AlGaAs／GaAs HBT集成电路的CAD

介绍了一套用于ＡｌＧａＡｓ／ＧａＡｓ ＨＢＴ集成电路的ＣＡＤ软件，它可完成ＨＢＴ的器件模拟、模型参数提取及电路模拟。应用该软件对ＨＢＴ运算放大器进行了模拟，为电路的研制提供了依据。     

GaAs IC CAD方法

本文重点论述ＧａＡｓ ＩＣ ＣＡＤ方法，包括：精确的ＧａＡｓ ＭＥｓＦＥＴ、ＨＥＭＴ和ＨＢＴ等有源器件模型；大、小信号模型参数提取；噪声模型；成品优化；高频、高速微带传输线模型；电路模拟与优化；砷化镓门阵等。还评述了ＧａＡｓ ＩＣ ＣＡＤ集成软件包及进一步工作。     

高电流截止频率GaInP／GaAs HBT

本文简要介绍了ＧａＩｎＰ／ＧａＡｓ ＨＢＴ的发展现状，用湿法工艺制作了自对准ＧａＩｎＰ／ＧａＡｓ ＨＢＴ，其电流截止频率高达５０ＧＨＺ，性能优于我们在同等工艺条件下制作的ＡｌＧａＡｓ／ＧａＡｓＨＢＰ。     

富士通研究所开发3．5V GaAs HBT

富士通研究所开发３．５ＶＧａＡｓＨＢＴ日本富士通研究所已研制成作为新一代便携电话的３．５ＶＧａＡｓ异质结双极晶体管（ＨＢＴ）和新结构ＨＢＴ。ＧａＡｓＨＢＴ具有与用于便携电话的发射部分的ＧａＡｓＦＥＴ相比，芯片面积减少１／２，大功率增益和单一电源工作等...     

HBT电压控制振荡器的相位噪声

研究了电压控制振荡器（ＶＣＯ）的相位噪声与构成该振荡器的有源器件的低频噪声的关系,测试了ＳｉＢＪＴ、ＡｌＧａＡｓ／ＧａＡｓ ＨＢＴ和ＧａＩｎＰ／ＧａＡｓ ＨＢＴ的低频噪声,并分析了各自低频噪声产生的原因,提出了选择ＧａＩｎＰ／ＧａＡｓ ＨＢＴ ＶＣＯ来实现微波固体振荡器低相位噪声化这一发展方向。     

InP基HEMT／HBT器件工艺的最新进展

目前ＧａＡｓ基低噪声ＨＥＭＴ，包括用于ＤＢＳ的ＩｎＧａＡｓ／Ｎ－ＡｌＧａＡｓＰＨＥＭＴ已经商品化，且ＧａＡｓ基功率ＨＢＴ也将很快进入市场。尽管ＩｎＰ基ＨＥＭＴ或ＨＢＴ仍处于研究与发展阶段，但由于它们特殊的电性能，它们将有希望成为下一代异质结构器件。在继续改进器件结构和工艺过程中，晶格生长工艺的改进激发了一种新的趋势，提出并实现了一种用ＩｎＰ做有源层的新型器件结构。这篇文章主要描述了这样一种ＩｎＰ基ＨＥＭＴ和ＨＢＴ器件结构的最新进展。     

台面型自对准结构AlGaAa／GaAs HBT的工艺研究

本文提出了一种台面型全自对准结构ＡｌＧａＡｓ／ＧａＡｓＨＢＴ的制造方案，对其中的欧姆接触金属系统的制备，ＡｌＧａＡｓ／ＧａＡｓ材料的选择性腐蚀及聚酰亚胺的反应离子刻蚀终点监控等关键工艺技术进行了研究，并给出了应用该工艺研制的ＨＢＴ器件的初步结果。     

AlGaAs－InGaP／GaAs HBT，f_T高达245GHz

ＡｌＧａＡｓ－ＩｎＧａＰ／ＧａＡｓ　ＨＢＴ，ｆ_Ｔ高达２４５ＧＨｚ《ＩＥＥＤＩＪ》１９９３年第１２期报道了一种新的ＨＢＴ，采用ＡＩＧａＡｓ－ＩｎＧａＰ发射区结构。该结构在发射极形成一个电子发射器，产生速度过冲效应。它一方面增强了发射极输运，同时减少了?..     

