基于CeO_(2-x)-TiO_(2)薄膜厚度的数模阻变转换机理EI北大核心

采用溶胶凝胶法和旋涂工艺在FTO衬底制备阻变层CeO_(2-x)-TiO_(2)薄膜,通过在CeO_(2-x)-TiO_(2)薄膜表面热蒸镀Al电极制备Al/CeO_(2-x)-TiO_(2)/FTO阻变器件,采用XRD和XPS表征CeO_(2-x)-TiO_(2)薄膜的晶相组成和晶体结构。结果表明:阻变层中主要由TiO_(2)和CeO_(2-x)组成。与Al/CeO_(2)/FTO器件相比,Al/CeO_(2-x)-TiO_(2)/FTO阻变器件的电学性能得到提升。I-V测试表明Al/CeO_(2-x)-TiO_(2)/FTO器件具有无初始化过程的双极性阻变特性。对不同CeO_(2-x)-TiO_(2)厚度下的阻变器件进行电学分析,研究表明Al/CeO_(2-x)-TiO_(2)/FTO器件在不同CeO_(2-x)-TiO_(2)膜厚下其低阻态呈欧姆导电机制。随着CeO_(2-x)-TiO_(2)厚度的增加,高阻态的阻变机制会发生本质变化,器件的阻变机制从氧空位导电细丝机制转变为缺陷对电荷的捕获/释放机制。研究发现Al/CeO_(2-x)-TiO_(2)界面处的AlO_(x)层是阻变机制转变的关键,AlO_(x)层的增厚使器件从“数字型”转变为“模拟型”。     

La0.67Sr0.33MnO3中Bi的掺杂效应

将Bi2O3掺杂到用溶胶—凝胶法制备的La0.6Sr0．33MnO3(LSMO)微粉中,XRD测量结果证实有过量的Bi析出。随着Bi掺杂量的增加,LSMO／(Bi2O3)x/2材料电阻率发生明显变化,在x=(0—0．10)摩尔比的掺杂范围内,电阻率先上升后突然下降。当X=0．1时,电阻率比未掺杂样品下降了一个数量级。Bi掺杂对低温和室温磁电阻有着完全不同的影响。低温下,随掺杂量增加,磁电阻下降;室温下Bi的微量掺杂可以使磁电阻增大,掺入x=0.03Bi使室温磁电阻由-4.4％提高到-5．6％。     

缺陷对RRAM材料阻变机理的影响

基于密度泛函理论(DFT)的第一性原理和VASP仿真软件,分析了阻变随机存储器(RRAM)阻变效应的物理机制。对比计算了单斜晶相HfO2中Ag掺杂体系、氧空位缺陷体系和Ag及氧空位缺陷共掺杂复合缺陷体系的能带、态密度、分波电荷态密度面和形成能,结果表明在相同浓度下Ag掺杂体系能形成导电通道,而氧空位缺陷体系不能形成导电通道;共掺杂体系中其阻变机制以Ag传导为主,氧空位缺陷为辅,且其形成能变小,体系更加稳定。计算共掺杂体系的布居数和迁移势垒,得出在氧空位缺陷存在的前提下,Ag—O键长明显增加,Ag离子的迁移势垒变小,电化学性能增强。进一步计算了缺陷间的相互作用能,其值为负,表明缺陷间具有相互缔合作用,体系更加稳定。     

(Mo_(1/2)Sr_(1/2))~(4+)掺杂Bi_(1/2)Na_(1/2)TiO_3无铅压电陶瓷结构及其性能研究

采用传统陶瓷制备工艺制备出了Bi1/2Na1/2Ti1-x(Mo1/2Sr1/2)xO3(简称BNT-MS-100x)系无铅压电陶瓷材料,研究了(Mo1/2Sr1/2)4+掺杂量对BNT基陶瓷材料显微结构和电学性能的影响。研究结果表明,(Mo1/2Sr1/2)4+掺杂并未影响BNT陶瓷的晶体结构,仍为纯钙钛矿型结构,而且致密性良好。随着(Mo1/2Sr1/2)4+掺杂量增加,居里温度升高,剩余极化强度先增大后减小。当x=0.004时,BNT-MS-100x陶瓷的压电系数最大,d33=104pC/N,介电损耗最小,tanδ=4.11%。     

