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1.
为了得到高性能的GaN基发光器件,有源层采用MOCVD技术和表面应力的不均匀性诱导方法生长了InGaN量子点,并通过原子力显微镜(AFM)、透射电子显微镜(TEM)和光致发光(PL)谱对其微观形貌和光学性质进行了观察和研究.AFM和TEM观察结果表明:InGaN/GaN为平均直径约30nm,高度约25nm的圆锥;InGaN量子点主要集中在圆锥形的顶部,其密度达到5.6×1010cm-2.室温下,InGaN量子点材料PL谱强度大大超出相同生长时间的InGaN薄膜材料,这说明InGaN量子点有望作为高性能有源层材料应用于GaN基发光器件.  相似文献   

2.
InGaN基量子阱作为太阳电池器件的有源区时,垒层厚度设计以及实际生长对其光学特性的影响极为重要.采用金属有机化学气相沉积(MOVCD)技术,在蓝宝石衬底上外延生长了垒层厚度较厚的InGaN/GaN多量子阱,使用高分辨X射线衍射和变温光致发光谱研究了垒层厚度对InGaN多量子阱太阳电池结构的界面质量、量子限制效应及其光学特性的影响.较厚垒层的InGaN/GaN多量子阱的周期重复性和界面品质较好,这可能与垒层较薄时对量子阱的生长影响有关.同时,厚垒层InGaN/GaN多量子阱的光致发光光谱峰位随温度升高呈现更为明显的“S”形(红移-蓝移-红移)变化,表现出更强的局域化程度和更高的内量子效率.  相似文献   

3.
通过提高InGaN量子阱结构的生长温度,降低量子阱In组分的掺入效率,提高InGaN/GaN量子阱结构生长质量,缩短LED输出波长等手段,实现了紫光LED高效率输出.采用高分辨率X射线双晶衍射、扫描隧道显微镜和光致发光谱技术研究了高温生长InGaN/GaN多量子阱的结构和光学特性.封装后的300μm×300μm LED器件在20mA的注入电流下输出功率为5.2mW,输出波长为408nm.  相似文献   

4.
通过提高InGaN量子阱结构的生长温度,降低量子阱In组分的掺入效率,提高InGaN/GaN量子阱结构生长质量,缩短LED输出波长等手段,实现了紫光LED高效率输出.采用高分辨率X射线双晶衍射、扫描隧道显微镜和光致发光谱技术研究了高温生长InGaN/GaN多量子阱的结构和光学特性.封装后的300μm×300μm LED器件在20mA的注入电流下输出功率为5.2mW,输出波长为408nm.  相似文献   

5.
Ⅲ族氮化物量子点研究进展   总被引:5,自引:0,他引:5  
综述了Ⅲ族氮化物量子点材料及其器件应用研究现状。主要涉及了GaN,InN和InGaN量子点材料的形貌结构特征、实现工艺方法、外延生长机理、光学特性和器件应用等内容。同时对该领域的未来研究趋势也进行了讨论。  相似文献   

6.
生长温度对InGaN/GaN多量子阱LED光学特性的影响   总被引:1,自引:0,他引:1  
利用低压MOCVD系统,在蓝宝石衬底上外延生长了InGaN/GaN多量子阱蓝紫光LED结构材料.研究了生长温度对有源层InGaN/GaN多量子阱的合金组分、结晶品质及其发光特性的影响.结果表明当生长温度从730℃升到800℃时,LED的光致发光波长从490nm移到380nm,室温下PL谱发光峰的半高全宽从133meV降到73meV,表明了量子阱结晶性的提高.高温生长时,PL谱中还观察到了GaN的蓝带发光峰,说明量子阱对载流子的限制作用有所减弱.研究表明,通过改变生长温度可以对LED发光波长及有源层InGaN的晶体质量实现良好的控制.  相似文献   

7.
InGaN绿光LED的量子阱结构具有较高的In含量,InN与GaN之间较大的晶格失配度使得该结构的稳定性下降.由于量子阱结构生长完成之后的p型GaN的生长温度要远高于量子阱结构生长温度,因此,p型GaN的生长过程对多量子阱质量有重大影响.论文探讨了p型GaN的生长温度与厚度对绿光LED的材料结构及器件性能的影响.研究发现,p-GaN过高的生长温度和过大的厚度都能加剧多量子阱结构中In组分的波动,使得发光峰宽化,同时降低绿光量子阱的发光效率.论文据此提出了优化的p型GaN生长温度与厚度,探讨了量子阱保护层对InGaN绿光LED性能的影响,该结构有利于增强绿光LED发光波长的稳定性.  相似文献   

8.
利用Silvaco软件对Al0.2Ga0.8N/GaN共振隧穿二极管(RTD)进行仿真,重点研究了InGaN子量子阱结构及相应非对称势垒结构设计对其电流特性的影响。对比分析了子量子阱结构中InGaN的In组分和子阱厚度对RTD微分负阻(NDR)特性的影响,得出了提升器件性能的最佳参数范围。为了克服Al0.2Ga0.8N/GaN RTD势垒低对器件电流峰谷比(PVCR)的影响,在子量子阱结构的基础上引入了非对称势垒结构设计,通过改变收集区侧势垒的高度和厚度,将AlGaN/GaN的Ip和PVCR由基本结构的0.42 A和1.25,提高到了0.583 A和5.01,实现了器件性能的优化,并为今后的器件研制提供了设计思路。  相似文献   

9.
通过求解修正的基于K·p方法的有效质量哈密顿方程并与泊松方程进行自洽,得到在极化效应影响下的不同阱宽和垒厚的InGaN/GaN多量子阱导带和价带的能带结构,并计算了不同多量子阱结构的自发辐射谱.仿真结果表明:阱宽和垒厚对InGaN/GaN多量子阱结构的光电子学特性有很大的影响.随着阱宽和垒厚的增加,InGaN/GaN多...  相似文献   

10.
用SiO2纳米图形层作为模板在以蓝宝石为衬底的n-GaN单晶层上制备了InGaN/GaN多量子阱纳米线,并成功实现了其发光二极管器件(LED).场发射扫描电子显微镜(FESEM)的测量结果表明,InGaN/GaN多量子阱纳米线具有光滑的表面形貌和三角形的剖面结构.室温下阴极射线荧光谱(CL)的测试发现了位于461 nm...  相似文献   

11.
Waveguide multilayer optical card (WMOC) is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling & processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic (VB) language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.  相似文献   

12.
IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…  相似文献   

13.
The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.  相似文献   

14.
Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.  相似文献   

15.
A doping system consisting of NPB and PVK is employed as a composite hole transporting layer (CHTL). By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK : NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK : NPB at 1:3.  相似文献   

16.
An insert layer structure organic electroluminescent device(OLED) based on a new luminescent material (Zn(salen)) is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn(salen)/Liq/LiF/A1/CuPc/NPD/Zn(salen)/Liq/LiF/A1. Effective insert electrode layers comprising LiF(1nm)/Al(5 nm) are used as a single semitransparent mirror, and bilayer cathode LiF(1 nm)/A1(100 nm) is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.  相似文献   

17.
Due to variable symbol length of digital pulse interval modulation(DPIM), it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation(FDPIM) method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.  相似文献   

18.
It is a key problem to accurately calculate beam spots' center of measuring the warp by using a collimated laser. A new method, named double geometrical center method (DGCM), is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device (CCD) is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What's more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.  相似文献   

19.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

20.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

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