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用溶胶-凝胶法制备出锆钛酸铅(PZT)粉体,与流延胶以一定配比混合后流延成型,坯膜于1 100℃高温烧结2h得到PZT厚膜.利用XRD和SEM研究其组织结构,同时测试其相关电性能.结果表明,以10 mL流延胶中加入120 g PZT粉的配比进行流延较合适;得到厚度约为200 μm的钙钛矿结构压电厚膜无裂纹、晶粒尺寸小且分布均匀,其压电常数d33为109 pC/N.在1 kHz测试频率下,其介电常数为179,介电损耗为0.4. 相似文献
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在(100)单晶Si 衬底上,采用MEMS 工艺和丝网印刷方法制作了锆钛酸铅(PZT)厚膜热释电红外探测器,深入研究了PZT 厚膜材料的制备方法与器件加工工艺。采用四甲基氢氧化铵(TMAH)溶液腐蚀Si 衬底制备硅杯结构。为防止Pb 和Si 相互扩散,在Pt 底电极与SiO2/ Si 衬底之间通过射频反应溅射制备了Al2O3 薄膜阻挡层。采用丝网印刷在硅杯中制备了30 m 厚的PZT 材料,并用冷等静压技术提高厚膜的致密度,实现了PZT 厚膜在850℃的低温烧结。PZT 厚膜在1 kHz、25℃下的相对介电常数与损耗角正切分别为210 和0.017,动态法测得热释电系数为1.510-8Ccm-2K-1。最后制备了敏感元为3 mm3 mm 的单元红外探测器,使用由斩波器调制的黑体辐射,在调制频率为112.9 Hz 时测得器件的探测率达到最大值7.4107 cmHz1/2W-1。 相似文献
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针对以国内新研发的Au导体浆料与电阻浆料在Al_2O_3基片表面印制的Au导体/电阻复合厚膜烧结易起泡的现象,在探明起泡原因的基础上,研究了烧结温度、升温速率以及Au层厚度对复合厚膜起泡的影响,进一步优化厚膜工艺,制备出无起泡的复合厚膜。研究表明,烧成温度过高导致的玻璃相浮于复合膜层表面并结晶,烧结过程不充分和Au层厚度不足等导致不能在陶瓷基片/Au层界面形成连续的玻璃相粘结层,界面结合强度大大降低,在陶瓷基片/Au层界面易起泡。在烧结峰值温度为825℃,升温速率为40℃/min,Au导体层厚度为10μm的工艺条件下,复合厚膜与陶瓷基片结合紧密,无起泡现象。 相似文献
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通过显微组织观察和电性能测试等研究了制备工艺和样品厚度对流延法制备单层方形ZnOV2O5-Sb2O3(ZnVSb)基压敏电阻的影响.在流延基础上,通过加压排胶和烧结可制得无翘曲、显微组织均匀且致密的样品.900℃、4 h烧结1 mm厚样品性能最佳:非线性系数及压敏电压分别为45 V/mm和600V/mm.样品的非线性系数随厚度的减少而降低. 相似文献
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采用丝网印刷工艺制备了Pb(Zr0.9T0.1)O3(PZT)厚膜,研究了过量PbO和Bi2O3-Li2CO3共同助烧对PZT厚膜低温烧结特性、微观结构、相构成以及介电和热释电性能的影响。结果表明:随着过量PbO及Bi2O3-Li2CO3添加量的增加,PZT厚膜的烧结温度和晶粒尺寸均逐渐降低。当PbO过量6.4%(质量分数)、Bi2O3-Li2CO3添加量为5.4%(质量分数)时,PZT厚膜可在900℃低温下致密成瓷,且其热释电系数和探测率优值均得到大幅提高;所得样品在30℃时的热释电系数为10.6×10–8C.cm–2.K–1,探测率优值为8.2×10–5Pa–1/2。 相似文献
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PZT叠层厚膜陶瓷材料性能的研究 总被引:1,自引:1,他引:0
使用凝胶流延成型工艺制备了PZT85/15、PZT95/5单组分厚膜及叠层厚膜.通过和单组分厚膜的性能进行对比,分析了叠层厚膜的形貌特征及介电、铁电和热释电性能.结果表明,由PZT85/15和PZT95/5组成的叠层厚膜内部均匀致密,具有良好的介电、铁电和热释电性能,极化后的相对介电常数εr=191.5,介电损耗tan δ=0.7%(温度T=20℃,频率f=1 kHz),热释电系数在41℃时达到峰值8×10-8 C/cm2·K,此后下降不明显,从而改善了单组分厚膜相变温区过窄的缺点,达到拓宽相变温区的目的,有望在红外探测和相变换能方面得到更广泛的应用. 相似文献
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以PZT薄膜为驱动和传感的微型陀螺研制 总被引:5,自引:0,他引:5
利用压电陶瓷PZT的正反压电位效应,将PZT薄膜同时作为驱动及传感材料,设计并制造了两种新颖的以IC兼容技术制作在硅片上的压电薄膜微型陀螺。高质量的PZT薄膜是在Pt/Ti/SiO2/Si基底上以溶胶-凝胶技术铺设的。基于反压电效应,微型陀螺在其谐振频率上被输入的交流信号驱动,由其正压电效应,可检测到与转动角速度成正比的输出信号。文章分别介绍了两种微型陀螺的设计原理,详述了制作方法,并对制出的压电微型陀螺进行了检测,得到了的结果与预测结果相符。 相似文献
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Papakostas T.V. White N.M. 《Components and Packaging Technologies, IEEE Transactions on》2001,24(1):67-75
The integration of polymer thick-film transducers and silicon offers a low-cost technology for the fabrication of hybrid microsystems. This paper presents a study on the feasibility and processing parameters of this integration. Selected transducer films were printed on silicon wafers covered with aluminum or various passivation layers and also on alumina for comparison. The quality of film adhesion was investigated using standard tape pull and scratch tests. Scanning electron microscopy and energy dispersive X-ray spectra analysis were used to investigate the interface between the films and the substrates. It was found that the films did not contaminate the wafers. We also characterized the film resolution by researching the wetting behavior of the pastes and the quality of printed patterns. The influence of the substrate's thermal coefficient of expansion on the resistance of a carbon polymer film was