Mo／SiO2软X射线多层膜反射镜的界面分析

用Ｘ射线衍射的动力学理论对磁控溅射法制备的Ｍｏ／ＳｉＯ２多层膜低角Ｘ射线衍射谱进行拟合，定量分析了膜层的周期结构和界面粗糙度。同时，用Ａｕｇｅｒ电子能谱证实了多层膜成分的周期性以及比较明晰的层界面，随样品厚度的增加，界面粗糙度增加。     

Co／Pt多层膜D射线小角衍射分析

对Ｃｏ／Ｐｔ多层膜进行Ｘ射线小角衍射分析，测量出多层膜的周期厚度和解释多层膜小角衍射主峰之间出现次峰的现象，并确立次峰个数与膜周期数之间的关系。     

Co/Pt多层膜X射线小角衍射分析

对Ｃｏ／Ｐｔ多层膜进行Ｘ射线小角衍射分析,测量出多层膜的周期厚度,解释多层膜小角衍射主峰之间出现次峰的现象,并确立了次峰个数与膜周期数之间的关系。     

Co／C多层膜的结构稳定性

用Ｘ射线衍射、透射电镜、Ｒａｍａｎ光谱、Ｘ射线光电子谱等测量方法研究了用对向靶溅射法制备的Ｃｏ／Ｃ多层膜的结构热稳定性．退火Ｃｏ／Ｃ多层膜的结构变化包括周期膨胀、非晶Ｃｏ层结晶、掠入射反射率变化以及化合物的形成．４００℃退火，周期膨胀主要是由于非晶碳层的石墨化．Ｃｏ／Ｃ系统的相分离造成掠入射反射率增强，可解释为Ｃｏ／Ｃ系统的正的混合焓．５００℃退火，Ｃｏ层的结晶和集聚导致了周期的异常膨胀和反射率的降低．此时界面处形成了少量的碳化物．     

不锈钢／Al固液轧制复合板材界面剪切强度与界面结构

测定了不锈钢／Ａｌ固液轧制复合板材界面剪切强度。应用扫描电镜、Ｘ射线衍射仪对不锈钢／Ａｌ固液轧制复合板材界面和剪切断面的形态、结构、成分等进行了观察和分析。界面层由明显不同的二层组成,即接近钢的明显过渡层和接近Ａｌ的沿晶界富Ｆｅ相的析出层。界面结合牢固,强度高。剪切断面大多发生在Ａｌ处,否则发生在界面层和钢／Ａｌ原始界面处。钢板经助焊剂浸镀后,界面结合强度高于未浸镀的。Ｘ射线衍射确定界面层中的金属     

低温热处理CoN／CN软X射线多层膜的界面互扩散研究

在４７３－５２３Ｋ的低温退火条件下,通过对ＣｏＮ／ＣＮ软Ｘ射线多层膜一级调制峰强度增强的定量观测,研究了ＣｏＮ／ＣＮ软Ｘ射线多层膜的界面互扩散行为,产测得低至１０＾－２５ｍ６２ｓ＾－１的有效扩散系数。通过和Ｃｏ／Ｃ多层膜的结果相比较,发现Ｎ掺杂使ＣｏＮ／ＣＮ软Ｘ射线多层膜的界面互扩散行为明显不同于Ｃｏ／Ｃ多层膜,并具有如下特点：（１）有儿扩散系数和宏观扩散系数较小;（３）扩散激活能较大;（３）临床     

