5Gb/s单片集成GaAs MSM/PHEMT 850nm光接收机前端

采用0.5μm GaAs PHEMT工艺研制出了一种单片集成850nm光接收机前端,它包括金属-半导体-金属(MSM)光探测器和分布放大器.探测器光敏面积为50μm×50μm,电容为0.17pF,4V偏压下的暗电流小于17nA.分布放大器-3dB带宽接近20GHz,跨阻增益约46dBΩ;在50MHz～16GHz范围内,输入、输出电压驻波比均小于2;噪声系数在3.03～6.5 dB之间.光接收机前端在输入2.5和5Gb/s非归零伪随机二进制序列调制的光信号下,得到较为清晰的输出眼图.     

2.5 Gb/s GaAs PIN/PHEMT单片集成光接收机前端

采用0.5 μm GaAs PHEMT工艺,研制了一种PIN光探测器和分布放大器单片集成850 nm光接收机前端. 探测器光敏面直径为30 μm,电容为0.25 pF,10 V反向偏压下的暗电流小于20 nA.分布放大器-3 dB带宽接近20 GHz,跨阻增益约46 dBΩ;在50 MHz～16 GHz范围内,输入、输出电压驻波比均小于2;噪声系数在3.03～6.50 dB之间.单片集成光接收机前端在1.0和2.5 Gb/s非归零(NRZ)伪随机二进制序列(PRBS)调制的光信号下得到较为清晰的输出眼图.     

一种850nm单片集成光接收机前端

采用0.5μm GaAs PHEMT工艺和台面光刻互连工艺研制了一种850nm光接收机前端单片电路,包括金属-半导体-金属光探测器和跨阻前置放大器。探测器光敏面积约2000μm2,电容小于0.15pF,4V偏压下的暗电流小于14nA。跨阻前置放大器-3dB带宽接近10GHz,跨阻增益约43dBΩ。光接收机前端在输入2.5Gb/s非归零伪随机二进制序列调制的850nm光信号下得到较为清晰的输出眼图。     

基于标准BiCMOS工艺的1.5 Gbit/s调节型共源共栅光接收机

基于IBM 0.18μm SiGe BiCMOS标准工艺设计实现了一种高速、低功耗的光接收机前端模拟电路。接收机芯片包括调节型共源共栅(RGC)跨阻放大器(TIA)、四级限幅放大器(LA)和输出缓冲电路(buffer)。采用高跨导SiGe异质结双极晶体管(HBT)作为输入级的RGC TIA有效隔离了探测器结电容和输入寄生电容的影响,更好地拓展了光接收机的带宽。仿真结果表明,在1.8V电源电压供电下,驱动50Ω电阻和10pF电容负载时,光接收机前端的跨阻增益为76.67dB,-3dB带宽为2.1GHz。测试结果表明,光接收机前端电路的-3dB带宽为1.2GHz,跨阻增益为72.2dB,在误码率(BER)为10-9的条件下,光接收机实现了1.5Gbit/s的数据传输速率。在1.8V电源电压下,芯片功耗仅为44mW,芯片总面积为800μm×370μm。     

短波长OEIC光接收机前端设计及制作

基于国内的材料和工艺技术,研制出850 nm单片集成光接收机前端,集成形式包括PIN/TIA、PIN/DA、MSM/TIA和MSM/DA等.对光探测器和电路分别进行了研究和优化.通过Silvaco软件,建立了探测器器件模型,并通过实验数据验证.分布放大器-3 dB带宽接近20 GHz,跨阻增益约46 dBΩ,输入、输出驻波比均小于2,噪声系数在3.03～6.5 dB之间.跨阻前置放大器-3 dB带宽接近10 GHz,跨阻增益约43 dBΩ,输入、输出驻波比均小于3.5,噪声系数在4～6.5 dB之间.集成芯片最高工作速率达到5 Gb/s.     

