共查询到20条相似文献,搜索用时 125 毫秒
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石墨烯由于高迁移率、高导热性、柔韧性好和机械强度高等优异性能使其成为构筑新型纳米电子器件的重要材料,已成为电子信息、生物医学、显示等领域的研究热点。当石墨烯材料及其电子器件放置于含有辐照因素的场景中时,会因为与高能光子和带电粒子等相互作用而改变晶格结构或积累电荷,使石墨烯材料及电子器件的性能发生变化。本文主要综述了典型辐照因素对石墨烯及器件的主要效应及研究进展,旨在总结不同辐照在石墨烯及其电子器件中引发的物理效应,归纳其微观-宏观性质变化,为加深石墨烯材料及器件的辐照效应的理解,推动其在辐照场景中的实际应用奠定基础。 相似文献
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近年来,氮化物半导体电子器件和材料研究有了重大的进展。在国家自然科学基金资助下,西安电子科技大学、北京大学和中科院微电子所完成了国家自然科学基金重点项目《GaN宽禁带微电子材料和器件重大基础问题研究》。致力于通过氮化物电子材料和器件的基础物理机理研究提高GaN电子材料的结晶质量和电学性能、发展新结构GaN异质结材料研究,获得高性能的GaN HEMT微波功率器件。本文主要介绍该项目在GaN微波功率HEMT和新型高k栅介质MOS-HEMT、InAlN/GaN材料的生长和物性缺陷分析以及HEMT器件研制、GaN异质结的量子输运和自旋性质研究以及GaN材料高场输运性质和耿氏器件等几个方面取得的研究进展。 相似文献
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一种简便的制备碳纳米管装填Fe纳米丝的方法 总被引:1,自引:0,他引:1
自1991年Ijima发现碳纳米管以来,人们对碳纳米管及其复合物的关注方兴未艾。在碳纳米管中装填金属纳米丝,可能会改变它们的电学性质,增强金属纳米丝的机械强度和化学稳定性,这种复合结构可用作纳米电子器件中的导线、纳米电极及探针,特别是有希望在磁记录材料上得到应用,开展这方面的研究有重要的意义。到目前为止,已有一些将金属装入碳纳米管的物理和化学方法。 相似文献
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近年来,氧化物一维纳米结构的研究成为物理、材料、化学领域的热点课题。氧化物一维纳米结构有着优异的物理和化学性质,同时又易于构建纳米器件以形成工业化生产,因而在激光器件、纳米电子学、纳米光子学以及未来新一代集成电路设计里有广阔的应用前景。 相似文献
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在半导体超晶格物理与器件的研究中,锗硅超晶格、异质结、量子阱材料与器件的研究占据着十分重要的地位.这是因为,以Si_(1-x)Ge_x/Si和Ge/Si为主的硅基低维材料具有许多显著不同于体单晶硅,而且相异于Ⅲ-V族超晶格的优异性质,如可生长大直径尺寸单晶,机械强度高、导热性能好、制备工艺成熟、价格低廉,SiGe合金中Ge的组分可调,可与现代微电子技术相兼容,布里渊区的折叠效应可使Si由间接带隙变为直接带隙等,因此在微米波段,毫米波段,超高速ECL电路,红外焦平面阵列等高速电子器件及其集成光电子器件中有着潜在的应用. 相似文献
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SiC和GaN等宽带隙半导体以其固有的高频、大功率、高温和抗恶劣环境应用潜力,在替代传统的Si和GaAs等器件应用于军事及宇航系统装备方面具有无可比拟的技术优势.概述了以SiC、GaN和金刚石等为代表的第三代半导体器件技术的发展现状,介绍了国外发达国家在发展宽带隙半导体技术上值得借鉴的一些做法,着重讨论宽带隙半导体技术对宇航及军事装备产生的重要影响,并展望了宽带隙半导体技术在宇航及军事应用中的发展前景. 相似文献
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Haitao Liu Qilin Hua Ruomeng Yu Yuchao Yang Taiping Zhang Yingjiu Zhang Caofeng Pan 《Advanced functional materials》2016,26(29):5307-5314
Bamboo‐like gallium nitride (GaN) microwires are synthesized via chemical vapor deposition (CVD) to fabricate piezotronic memristors. Defect boundary areas (DBAs) near the bamboo knots produce apparent switching between high and low resistance states upon sweeping of the magnitudes of the biased voltages across the GaN microwire‐based devices at room temperature. Furthermore, by coupling the piezoelectric and semiconducting properties in the GaN microwire, the piezotronic effect is introduced to effectively modulate the SET voltages via strain‐induced piezoelectric polarizations created at the DBA interface upon mechanical deformation. The experimental results indicate that the device remembered the most recent resistance states when the power is turned off, and the waveform is tunable because of the delayed switching effect. This work provides an alternative approach to the design and modification of memristors based on nanostructured piezoelectric semiconductors using the piezotronic effect. 相似文献
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M.S. Shur 《Solid-state electronics》1998,42(12):2131-2138
Unique properties of GaN and related semiconductors make them superior for high-power applications. The maximum density of the two-dimensional electron gas at the GaN/AlGaN heterointerface or in GaN/AlGaN quantum well structures can exceed 2×1013 cm−2, which is more than an order of magnitude higher than for traditional GaAs/AlGaAs heterostructures. The mobility-sheet carrier concentration product for these two dimensional systems might also exceed that for GaAs/AlGaAs heterostructures and can be further enhanced by doping the conducting channels and by using “piezoelectric” doping. Current densities over 20 A mm−1 can be reached in GaN-based high electron mobility transistors (HEMTs). These high current values can be combined with very high breakdown voltages in high-power HEMTs, which are expected to reach several thousand volts. Recent Monte Carlo simulations point to strong ballistic and overshoot effects in GaN and related materials, which should be even more pronounced than in GaAs-based compounds but at much higher electric fields. This should allow us to achieve faster switching, minimizing the power dissipation during switching events. Self-heating, which is unavoidable in power devices, raises operating temperatures of power devices well above the ambient temperature. For GaN-based devices, the use of SiC substrates allows to combine the best features of both GaN and SiC technologies; and GaN/SiC-based semiconductors and heterostructures should find numerous applications in power electronics. 相似文献