调制周期对磁控溅射WB2/CrN多层薄膜力学性能的影响

目的研究调制周期对磁控溅射WB_2/CrN多层膜结构及性能的影响。方法通过双靶直流磁控溅射法,在硅片、石英玻璃片及不锈钢上,制备Al B_2型WB_2薄膜与CrN薄膜及其多层复合薄膜,采用X射线衍射及扫描电子显微镜对其相结构及形貌进行观察和分析,使用维氏显微硬度仪及划痕仪对多层膜的硬度及膜基结合力进行研究。结果磁控溅射WB_2/CrN多层薄膜呈现出柱状生长趋势,且层状结构明显,仅当调制周期大于317 nm时,多层膜中才出现WB_2晶体的衍射峰。结论多层膜中的WB_2薄膜在本实验条件下的临界结晶厚度大于150 nm。随着调制周期的减小,CrN层生长取向发生由(200)晶面向多晶面的转变,WB_2层生长取向由(101)晶面向(001)晶面转变。多层膜硬度随调制周期的减小大体呈下降趋势,在调制周期为317 nm时达到最大值。结合力变化趋势与硬度相反,CrN层及多层界面有助于复合薄膜膜基结合强度的提高。     

不同调制结构Ni/Al型纳米多层膜的非对称扩散及界面应力演化行为

为了研究分析室温下溅射沉积的金属异质结界面演化的尺度依赖性,制备了不同调制周期和Ni:Al调制比等特征结构的Ni/Al型金属纳米多层膜。结合X射线衍射,多光束光学应力传感器(MOSS)实时薄膜曲率测量,研究了应力演化行为,并在此基础上分析推测纳米多层膜在生长过程中的界面特性。实验结果表明,由于各亚层内各向异性纳米晶结构,多层膜界面具有不对称性,这是由于界面处Ni原子向Al晶格内的不对称扩散行为所致。特别地,当此类型多层膜具备最小调制周期和最低Ni:Al调制比这两个特征参量时,上述不对称扩散行为由于界面累积效应变得更为加剧。     

Cu/X(X=Cr,Nb)纳米多层膜力/电学性能的尺度依赖性

利用纳米压痕实验以及四探针法,系统研究了相同层厚Cu/X(X=Cr,Nb)纳米金属多层膜的力学性能(强/硬度)和电学性能(电阻率)的尺度依赖性.微观分析表明:Cu/X多层膜调制结构清晰,Cu层沿{111}面择优生长,X层沿{110}面择优生长.纳米压入结果表明,Cu/X多层膜的强度依赖于调制周期,并随调制周期的减小而增加.多层膜变形机制在临界调制周期(λ~c≈25 nm)由Cu层内单根位错滑移转变为位错切割界面.多层膜的电阻率不仅与表面/界面以及晶界散射相关,而且在小尺度下受界面条件显著影响.通过修正的FS-MS模型可以量化界面效应对多层膜电阻率的影响.Cu/X纳米多层膜可以通过调控微观结构实现强度-电导率的合理匹配.     

基于X射线反射研究溅射工艺对CrAlN/TiAlN周期膜界面结构的影响

为研究X射线反射技术在纳米多层膜界面微结构表征中的应用,采用反应磁控溅射技术在单晶硅基片上制备CrAlN/TiAlN纳米周期膜,利用X射线反射技术系统研究溅射工艺参数对CrAlN/TiAlN纳米周期膜界面微结构的影响规律。结果表明:增加铝靶功率可提高膜层的溅射速率和降低膜层的界面粗糙度,然而较高的铝靶功率会使膜层界面出现严重的弥散;较大和较小的负偏压都不利于形成完整的周期膜调制结构和光滑的界面;提高Ti/Cr靶电流可有效改善周期膜的调制界面结构,但太大的靶电流会导致膜层间扩散加重,形成弥散界面。N2流量与Ar流量对膜层界面粗糙度具有相反的影响作用。试验得到的优化工艺参数为:铝靶功率80W,溅射负偏压-200 V,Ti/Cr靶电流0.2A,N2流量30cm~3/min,Ar流量10cm~3/min。     

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 各种铁磁性金属、非铁磁性金属组成的磁性多层膜系统的性质及微结构的研究是凝聚态物理及材料科学中的一个热点。它们的巨磁电阻（GMR）效应强烈地依赖于多层膜的微结构，如周期厚度、界面粗糙度、生长取向以及晶粒度等。采用掠入射X射线衍射分析（ＧIXA）法表征多层膜的微结构，具有无损和空间分辨率高的特点。通过ＧIXA可获得有关薄膜的密度、厚度以及表面粗糙度等微观结构信息。文章对上述有关的分析方法进行了评述。     

