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非晶碳化硅薄膜的结构及其光学特性研究 总被引:1,自引:0,他引:1
采用等离子体增强化学气相沉积系统制备非晶碳化硅薄膜,通过控制反应气体中甲烷和硅烷的流量比R来调节薄膜中的碳/硅比,获得具有不同碳/硅比的薄膜结构.采用Raman、XPS以及FT-IR等技术手段对样品的结构进行表征.通过对样品吸收谱的测量,对样品的光学特性进行了研究.研究结果表明,薄膜中C-H键以及Si-C键含量的增加引... 相似文献
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利用微波等离子体化学气相沉积法在不锈钢衬底上直接合成非晶碳和碳纳米管混合薄膜.采用氢气和甲烷作为反应气体,流量分别为100和16sccm.沉积室内的压强为5.0kPa.利用场发射扫描电镜(SEM)和喇曼谱(Raman)对制备的薄膜的结构和形貌进行了分析.场发射实验在5×10-5Pa的真空下进行.实验结果表明:制备的非晶碳和碳纳米管混合薄膜开启电场较低,仅有0.9V/μm;在电场为3.7V/p.m时电流密度达到4.0mA/cm2,发射点密集,分布均匀.表明此种材料是一种优良的场发射冷阴极材料. 相似文献
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非晶碳和碳纳米管混合薄膜的场发射性能 总被引:2,自引:2,他引:0
利用微波等离子体化学气相沉积法在不锈钢衬底上直接合成非晶碳和碳纳米管混合薄膜.采用氢气和甲烷作为反应气体,流量分别为100和16sccm.沉积室内的压强为5.0kPa.利用场发射扫描电镜(SEM)和喇曼谱(Raman)对制备的薄膜的结构和形貌进行了分析.场发射实验在5×10-5Pa的真空下进行.实验结果表明:制备的非晶碳和碳纳米管混合薄膜开启电场较低,仅有0.9V/μm;在电场为3.7V/p.m时电流密度达到4.0mA/cm2,发射点密集,分布均匀.表明此种材料是一种优良的场发射冷阴极材料. 相似文献
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采用超高频等离子体增强化学气相沉积(VHF-PECVD)技术研究微晶硅(μc-Si)薄膜的高速沉积过程发现:分别采用100和500 sccm流量制备本征μc-Si材料,将其应用在μc-Si电池i层,电池的电流-电压(I-V)特性有明显的差异.通过微区Raman、原子力显微镜(AFM)和X射线衍射(XRD)测试发现:尽管μc-Si薄膜的晶化率相似,但是小流量情况下制备的薄膜具有较厚的非晶孵化层,晶粒尺寸不一;大流量下制备的材料沿生长方向的纵向均匀性相对较好,晶粒尺寸较小、分布均匀,而且具有〈220〉晶相峰强度高于〈111〉和〈311〉晶相峰强度的特点.因此得出:在高压高速沉积μc-Si薄膜过程中,反应气体流量对μc-Si的纵向结构有很大影响,选择适合的反应气流量能够调节适宜的气体滞留时间,从而减小薄膜的纵向不均匀性. 相似文献
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以SiH4为先驱气体,采用低频等离子体增强化学气相沉积(LF-PECVD)方法在Si衬底上制备了氢化非晶硅(a-Si∶H)薄膜。在薄膜沉积过程中,工艺参数将会影响非晶硅薄膜的沉积速率和光学性能。通过反射式椭圆偏振光谱仪(SE)研究了SiH4气体流量、工作压强和衬底温度等条件对氢化非晶硅沉积速率和光学性质的影响。实验结果表明,氢化非晶硅沉积速率随着SiH4流量、工作压强和衬底温度的改变而规律地变化。相比于SiH4流量和工作压强,衬底温度对折射率、吸收系数和折射率的影响更大。各工艺条件下所制备的非晶硅薄膜光学禁带宽度在1.61~1.77eV。 相似文献
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以SiH4,PH3,CH4为源气体,采用射频等离子增强化学气相沉积(RF-PECVD)方法,通过改变CH4流量制备了磷、碳二元掺杂非晶硅薄膜,研究了磷、碳二元掺杂对薄膜微观结构和光学性能的影响.用X射线光电子能谱仪(XPS)观察到了C-Si峰的存在,同时发现随着CH4流量的增加,薄膜中C元素含量逐渐增大.傅里叶转换红外光谱(FTIR)测试表明,掺杂薄膜中的H含量随着CH4流量的增加逐渐增大,由11.5%增大到24.6%.光学性能测试表明,随着CH4流量的增加,掺杂薄膜的折射率逐渐降低,而光学带隙逐渐增加. 相似文献
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N/A 《半导体光子学与技术》1997,3(4):290-295
The relation between threshold voltage for hydrogenated amorphous silicon thin film transistors(a-Si:HTFTs)and deposition conditions for hydrogenated amorphous silicon nitride(a-SiNx:H)films is investigated.It is observed that the threshold voltage,Vth,of a-Si:HTFT increases with the increase of the thickness of a-SiNx:H film,and the threshold voltage is reduced apparently with the increase of NH3/SiH4 gas flow rate ratio. 相似文献
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XIONG Zhibin WANG Chang''''an XU Zhongyang ZOU Xuemei ZHAO Bofang DAI Yongbing WAN Xinheng 《半导体光子学与技术》1997,(4)
DependenceofThresholdVoltageofa-Si:HTFTona-SiNx:HFilm①XIONGZhibin,WANGChang’an,XUZhongyang,ZOUXuemei,ZHAOBofang,DAIYongbing,W... 相似文献