Ag掺杂对La2/3A1/3MnO3（A=Ca、Sr、Ba）材料电学性能的影响

采用化学共沉淀法制备了La2/3A1/3MnO3:Agx(A=Ca、Sr、Ba,LAMO:Agx,x=0、0.1、0.2、0.3、0.4 mol%)多晶复合材料。XRD结果表明实验制备了纯相LAMO:Agx样品,Ag+离子A位替代致使LCaMO:Agx和LSrMO:Agx晶格常数和晶胞体积发生微小膨胀,LBaMO:Agx晶格常数和晶胞体积发生微小收缩;R-T测试结果表明LCaMO:Agx的电阻温度系数(Temperature Coefficient of Resistance,TCR)数值在x=0.4、Tk=271.3 K(Tk为TCR位于最大值时对应的温度数值)时具有最大值为28%/K。SEM分析结果表明,随着Ag掺杂量增加,LCaMO晶粒尺寸增大,晶粒均匀性和规则性得以改善,晶化质量得到提高。通过Ag微观掺杂机制对LAMO复合材料的TCR数值增强进行了分析讨论。     

BiFe0.95Mn0.05O3薄膜阻变效应的空间电荷限制电流机理分析

研究了BiFe0.95Mn0.05O3薄膜器件的双极性阻变效应。通过对薄膜器件的电流电压曲线进行电导机制的拟合分析,发现在低阻态时其电流电压关系遵循欧姆定律,而在高阻态时则满足指数分布陷阱控制的空间电荷限制电流规律。同时,还研究了限制电流对双极性阻变效应的影响,结果表明通过调节限制电流值,可以改变薄膜内形成的导电丝粗细,从而得到不同的低阻态,实现薄膜器件的多态存储功能。在导电丝理论的基础上,利用指数分布陷阱控制的空间电荷限制电流机理对这一现象进行了详尽的阐述。     

氧化镍溶胶-凝胶薄膜阻变特性研究

用溶胶-凝胶法在1TO基片上旋涂制备了NiO薄膜,通过对ITO/NiO薄膜/GaIn器件进行伏安特性测试,研究了溶胶浓度、退火、层数以及Cu掺杂等对其电学特性的影响.结果表明:所制备NiO薄膜具有良好可重复双极电阻开关特性.其中,2％Cu掺杂0.2 mol/L溶胶、双层、400℃退火1h制备的薄膜,阈值电压较低,约0.8 V;而开关比受以上因素影响不明显,约3× 102.分析发现薄膜高阻态的荷电输运符合空间电荷限制导电机制,而低阻态为欧姆特性,阻变开关机理为阈值电场及焦耳热导致的氧空位细丝的形成与断裂.     

溅射沉积掺Ag的SnSe薄膜的微结构和热电性能

使用粉末烧结SnSe合金靶高真空磁控溅射制备掺杂Ag的SnSe热电薄膜,利用X射线衍射仪(XRD)、扫描电子显微镜(SEM)和能谱仪(EDS)等手段分析薄膜的相组成、表面形貌、截面形貌、微区元素含量和元素分布,利用塞贝克系数/电阻分析系统LSR-3测量沉积薄膜的电阻率和Seebeck系数,研究了不同Ag含量SnSe薄膜的热电性能。结果表明,采用溅射技术可制备出正交晶系Pnma结构的SnSe相薄膜,掺杂的Ag在薄膜中生成了纳米Ag₃Sn。与未掺杂Ag相比,掺杂Ag的SnSe薄膜其电阻率和Seebeck系数(绝对值,下同)明显减小。并且在一定掺杂范围内,掺杂Ag越多的薄膜电阻率和Seebeck系数越小。未掺杂Ag的SnSe薄膜样品,其Seebeck系数较大但是电阻率也大,因此功率因子较小。Ag掺杂量(原子分数)为7.97%的样品,因其Seebeck系数绝对值较大而电阻率适当,280℃时的功率因子最大(约为0.93 mW·m^-1·K^-2),比未掺杂Ag的样品(PF=0.61 mW·m^-1·K^-2)高52%。掺杂适量的Ag能提高溅射沉积的SnSe薄膜的热电性能(功率因子)。     

退火温度对TiO2基电阻开关器件性能的影响

采用直流磁控溅射法在n+-Si上制备了TiO2薄膜,采用电子束蒸发镀膜仪在TiO2薄膜上沉积Au电极,获得了Au/TiO2/n+-Si结构的器件.研究了退火温度对薄膜结晶性能及器件电阻开关特性的影响.Au/TiO2/n+-Si结构的器件具有单极性电阻开关特性,置位(set)电压,复位(reset)电压、reset电流及功率的大小随退火温度的不同而不同,并基于灯丝理论对器件的电阻开关效应的工作机理进行了探讨.研究结果表明,500℃退火的器件具有良好的非易失性.器件高低阻态的阻值比大于103,其信息保持特性可达10年之久.在读写次数为100次时,器件仍具有电阻开关效应.     