气相沉积 Ti / TiN 多层薄膜的力学及耐腐蚀性能研究

目的研究多层薄膜的界面对薄膜性能的影响。方法通过直流磁控溅射法在45#钢表面制备Ti N及Ti/Ti N多层薄膜,采用扫描电镜和XRD衍射分析仪对薄膜表面形貌及相结构进行观察和分析,使用纳米压痕仪、电子薄膜应力分布测试仪对Ti N及Ti/Ti多层薄膜的力学性能以及残余应力大小进行研究,并运用电化学设备对Ti N及不同调制周期的Ti/Ti多层薄膜的耐腐蚀性能进行研究。结果制备的Ti N及Ti/Ti N多层薄膜表面光滑且结构致密,Ti N晶粒细小且为非晶相;薄膜力学性能良好,内部均存在残余压应力。随着调制周期的减小,弹性模量和硬度先减小后增大,内部残余应力逐渐减小且分布不均匀程度逐渐增大。薄膜在H_2SO_4中的腐蚀试验表明:当Ti/Ti N多层薄膜调制周期为1μm时,多层薄膜的耐腐蚀性能不如Ti N薄膜,随着Ti/Ti N多层薄膜随调制周期的减小,多层薄膜的耐腐蚀性能逐渐升高;当调制周期为0.5μm时,Ti/Ti N多层薄膜的耐蚀性能已超过Ti N薄膜。结论 Ti/Ti N多层薄膜界面的增多有助于减小薄膜的残余应力,并且可提高薄膜的耐蚀性能。     

Microstructure, mechanical and tribological properties of CrN/W2N multilayer films deposited by DC magnetron sputtering

CrN/W₂N multilayer films with various bilayer periods of 15-85 nm were deposited on high speed steel (W18Cr4V) substrates by means of DC closed field unbalanced magnetron sputtering. The morphology and microstructure of the multilayer films were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD) and high resolution transmission electron microscopy (HRTEM). The mechanical and tribological properties were evaluated using a nanoindentor, Rockwell and scratch tests and a conventional ball-on-disk tribometer, respectively. There were some transverse grains at the layer interface and the interface between the CrN and W₂N layers was not so sharp owing to atom diffusion through the interface. In the bilayer period range, the microhardness, elastic modulus and adhesive strength of the CrN/W₂N multilayer films increased with the decrease of bilayer period. The CrN/W₂N multilayer film with a bilayer period of 15 nm showed the highest hardness (29.2 GPa), elastic modulus (376 GPa) and best adhesion strength, it also had the highest wear resistance and lowest friction coefficient.     

Growth of Gallium Nitride Films on Multilayer Graphene Template Using Plasma-Enhanced Atomic Layer Deposition

In this work,the GaN thin films were directly deposited on multilayer graphene(MLG) by plasma-enhanced atomic layer deposition.The deposition was carried out at a low temperature using triethylgallium(TEGa) precursor and Ar/N_2/H_2 plasma.Chemical properties of the bulk GaN and GaN-graphene interface were analyzed using X-ray photoelectron spectroscopy.The sharp interface between GaN and graphene was verified via X-ray reflectivity and transmission electron microscope.The microstructures and the nucleation behaviors of the GaN grown on graphene have been also studied.The results of grazing incidence X-ray diffraction and Raman spectrum indicate that the as-deposited sample is polycrystalline with wurtzite structure and has a weakly tensile stress.Optical properties of the sample were investigated by photoluminescence(PL) at room temperature.The successful growth of GaN on MLG at a low temperature opens up the possibility of ameliorating the performance of electronic and optical devices based on GaN/graphene heterojunction.     