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文章用RF—PECVD设备制备了G—SiNx薄膜,研究了TFT器件击穿电压的测定与分析方法,并对成膜条件中的SiH4流量以及G-SiNx膜厚进行浮动变化,以及研究TFT器件击穿电压的变化方式。结果表明:随着SiH4/NH3流量增大,其耐压性降低;增大绝缘膜厚度,耐压性随之增大。文章对TFT耐压性测量方法的探讨以及PECVD工艺条件与耐压性的相关关系的研究。对于制备合格的氮化硅薄膜提供了借鉴与指导。 相似文献
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Shi Mingji Wang Zhanguo Liu Shiyong Peng Wenbo Xiao Haibo Zhang Changsha Zeng Xiangbo 《半导体学报》2009,30(6)
Boron-doped hydrogenated silicon films with different gaseous doping ratios (B2H6/SiH4) were deposited in a plasma-enhanced chemical vapor deposition (PECVD) system. The microstructure of the films was investigated by atomic force microscopy (AFM) and Raman scattering spectroscopy. The electrical properties of the films were characterized by their room temperature electrical conductivity (σ) and the activation energy (Ea). The results show that with an increasing gaseous doping ratio, the silicon films transfer from a microcrystalline to an amorphous phase, and corresponding changes in the electrical properties were observed. The thin boron-doped silicon layers were fabricated as recombination layers in tunnel junctions. The measurements of the Ⅰ-Ⅴ characteristics and the transparency spectra of the junctions indicate that the best gaseous doping ratio of the recombination layer is 0.04, and the film deposited under that condition is amorphous silicon with a small amount of crystallites embedded in it. The junction with such a recombination layer has a small resistance, a nearly ohmic contact, and a negligible optical absorption. 相似文献
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等离子增强化学气相沉积法制备Si-C-H薄膜 总被引:1,自引:0,他引:1
以SiH4和CH4为气源,在不同的工艺条件下用增强化学气相沉积(PECVD)方法制备了一系列Si-C-H薄膜,并对薄膜的结构和性能进行了一系列测试分析,研究了薄膜的结构性能特点以及CH4/SiH4比和射频功率等工艺参数对薄膜结构和性能的影响。发现薄膜中主要形成的是嵌有Si晶粒的非晶态SiC结构,H原子主要以C-H键形式存在。高的射频功率和CH4/SiH4比均有利于Si-C的形成,而较低的CH4/SiH4比可以提高薄膜的晶态率。薄膜的电阻率随着CH4/SiH4比的增大而增大,随着射频功率的增大而减小。 相似文献
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The surface and optical properties of silicon nitride samples with different compositions were investigated.The samples were deposited on InP by inductively coupled plasma chemical vapor deposition using different NH3 flow rates.Atomic force microscopy measurements show that the surface roughness is increased for the samples with both low and high NH3 flow rates.By optimization,when the NH3 flow rate is 6 sccm,a smooth surface with RMS roughness of 0.74 nm over a 5 × 5μm2 area has been achieved.X-ray photoelectron spectroscopy measurements reveal the Si/N ratio of the samples as a function ofNH3 flow rate.It is found that amorphous silicon is dominant in the samples with low NH3 flow rates,which is also proved in Raman measurements.The bonding energies of the Si and N atoms have been extracted and analyzed.Results show that the bonding states of Si atoms transfer from Si0 to Si+4 as the NH3 flow rate increases. 相似文献