La0.67Sr0.33MnO3中Ag-Ti的掺杂效应

将La0.67Sr0.33MnO3（LSMO）、Ag2O及TiO2粉混合经高温烧结后制备了钙钛矿相/xAg两相复合体系（x是Ag与钙钛矿材料的物质的量比）,系统地研究了Ag-Ti的共掺杂对LSMO电性和磁电阻效应的影响.0.07摩尔比Ti4＋离子的B位掺杂使LSMO的居里温度降至室温.Ag的掺入对Tc影响不大,Tp逐渐升高.由于钙钛矿颗粒属性的改善和金属导电通道的出现,材料的电阻率明显下降.Ag掺杂使室温磁电阻得到显著增强,室温下从x=0.30样品中得到最大的磁电阻,约为32%,是La0.67Sr0.33MnO3样品的8倍,La0.67Sr0.33Mn0.93Ti0.07O3样品的1.6倍.     

Bi2O3薄膜的制备及其电阻开关特性的研究

电阻式存储器由于具有众多的优点有望成为最有前景的下一代高速非挥发性存储器的选择之一.实验利用射频磁控溅射法在重掺硅上沉积了Bi2O3薄膜,并对该薄膜的结晶状态和Au/Bi2O3/n+Si/Al结构的电阻开关特性进行了研究.XRD分析结果表明,射频磁控溅射法沉积所得的Bi2O3薄膜结晶性能好,(201)取向明显.I-V曲线测试结果表明,Au/Bi2O3/n+Si/Al结构具有单极性电阻开关特性.通过对不同厚度Bi2O3薄膜的Au/Bi2O3/n+Si/Al结构I-V特性比较发现,随着薄膜厚度的增加,电阻开关的Forming、Set和Reset阈值电压均随之增加.对于Bi2O3薄膜厚度为31.2 nm的Au/Bi2O3/n+Si/Al结构,其Forming、Set和Reset阈值电压均低于4 V,符合存储器低电压工作的要求.     

Rectifying resistance-switching behaviour of Ag/SBTO/STMO/$$\hbox {p}^{+}$$-Si heterostructure films

The \(\hbox {Sr}_{0.88}\hbox {Bi}_{0.12}\hbox {TiO}_{3}/\hbox {SrTi}_{0.92}\hbox {Mg}_{0.08}\hbox {O}_{3}\) (SBTO/STMO) heterostructure films were prepared on \(\hbox {p}^{+}\hbox {-Si}\) substrates by sol–gel spin-coating technique, and the films had good crystallinity and uniform grain distribution. The heterostructure films with a structure of Ag/SBTO/STMO/\(\hbox {p}^{+}\hbox {-Si}\) exhibited a bipolar, remarkable resistance-switching characteristic, and \(R_{\mathrm{HRS}}/R_{\mathrm{LRS}}\,\,{\sim }10^{4}\). More importantly, the heterostructure films showed rectifying characteristic in the low resistance state (LRS), and the rectification ratio can reach \(10^{2 }\) at \(\pm 1\hbox { V}\). The dominant resistive-switching conduction mechanism of high resistance state (HRS) was Ohmic behaviour, and the LRS changed to space charge-limited current (SCLC).     

Tunable capacitors employing BZN/BST thin films for RF applications

Tunable parallel-plate capacitors employing Bi(1.5)Zn(1.0)Nb(1.5)O(7)/Ba(0.5)Sr(0.5)TiO(3) (BZN/BST) thin films for RF applications are reported. The intermediate frequency measurements indicate that the BZN/BST-based varactors demonstrate large tunability of 39% at 40 V and high device quality factor of 300 at 1 MHz. The devices maintain quite low leakage current density even under a high applied bias. The quality factor analysis shows that the device quality factor is highly dependent on conductor loss of electrodes at frequencies above 1 MHz. The phase shifter employing BZN/BST-based varactors exhibits lower insertion loss than does employing semiconductor diodes at a designed frequency of 445 MHz, demonstrating the potential of tunable capacitors employing BZN/BST thin films for RF applications.     

Improved photoluminescence and ferroelectric properties of (Bi(3.6)Eu(0.4))Ti₃O₁₂ thin films via Li+ doping

(Bi(3.6)Eu(0.4))Ti?O?? (BEuT) thin films with different Li+ doping contents were prepared on fused silica and Pt/Ti/SiO?/Si substrates by chemical solution deposition, and the effects of Li+ doping contents on the photoluminescence and ferroelectric properties of the thin films were investigated in detail. The results showed that an appropriate amount of Li+ doping could effectively improve emission intensities for two characteristic Eu3+ emission transitions of ?D?→?F? (594 nm) and ?D?→?F? (617 nm) compared with BEuT thin films without Li doping. This photoluminescence improvement can be attributed to the dual roles of Li+ ions, one of which is that Li ions can act as co-activators which are helpful to the energy transfer from the host to the Eu3+ ions, leading to a higher quantum yield; the other is that Li ion doping can induce local distortion of crystal field surrounding the Eu3+ activator because Bi3+ and Li+ ions have different ionic radii. In addition, the Li+-doped BEuT thin films had larger remanent polarization than BEuT thin films without Li doping prepared under the same experimental conditions. These results suggest that Li+ doping is an effective way to improve photoluminescence and ferroelectric properties of the (Bi,Eu)?Ti?O?? thin films.     