基于标准BiCMOS工艺的1.5Gbit/s调节型共源共栅光接收机

基于IBM 0.18μm SiGe Bi CMOS标准工艺设计实现了一种高速、低功耗的光接收机前端模拟电 路。接收机芯片包括调节型共源共栅 (RGC) 跨阻放大器(TIA)、四级限幅放大器(LA)和 输出缓冲 电路(buffer)。采用高跨导SiGe异质结双极晶体管(HBT)作为输入级的RGC TIA有效隔离了 探测器结电容和输入寄生电容的影响,更好地拓展了光接收机的带宽。仿真结果表明,在1.8V电源电 压供电下,驱动50Ω电阻和10pF电容负载时 ,光接收机前端的跨阻增益为76.67dB带宽为2.1GHz 。 测试结果表明,光接收机前端电路的－3dB带宽为1.2GHz,跨阻增 益为72.2dB,在误码率(BER)为10－9的条件 下,光接收机实现了1.5Gbit/s的数据传输速率。在1. 8V电源电压 下,芯片功耗仅为44mW,芯片总面积为800 μm×370μm。     

基于BiCMOS工艺的光接收机前端电路

基于IBM 0.18μm SiGe BiCMOS工艺设计,实现了光接收机模拟前端,电路整体结构包括差分共射跨阻放大器(TIA)、限幅放大器(LA)以及输出缓冲级(Buffer)。采用SiGe异质结双极晶体管(HBT)作为输入级的差分共射跨阻放大器大大地减小了输入电阻,更好地展宽了频带。仿真结果表明,在1.8V电源电压供电下,驱动50Ω电阻和10pF电容负载时光接收机前端跨阻增益为74.59dB,带宽为2.4GHz,功耗为39.6mW。在误码率为10-9、输入电流为50μA的条件下,光接收机前端电路实现了3Gb/s的数据传输速率。实测结果表明,光接收机的-3dB带宽为1.9GHz。芯片面积为910μm×420μm。     

2.5Gb/s宽动态范围光接收机前端放大电路设计

基于UMC 0.18μm CMOS工艺,设计了一种2Gb/s传输速率的宽动态范围光接收机前端放大电路。采用对数放大器来增大接收机的输入动态范围,前置放大器采用差分共源跨阻放大器,并使用有源电感做负载来增大带宽。实验结果表明:该接收机前端电路的增益为80dB,3dB带宽为2.3GHz,2.5Gb/s输出眼图良好,输入动态范围为60dB(1μA～1mA)。     

12 Gb/s GaAs PHEMT跨阻抗前置放大器

采用0.5 μ m GaAs PHEMT工艺研制了一种单电源偏置光接收机跨阻抗前置放大器.放大器-3dB带宽约为9.5GHz;在50MHz~7.5GHz范围内,跨阻增益为43.5±1.5dB Ω ,输入输出回波损耗均小于-10dB;带内噪声系数在4dB~6.5dB之间,由此得到的最小等效输入噪声电流密度约为17.6pA/ Hz ;输入12Gb/s NRI伪随机序列时,放大器输出眼图清晰,眼开良好.     

20GHz宽带GaAs PHEMT分布式前置放大器

采用0.5μm GaAs PHEMT工艺研制了一种光接收机分布式前置放大器.该放大器-3dB带宽接近20GHz,跨阻增益约46dBΩ;在50MHz~16GHz范围内,输入、输出电压驻波比(VSWR)均小于2;带内噪声系数在3.03~6.5dB之间,平均等效输入噪声电流密度约为14.6pA/ Hz ;在输入10Gb/s非归零(NRZ)伪随机二进制序列(PRBS)信号下,放大器输出眼图清晰,具有12ps的定时抖动和166mV峰峰电压.     

Performance improvement in tensile-strained In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As metamorphic HEMT

This paper proposes a In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As (x=0.3-0.5-0.3) metamorphic high-electron mobility transistor with tensile-strained channel. The tensile-strained channel structure exhibits significant improvements in dc and RF characteristics, including extrinsic transconductance, current driving capability, thermal stability, unity-gain cutoff frequency, maximum oscillation frequency, output power, power gain, and power added efficiency.     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

A 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode array

We report a 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode (APD) array. The mean breakdown voltage of the APD was 57.9 V and the standard deviation was less than 0.1 V. The mean dark current was /spl sim/2 and /spl sim/300 nA, and the standard deviation was /spl sim/0.19 and /spl sim/60 nA at unity gain (V/sub bias/ = 13.5 V) and at 90% of the breakdown voltage, respectively. External quantum efficiency was above 40% in the wavelength range from 1.0 to 1.6 /spl mu/m. It was /spl sim/57% and /spl sim/45% at 1.3 and 1.55 /spl mu/m, respectively. A bandwidth of 13 GHz was achieved at low gain.     