Deposition,microstructure and hardness of TiN/(Ti,Al)N multilayer films

In this work, TiN/(Ti,Al)N multilayer films were deposited on stainless steel substrates with alternatively switching Ti and TiAl alloy targets sources on and off by pulse biased arc ion plating. The crystallography structures and cross-sectional structures of TiN/(Ti,Al)N multilayer films were evaluated by X-ray diffraction analysis (XRD) and by TEM, respectively. The hardness and film/substrate adhesion were determined by nanoindentation and scratch test, respectively. A complex set of microstructures has been found between TiN and (Ti,Al)N layers, at the interface, another layered interfacial region which consists of extremely fine sub-layers, which results from the rotation of the specimen in the deposition chamber. The hardness values of the multilayers exhibit higher hardness compared with that of monolithic (Ti,Al)N film.     

Interface and superhardness of TiN/CNx multilayer films

This work attempts to reveal the microstructure of interface and the relation between interface mixing and hardening mechanism in TiN/CN_x multilayer films. The growth and microstructure of these interfacial layers are characterized by X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM). Investigation result indicates that the interface species are mainly composed of Ti-C-N, the growth of interlayer mainly depends on the deposition temperature. The thickest interlayer (about 2.5 nm) is produced at 300 °C, and the interlayer disappears at 500 °C. Nanoindentation testing indicates that the film with a maximum interlayer thickness of about 2.5 nm exhibits superhardness up to 40 GPa. Based on the experimental results, it is suggested that the interfacial intermixing and the crystal quality of TiN are the main reasons for the superhardness effect in TiN/CN_x nanostructured multilayers.     

离子束溅射制备立方C-N化合物

用氮离子束分别原位溅射Ｔｉ和石墨靶的方法制备了ＣＮｘ／ＴｉＮｙ多层膜。用Ｘ射线光电子谱分析ＣＮｘ层中Ｃ和Ｎ的键合状态,用透射电镜观察薄膜中的相形貌,用电子衍射和Ｘ射线衍射的方法分析相的结构。结果表明,ＣＮｘ层中主要有Ｎ－ｓｐ＾２Ｃ和Ｎ－ｓｐ＾３Ｃ两种键合状态,薄膜中观察到的Ｃ－Ｎ化合物尺寸为１０－６０ｎｍ的晶体颗粒,其衍射数据可用立方Ｃ３Ｎ４结构标定,证实了该薄膜中存在立方Ｃ３Ｎ４化合物。     

离子束轰击对多层膜摩擦学性能的影响

用Ｎｅ离子束混合法制务了Ｎｉ／Ｃｒ多层膜，用Ａｕｇｅｒ光电子能谱（ＡＥＳ），Ｘ射线衍射（ＸＲＤ）分析离子束混合多层膜的元素组成，分布和相结构，将其结果与简单蒸发沉积的Ｎｉ／Ｃｒ多层膜结构进行比较，同时，对多层膜（轰击与未轰击）的硬度及摩擦学性能进行测定分析比较，结果表明，离子束混合多层膜的硬度和抗磨性能与简单蒸发沉积多层膜相比都相有提高，这主要是因为Ｎｅ离子的轰击使用使多层膜更加致密及膜内的碳化铬     

Preparation, corrosion and structural properties of Cu–Ni multilayers from sulphate/citrate bath

Potentiostatic electrodeposition was used to produce Cu–Ni multilayer by two-wave pulse plating technique from sulphate/citrate electrolyte at pH 4. Cyclic voltammetry studies provide information about the deposition potential. The compositions of multilayers were studied using X-ray fluorescence (XRF). Electrochemical corrosion studies of the deposited multilayer on copper were studied by potentiodynamic polarization and electrochemical impedance spectroscopy (EIS). The surface of the layer having smooth, small grain and compact structure was confirmed by scanning electron microscopy (SEM) and atomic force microscopy (AFM) analysis. The face centered cubic lattices are present in the Ni–Cu multilayer and this is confirmed by the X-ray diffraction (XRD) data. The multilayer structures have better corrosion resistance than the base substrate.