铅对(Pbx,Sr1-x)0.85Bi0.1TiO3薄膜结构与介电可调性影响的研究

用溶胶-凝胶法制备了（Pbx，Sr1-x）0．85Bi0．1TiO3薄膜，对其晶相结构、微观形貌和介电可调性进行了研究．结果表明，该薄膜以钙钛矿形式存在．快速热处理过程可分解得到高活性离子，直接形成比相应温度平衡状态析晶时更多的晶相量．这种晶相在一定条件下有分解和再结晶的趋势．随着Pb^2＋离子增加和Sr^2＋离子减少，钙钛矿相的四方相与立方相间的转变温度升高．薄膜处在铁电相和顺电相转变点附近时，可以获得较大的可调性．     

Si/a-Si core/shell nanowires as nonvolatile crossbar switches

Radial core/shell nanowires (NWs) represent an important class of nanoscale building blocks with substantial potential for exploring fundamental electronic properties and realizing novel device applications at the nanoscale. Here, we report the synthesis of crystalline silicon/amorphous silicon (Si/a-Si) core/shell NWs and studies of crossed Si/a-Si NW metal NW (Si/a-Si x M) devices and arrays. Room-temperature electrical measurements on single Si/a-Si x Ag NW devices exhibit bistable switching between high (off) and low (on) resistance states with well-defined switching threshold voltages, on/off ratios greater than 10(4), and current rectification in the on state. Temperature-dependent switching experiments suggest that rectification can be attributed to barriers to electric field-driven metal diffusion. Systematic studies of Si/a-Si x Ag NW devices show that (i) the bit size can be at least as small as 20 nm x 20 nm, (ii) the writing time is <100 ns, (iii) the retention time is >2 weeks, and (iv) devices can be switched >10(4) times without degradation in performance. In addition, studies of dense one-dimensional and two-dimensional Si/a-Si x Ag NW devices arrays fabricated on crystalline and plastic substrates show that elements within the arrays can be independently switched and read, and moreover that bends with radii of curvature as small as 0.3 cm cause little change in device characteristics. The Si/a-Si x Ag NW devices represent a highly scalable and promising nanodevice element for assembly and fabrication of dense nonvolatile memory and programmable nanoprocessors.     

Ag／La0.67Sr0.33MnO3/Pt异质结构的电阻开关特性

采用脉冲激光沉积技术在Pt／Ti／SiO2／Si（100）衬底上制备出多晶La0.67Sr0.33MnO3（LSMO）薄膜,对其电脉冲致非挥发可逆电阻开关特性进行研究．结果表明,Ag/LSMO／Pt结构具有明显的室温电脉冲诱发电阻开关特性,且在宽电压脉冲作用下表现出较低的开关电压和较快的变阻饱和速度．由此可见,总脉冲能量或电荷（电流作用）为该结构的电阻开关效应提供驱动力．对Ag／LsMO／Pt结构进行了耐久性测试,表明该结构具有良好的疲劳特性与保持特性,可应用于新型不挥发存储器、传感器及可变电阻等电子元器件的研制     

Resistance Random Access Memory Based on a Thin Film of CdS Nanocrystals Prepared via Colloidal Synthesis

We demonstrate that resistance random access memory (RRAM) can be fabricated based on CdS-nanocrystal thin films. A simple drop-drying of the CdS-nanocrystal solution leads to the formation of uniform thin films with controlled thickness. RRAMs with a Ag/Al(2) O(3) /CdS/Pt structure show bipolar switching behavior, with average values of the set voltage (V(Set) ) and reset voltage (V(Reset) ) of 0.15 V and -0.19 V, respectively. The RRAM characteristics are critically influenced by the thickness of the Al(2) O(3) barrier layer, which prevents significant migration of Ag into the CdS layer as revealed by Auger electron spectroscopy (AES). Interestingly, RRAM without an Al(2) O(3) layer (i.e., Ag/CdS/Pt structure) also shows bipolar switching behavior, but the polarity is opposite to that of RRAM with the Al(2) O(3) layer (i.e., Ag/Al(2) O(3) /CdS/Pt structure). The operation of both kinds of devices can be explained by the conventional conductive bridging mechanism. Additionally, we fabricated RRAM devices on Kapton film for potential applications in flexible electronics, and the performance of this RRAM device was comparable to that of RRAMs fabricated on hard silicon substrates. Our results show a new possibility of using chalcogenide nanocrystals for RRAM applications.