also analyzed. The experiments showed that the same design rules can be applied on both alumina and silicon substrates. Furthermore, dry and wet methods of etching and cleaning wafers from the thick-films were assessed. An insight into the potential and limitations of the technology is developed by discussing the issues of bonding mechanism, silicon contamination and influence of substrate on the resolution, electrical properties and infrared curing of the films. A design methodology for hybrid microsystems is proposed along with a suggestion for potential applications 相似文献
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铁电存储器中Pb(Zr,Ti)O_3集成铁电电容的制备 总被引:1,自引:0,他引:1
在铁电不挥发存储器 (FERAM)技术中 ,集成铁电电容的制备是关键工艺之一。文中提出一种制备集成铁电电容的改进工艺 :采用 lift-off技术在衬底样品表面淀积铁电电容 Pt/Ti下电极 ,然后用 Sol-Gel方法制备 PZT薄膜。在 PZT薄膜未析晶前 ,先将它加工成电容图形 ,再高温退火成为 PZT铁电薄膜。最后完成铁电电容 Pt上电极。与传统工艺相比 ,改进后的工艺能保持 PZT铁电薄膜与金属上电极之间良好的接触界面。测试结果表明 ,工艺条件的变动不会影响 PZT铁电薄膜的成膜和结构 ,从而可得到性能优良的铁电电容。 相似文献
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氮化硅陶瓷力学性能优异,理论热导率高,是大功率电力电子器件的关键热管理材料。但是,高导热氮化硅陶瓷烧结温度高、保温时间长,因此制备成本居高不下,对于产业化应用不利。本研究提出了一种快速制备高导热氮化硅陶瓷的方案。以Y2O3-MgO-C作为烧结助剂,以高纯硅粉作为起始原料,通过流延成型和硅粉氮化制备素坯,在1900℃、0.6MPa保温2h制备出高导热氮化硅陶瓷。研究了C的添加量对于氮化硅陶瓷的致密化、晶相、微结构、力学性能以及热导率的影响规律。最终制备的氮化硅陶瓷密度可以达到99%以上,热导率达到98W/m·K。 相似文献
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The integration and the device realization of Pb(Zr, Ti)O3 (PZT) thick films on Si substrates are known to be extremely difficult because the processing temperature of the PZT thick film is close to the melting point of Si. However, PZT thick‐film devices on Si warrant attention as they are appropriate for biological transducers; they generate large actuating forces and have a relatively high sensitivity for mass detection, especially in liquids. In this study, Pb(Zr0.52Ti0.48)O3 thick‐film cantilever devices are successfully fabricated on a Pt/TiO2/SiNx/Si substrate using a screen‐printing method and microelectromechanical systems (MEMS) process. Elastic and electromechanical properties such as the Young's modulus and transverse piezoelectric coefficient are determined from microstructural and electrical analyses for further mechanical study. The calculated Young's modulus of the thick film, 53.9 ± 3.85 GPa, corresponds to the resonant frequency obtained from the measured harmonic oscillation response. The transverse piezoelectric constant, d31, of –20.7 to –18.8 pC N–1 is comparable to that of a dense thin film. These values promise the possibility of determining the resonance properties of a thick‐film cantilever by designing its structure and then simulating the harmonic oscillation response. Using the PZT thick‐film cantilever, a strong harmonic oscillation with a quality (Q) factor of about 23 is demonstrated in water. The observation of strong harmonic oscillation in liquid implies the feasibility of precise real‐time recognition of biomolecules using PZT thick‐film cantilevers. 相似文献
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采用溶胶-凝胶法(Sol-Gel)在Pt/Si衬底上制备了PbTiO3 (PT)薄膜和Pb (Zrx,Ti1-x)O3(PZT)薄膜,研究了退火温度以及PT种子层对PZT薄膜结晶及压电性能的影响。X射线衍射(XRD)结果表明,制备的PZT薄膜为纯钙钛矿结构的多晶薄膜,有PT种子层的PZT薄膜晶粒尺寸更大,(110)面取向度更高,结晶性能更好;原子力显微镜(AFM)结果表明,制备的薄膜表面形貌比较平整、均匀、无裂纹;压电力显微镜(PFM)结果表明,压电力显微镜(PFM)结果表明,有PT种子层时,PZT薄膜的平均压电系数d33为128~237 pm/V,无PT种子层时平均压电系数d33为21~29 pm/V。在升温速率为10 ℃/s的退火条件下保温10 min时,随着退火温度的升高,PZT薄膜晶粒尺寸增大,粗糙度增大,(110)面取向度升高,平均压电系数d33增大。PT种子层能够有效的改善PZT薄膜的结晶性能和压电性能。 相似文献