The C-V-f and G/ω-V-f characteristics of Al/SiO2/p-Si (MIS) structures

The frequency dependence of capacitance-voltage (C-V) and conductance-voltage (G/ω-V) characteristics of the Al/SiO₂/p-Si metal-insulator-semiconductor (MIS) structures has been investigated taking into account the effect of the series resistance (R_s) and interface states (N_ss) at room temperature. The C-V and G/ω-V measurements have been carried out in the frequency range of 1 kHz to 1 MHz. The frequency dispersion in capacitance and conductance can be interpreted only in terms of interface states and series resistance. The N_ss can follow the ac signal and yield an excess capacitance especially at low frequencies. In low frequencies, the values of measured C and G/ω decrease in depletion and accumulation regions with increasing frequencies due to a continuous density distribution of interface states. The C-V plots exhibit anomalous peaks due to the N_ss and R_s effect. It has been experimentally determined that the peak positions in the C-V plot shift towards lower voltages and the peak value of the capacitance decreases with increasing frequency. The effect of series resistance on the capacitance is found appreciable at higher frequencies due to the interface state capacitance decreasing with increasing frequency. In addition, the high-frequency capacitance (C_m) and conductance (G_m/ω) values measured under both reverse and forward bias were corrected for the effect of series resistance to obtain the real diode capacitance. Experimental results show that the locations of N_ss and R_s have a significant effect on electrical characteristics of MIS structures.     

Lanthanum diffusion in the TiN/LaOx/HfSiO/SiO2/Si stack

Band edge Complementary Metal Oxide Semiconductor (CMOS) devices are obtained by insertion of a thin LaO_x layer between the high-k (HfSiO) and metal gate (TiN). High temperature post deposition anneal induces Lanthanum diffusion across the HfSiO towards the SiO₂ interfacial layer, as shown by Time of Flight Secondary Ions Mass Spectroscopy (ToF-SIMS) and Atom Probe Tomography (APT). Fourier Transform Infrared Spectroscopy in Attenuated Total Reflexion mode (ATR-FTIR) shows the formation of La-O-Si bonds at the high-k/SiO₂ interface. Soft X-ray Photoelectron Spectroscopy (S-XPS) is performed after partial removal of the TiN gate. Results confirm La diffusion and changes in the La chemical environment.     

Al/sub 0.3/Ga/sub 0.7/As/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) doped-channel field-effect transistors (DCFET's)

The properties of both lattice-matched and strained doped-channel field-effect transistors (DCFET's) have been investigated in AlGaAs/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) heterostructures with various indium mole fractions. Through electrical characterization of grown layers in conjunction with the dc and microwave device characteristics, we observed that the introduction of a 150-/spl Aring/ thick strained In/sub 0.15/Ga/sub 0.85/As channel can enhance device performance, compared to the lattice-matched one. However, a degradation of device performance was observed for larger indium mole fractions, up to x=0.25, which is associated with strain relaxation in this highly strained channel. DCFET's also preserved a more reliable performance after biased-stress testings.<>     

Highly linear Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMTs

We report an Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMT with enhanced linearity. By engineering the channel region, i.e., inserting a 6-nm-thick AlGaN layer with 5% Al composition in the channel region, a composite-channel HEMT was demonstrated. Transconductance and cutoff frequencies of a 1 /spl times/100 /spl mu/m HEMT are kept near their peak values throughout the low- and high-current operating levels, a desirable feature for linear power amplifiers. The composite-channel HEMT exhibits a peak transconductance of 150 mS/mm, a peak current gain cutoff frequency (f/sub T/) of 12 GHz and a peak power gain cutoff frequency (f/sub max/) of 30 GHz. For devices grown on sapphire substrate, maximum power density of 3.38 W/mm, power-added efficiency of 45% are obtained at 2 GHz. The output third-order intercept point (OIP3) is 33.2 dBm from two-tone measurement at 2 GHz.