AlGaAs／GaAs毫米波HBT的研制

ＡｌＧａＡｓ／ＧａＡｓ毫米波ＨＢＴ的研制吴英，钱峰，陈新宇，邵凯，郑瑞英，肖秀红，葛亚芬，金龙（南京电子器件研究所，２１００１６）ＴｈｅＤｅｖｅｌｏｐｍｅｎｔｏｆＡｌＧａＡｓ／ＧａＡｓＭｉｌｌｉｍｅｔｅｒＷａｖｅＨＢＴ￥ＷｕＹｉｎｇ；ＱｉａｎＦｅｎｇ...     

四元系AlGaInP为发射极异质结双极晶体管研究

本文对ＡｌＧａＩｎＰ／ＧａＡｓ异质结双极晶体管（ＨＢＴ）进行了研究．设计并制备了ＡｌＧａＩｎＰ为发射极的叉指结构ＨＢＴ器件．研究结果表明,ＡｌＧａＩｎＰ／ＧａＡｓＨＢＴ具有较高的电流增益和较好的温度特性．同时,由于对ＡｌＧａＩｎＰ和ＧａＡｓ腐蚀选择性大,因而工艺简单、重复性好．     

RTD的器件模型和模拟——共振隧穿器件讲座(9)

阐述了电路模拟在设计和研制大规模集成过程中的必要性和重要意义,器件模型在电路模拟中的重要性以及器件模拟与器件模型的关系;在器件模拟通用软件形成过程的基础上重点讨论了RTD的器件模型、器件模拟和电路模拟软件SPICE三个课题;介绍了基于物理参数I-V方程RTD模型和高斯函数、指数函数RTD直流模型;利用ATLAS器件模拟通用软件对RTD进行了器件模拟,得到了势垒和势阱宽度、E区掺杂浓度等对RTDI-V特性的影响;以包含RTD电路的SPICE电路模拟中的文字逻辑门为例,通过电路模拟验证了其逻辑功能,对设计该电路起到指导和参考作用。     

System simulation and realization of a resonant inverter with afield-controlled thyristor

The design, simulation, and realization of a single-ended quasi-resonant inverter (SEQRI) for induction heating applications are described. A novel power device, the field-controller thyristor (FCT), is used as a switching device. Full understanding and a proper realization of the circuit is obtained by accurate simulation with a software tool combining circuit and two-dimensional device simulation. With the use of combined circuit/device simulation, the operation of the system is predicted accurately. Comparison with experimental data showed excellent agreement. It is verified that a 15 A/1700 V FCT is an appropriate switching device for a SEQRI fed from a 220 V mains and delivering an output power of 1 kW     

Dealing with hot-carrier aging in nMOS and DMOS, models, simulations and characterizations

Circuit aging simulation is seen as a true enhancement to device and circuit simulation. To predict aging of circuit performance, tested models for device parameters are needed in which the change in device behavior as function of time, given the biasing and temperature condition of the device in the circuit, is correctly modeled. The time scale here is the lifetime of the product. A circuit simulator in the transient mode can predict circuit aging using a transformation of the dc/ac biasing situation with an appropriate scaling mechanism. Device aging models that can be implemented in such a circuit simulator are presented here for nMOS and DMOS (double diffused MOS) based on measurements and empirical modeling.     

深亚微米CMOS混合信号电路衬底噪声耦合宏模型

提出了一种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型.该宏模型通过器件模拟与非线性拟合相结合的方法建立,使衬底寄生参数的提取更加方便,同时保障了深亚微米电路特性的模拟精度.此外,该宏模型结构简单,可以得到与器件模拟基本一致的模拟结果,并可以方便地嵌入SPICE中进行一定规模的电路模拟.     

