序列曲线存在复杂的非线性特性,传统的预测模型精度不足以满足预测要求。为此提出了基于变分模态分解的鸟群优化-核极限学习机的预测模型,并用于河北省某水泥厂的边坡位移预测。该方法首先采用VMD把边坡位移序列分解为一系列的有限带宽的子序列,再对各子序列分别采用相空间重构并用核极限学习机预测,采用鸟群算法优化相空间重构的嵌入维度和KELM中惩罚系数和核参数三个数值,以取得最优预测模型。最后将各个子序列预测值叠加,得到边坡位移的最终预测值。结果表明：和KELM、BSA-KELM、EEMD-BSA-KELM模型相比,基于VMD的BSA-KELM预测精度更高,为边坡位移的预测提供一种有效的方法。     

Interfacial microstructure and mechanical properties of Ti3SiC2 ceramic and TC11 alloy joint diffusion bonded with a Cu interlayer

Reliable joints of Ti₃SiC₂ ceramic and TC11 alloy were diffusion bonded with a 50 μm thick Cu interlayer. The typical interfacial structure of the diffusion boned joint, which was dependent on the interdiffusion and chemical reactions between Al, Si and Ti atoms from the base materials and Cu interlayer, was TC11/α-Ti + β-Ti + Ti₂Cu + TiCu/Ti₅Si₄ + TiSiCu/Cu(s, s)/Ti₃SiC₂. The influence of bonding temperature and time on the interfacial structure and mechanical properties of Ti₃SiC₂/Cu/TC11 joint was analyzed. With the increase of bonding temperature and time, the joint shear strength was gradually increased due to enhanced atomic diffusion. However, the thickness of Ti₅Si₄ and TiSiCu layers with high microhardness increased for a long holding time, resulting in the reduction of bonding strength. The maximum shear strength of 251 ± 6 MPa was obtained for the joint diffusion bonded at 850 °C for 60 min, and fracture primarily occurred at the diffusion layer adjacent to the Ti₃SiC₂ substrate. This work provided an economical and convenient solution for broadening the engineering application of Ti₃SiC₂ ceramic.     

A review on ultrasonic spot welding of copper alloys

As a solid state joining process, ultrasonic spot welding has been proven to be a promising technique for joining copper alloys. However, challenges still remain in employing ultrasonic spot welding to join copper alloys. This article comprehensively reviews the current state of ultrasonic spot welding of copper alloys with a number of critical issues including materials flow, plastic deformation, temperature distribution, vibration, relative motion, vertical displacement, interface friction coefficient, online monitoring technique, coupled with the macrostructure and microstructure, the mechanical properties and electrical conductivity. In addition, the future trends in this field are provided.     

Low complexity quantum private queries protocol

Private information retrieval(PIR) is an important privacy protection issue of secure multi-party computation, but the PIR protocols based on classical cryptography are vulnerable because of new technologies,such as quantum computing and cloud computing. The quantum private queries(QPQ) protocols available, however, has a high complexity and is inefficient in the face of large database. This paper, based on the QKD technology which is mature now, proposes a novel QPQ protocol utilizing the key dilution and auxiliary parameter. Only N quits are required to be sent in the quantum channel to generate the raw key, then the straight k bits in the raw key are added bitwise to dilute the raw key, and a final key is consequently obtained to encrypt the database. By flexible adjusting of auxiliary parameters θ and k, privacy is secured and the query success ratio is improved. Feasibility and performance analyses indicate that the protocol has a high success ratio in first-trial query and is easy to implement, and that the communication complexity of O(N) is achieved.