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Fang Liu Zhihong Zhang Xin Rong Ye Yu Tao Wang Bowen Sheng Jiaqi Wei Siyuan Zhou Xuelin Yang Fujun Xu Zhixin Qin Yuantao Zhang Kaihui Liu Bo Shen Xinqiang Wang 《Advanced functional materials》2020,30(22)
Lattice polarity is a key point for hexagonal semiconductors such as GaN. Unfortunately, only Ga‐polarity GaN have been achieved on graphene till now. Here, the epitaxy of high quality nitrogen‐polarity GaN films on transferred graphene on non‐polar sapphire substrates by molecular beam epitaxy is reported. This success is achieved through atomic nitrogen irradiation, where C? N bonds are formed in graphene and provide nucleation sites for GaN and leading to N‐polarity GaN epitaxy. The N‐polarity characteristics are confirmed by chemical etching and transmission electron microscopy measurement. Due to the higher growth temperature of InGaN at N‐polarity than that at Ga‐polarity, green light emitting diodes are fabricated on the graphene‐assisted substrate, where a large redshift of emission wavelength is observed. These results open a new avenue for the polarity modulation of III‐nitride films based on 2D materials, and also pave the way for potential application in longer wavelength light emitting devices. 相似文献
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Ⅲ族氮化物及其二维电子气输运特性的研究进展 总被引:1,自引:0,他引:1
薛舫时 《固体电子学研究与进展》2004,24(3):265-274,280
Ⅲ族氮化物半导体具有宽禁带和直接带隙 ,导带能谷间距大 ,强场输运特性好。Al Ga N/Ga N异质结产生高密度的二维电子气 ,屏蔽了杂质和缺陷的散射 ,改善了低场输运性能。它弥补了宽禁带半导体输运性能差的缺点 ,已研制成大功率的 HFET。利用强场下的速度过冲有望消除阴极端的速度凹坑 ,显著改进器件性能。电子气的强二维性使输运特征依赖于器件结构和工作状态 ,器件设计变为一个剪裁电子状态和输运特性的复杂工程。文中综述了 族氮化物及其二维电子气的输运特性 ,讨论了从输运特性出发 ,优化 HFET性能的问题。 相似文献
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The first on-wafer integration of Si(100) MOSFETs and AlGaN/GaN high electron mobility transistors (HEMTs) is demonstrated. To enable a fully Si-compatible process, we fabricated a novel Si(100)-GaN-Si(100) virtual substrate through a wafer bonding and etch-back technique. The high thermal stability of nitride semiconductors allowed the fabrication of Si MOSFETs on this substrate without degrading the performance of the GaN epilayers. After the Si devices were fabricated, the nitride epilayer is exposed, and the nitride transistors are processed. By using this technology, GaN and Si devices separated by less than 5 mum from each other have been fabricated, which is suitable for building future heterogeneous integrated circuits. 相似文献
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Xiaolong Cai Chenglin Du Zixuan Sun Ran Ye Haijun Liu Yu Zhang Xiangyang Duan Hai Lu 《半导体学报》2021,42(5):37-48
Gallium nitride (GaN)-based high-electron mobility transistors (HEMTs) are widely used in high power and high frequency application fields,due to the outstanding physical and chemical properties of the GaN material.However,GaN HEMTs suffer from degradations and even failures during practical applications,making physical analyses of post-failure devices extremely significant for reliability improvements and further device optimizations.In this paper,common physical characterization techniques for post failure analyses are introduced,several failure mechanisms and corresponding failure phenomena are reviewed and summarized,and finally device optimization methods are discussed. 相似文献
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AlGaN/GaN界面特性研究进展 总被引:2,自引:0,他引:2
GaN是一种宽禁带半导体材料,由于具有优越的热稳定性和化学稳定性,使这种材料和与其相关的器件可以工作在高温和恶劣的环境中,并可用于大功率微波器件。本文主要介绍AlGaN/GaN有关界面特性,该特性反映了纵向纳米尺度下的能带特性;从AlGaN/GaNHEMT设计出发,给出了材料性质和结构参数对AlGaN/GaN异质结二维电子气特性影响的研究结果;讨论了AlGaN/GaN界面2DEG载流子的输运性质;分析了材料缺陷对AlGaN/GaN界面2DEG性质的影响;指出了有待研究的问题和方向。 相似文献
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使用金属有机物化学气相淀积(MOCVD)方法在蓝宝石衬底上分别采用AlN和GaN作为形核层生长了AlGaN/GaN高电子迁移率晶体管(HEMT)外延材料,并进行了器件制备和性能分析.通过原子力显微镜(AFM)、高分辨率X射线双晶衍射仪(HR-XRD)和二次离子质谱仪(SIMS)等仪器对两种样品进行了对比分析,结果表明采用AlN形核层的GaN外延材料具有更低的位错密度,且缓冲层中氧元素的拖尾现象得到有效地抑制.器件直流特性显示,与基于GaN形核层的器件相比,基于AlN形核层的器件泄漏电流低3个数量级.脉冲Ⅰ-Ⅴ测试发现基于GaN形核层的HEMT器件受缓冲层陷阱影响较大,而基于AlN形核层的HEMT器件缓冲层陷阱作用不明显. 相似文献