3-D device modeling for SRAM soft-error immunity and tolerance analysis

Soft-error tolerance of static random-access memory (SRAM) devices has been predicted by using three-dimensional (3-D) and time-dependent device simulation in conjunction with circuit simulation. An inverter model developed for 3-D device simulation is described, along with the analysis of the inverters device response as a function of time. The output thus obtained was applied as an input voltage source in circuit simulation of unit SRAM cell and the stability of this bistable circuit is studied on that basis. The effects on soft-error immunity of changes in alpha-particle injection conditions and in load resistance and capacitance are described. The validity of the presented model is examined through comparison of the bit-error-rate dependence on incident angle of alpha particles to that of measured rates. To simulate the angular dependence, we introduce statistical distribution models for alpha-particle energy, position of incidence on the device surface, and angle of incident. Results of device/circuit simulation carried out with many sets of energy, position, and angle are presented. Reasonable agreement between results of simulation and experimental data without the use of adjustment parameters is demonstrated. A map of soft-error tolerance on the CR plane with critical charge Q/sub c/ as a parameter is presented and its derivation explained. An analytic expression for the tolerance is clarified by proposing an equivalent circuit model for the simulation of alpha-particle injection at the output node in an inverter circuit. Inverter modeling is shown to be essential to obtaining SRAM soft-error tolerance to high degrees of accuracy.     

Convolution-based global simulation technique for millimeter-wave photodetector and photomixer circuits

A fast convolution-based time-domain approach to global photonic-circuit simulation is presented that incorporates a physical device model in the complete detector or mixer circuit. The device used in the demonstration of this technique is a GaAs metal-semiconductor-metal (MSM) photodetector that offers a high response speed for the detection and generation of millimeter waves. Global simulation greatly increases the accuracy in evaluating the complete circuit performance because it accounts for the effects of the millimeter-wave embedding circuit. Device and circuit performance are assessed by calculating optical responsivity and bandwidth. Device-only simulations using GaAs MSMs are compared with global simulations that illustrate the strong interdependence between device and external circuit.     

Practical integration of process, device, and circuit simulation

Readily available process, device, and circuit simulation programs have been integrated into an effective system for enhancing semiconductor product development. In this paper, the system will be discussed with particular emphasis on the problems encountered in making simulation tools accessible to users. Each of the primary programs is reviewed, and the modifications and enhancements which have been made to adapt the programs to our requirements are discussed. The problem of interpolating impurity concentration profiles between process simulation grids and device simulation grids is discussed. The link between device simulation and circuit simulation is parameter extraction. The application of optimization techniques for parameter extraction is considered.     

半导体器件/电路混合模拟及其在HPM效应中的应用

建立了自行研制的通用二维半导体器件数值模拟软件GSRES与电子电路仿真软件SPICE的接口;实现了半导体器件/电路混合模拟功能,从而将电子系统的高功率微波效应模拟容纳到电路模拟的框架下;给出对CMOS反相器及典型数字电路的混合模拟算例.计算结果验证了该方法的可行性及有效性.     

10kV电压扰动装置主电路设计及稳态运行特性

为了检测电能质量补偿装置在电能质量扰动情况下的性能,文章提出了适用于10kV电压等级的多功能电压扰动发生器的主电路结构设计方案,采用H桥级联的拓扑结构,将该装置直接串联在线路,形成了电压扰动发生源。结合该装置主电路拓扑,研究了装置的稳态运行特性,利用PSCAD/EMTDC软件对装置稳态运行特性进行了仿真,仿真结果验证了该装置主电路设计方案的可行性。     

红外遥控发射器Proteus仿真研究

Proteus仿真软件中缺少红外遥控器件,给红外遥控系统开发造成了一定的阻碍。通过设计一种通用的红外遥控发射器Proteus仿真模块能解决这一问题。该仿真模块由单片机做控制核心,包含矩阵键盘扫描、数据调制和红外发射三部分外围电路,整个模块相当于红外遥控器。在红外遥控系统仿真时,可以直接复制该模块,填补了Proteus仿真软件对于红外遥控发射器件的这一缺口,能大大缩短红外遥控系统开发周期。