MBE生长的InP DHBT的性能

报道了一种自对准InP/InGaAs 双异质结双极晶体管的器件性能.成功制作了U型发射极尺寸为2μm×12μm的器件,其峰值共射直流增益超过300,残余电压约为0.16V,膝点电压仅为0.6V,而击穿电压约为6V.器件的截至频率达到80GHz,最大震荡频率为40GHz.这些特性使此类器件更适合于低压、低功耗及高频方面的应用.     

High DC and microwave characteristics of subhalf-micrometre gate ion-implanted GaAs MESFETs using trilayer deep UV lithography

Subhalf-micrometre gate length ion-implanted GaAs MESFETs have been fabricated on 3 inch diameter substrates using trilayer deep UV lithography. Implanted MESFETs with 0.3 mu m gate lengths exhibit a maximum extrinsic transconductance of 205 mS/mm at a drain current of 600 mA/mm. From S-parameter measurements, a current gain cutoff frequency f/sub t/ of 56 GHz and a maximum available gain cutoff frequency f/sub max/ greater than 90 GHz are achieved. The gate-to-drain diode characteristics of the devices show a sharp breakdown voltage of 13-15 V. The high drain current-drain voltage and microwave characteristics indicate that ion-implanted technology with trilayer deep UV lithography has potential for the manufacture of power devices and amplifiers for Q-band communication applications. This is the first reported result using trilayer deep UV lithography to demonstrate both f/sub t/ over 56 GHz and 13-15 V gate-to-drain breakdown on 0.3 mu m gate-length ion-implanted GaAs MESFETs.<>     

Low power 10 GHz ring VCO using source capacitively coupled current amplifier in 0.12 /spl mu/m CMOS technology

A 10 GHz ring voltage controlled oscillator (VCO) has been designed and implemented in 0.12 /spl mu/m CMOS technology. A source capacitively coupled current amplifier (SC3A) is adopted to realise this VCO. It can operate from 8.4 GHz up to 10.6 GHz with a phase noise of about -85 dBc/Hz at 1 MHz frequency offset. With the 1.5 V supply voltage, the current consumption is about 35 mA.     

An SOI LDMOS/CMOS/BJT technology for integrated power amplifiersused in wireless transceiver applications

This paper describes a SOI LDMOS/CMOS/BJT technology that can be used in portable wireless communication applications. This technology allows the complete integration of the front-end circuits with the baseband circuits for low-cost/low-power/high-volume single-chip transceiver implementation. The LDMOS transistors (0.35 μm channel length, 3.8 μm drift length, 4.5 GHz f_T and 21 V breakdown voltage), CMOS transistors (1.5 μm channel length, 0.8/-1.2 V threshold voltage), lateral NPN transistor (18 V BV_CBO and h _FE of 20), and high Q-factor (up to 6.1 at 900 MHz and 7.2 at 1.8 GHz) on-chip inductors are fabricated. A fully-functional high performance integrated power amplifier for 900 MHz wireless transceiver application is also demonstrated     

2.5Gb/Scmos光接收机跨阻前置放大器

给出了一种利用0.35μm CMOS工艺实现的2.5Gb/s跨阻前置放大器。此跨阻放大器的增益为59 dB*Ω,3dB带宽为2GHz,2GHz处的等效输入电流噪声为0.8×10-22 A2/Hz。在标准的5V电源电压下,功耗为250mW。PCML单端输出信号电压摆幅为200mVp-p。整个芯片面积为1.0mm×1.1mm。     

A Low Voltage Divide-by-4 Injection Locked Frequency Divider With Quadrature Outputs

This letter presents a low voltage quadrature divide-by-4 (divide4) injection-locked frequency divider (QILFD). The QILFD consists of a 1.8-GHz quadrature voltage controlled oscillator (QVCO) and two NMOS switches, which are inserted into the quadrature outputs of the QVCO for signal injection. The low-voltage CMOS divide4 QILFD has been implemented with the TSMC 0.18-mum 1P6 M CMOS technology and the core power consumption is 3.12mW at the supply voltage of 1.2V. The free-running frequency of the QILFD is tunable from 1.73 to 1.99GHz, the measured phase noise of QILFD is -118dBc/Hz at 1-MHz offset from the free running frequency of 1.82GHz. At the input power of 0dBm, the total locking range is from 6.86 to 8.02GHz as the tuning voltage is varied from 0 to 1.2V. The phase noise of the locked output spectrum is lower than that of free running ring oscillator by 11dBc/Hz. The phase deviation of quadrature output is about 0.8deg     

A Wide Locking Range Differential Colpitts Injection Locked Frequency Divider

This letter proposes a new wideband Colpitts injection locked frequency divider (ILFD) and describes the operation principle of the ILFD. The circuit consists of a differential CMOS LC-tank oscillator and a direct injection topology. The divide-by-two ILFD can provide wide locking range, and the measurement results show that at the supply voltage of 2.4 V, the tuning range of the free running ILFD is from 4.46 to 5.6 GHz, about 1.14 GHz, and the locking range of the ILFD is from 8.03 to 11.63 GHz, about 3.6 GHz, at the injection signal power of 0 dBm. The ILFD dissipates 19.92 mW at a supply voltage of 2.4 V and was fabricated in 1P6M 0.18 mum CMOS process. At the tuning voltage of 1.2 V, the measured phase noise of the free running ILFD is -110.8 dBc/Hz at 1 MHz offset frequency from 4.94 GHz and the phase noise of the locked ILFD is -135.4 dBc/Hz, while the input signal power is -4 dBm.     

Micro-power low-offset instrumentation amplifier IC design for biomedical system applications

This work presents a micro-power low-offset CMOS instrumentation amplifier integrated circuit with a large operating range for biomedical system applications. The equivalent input offset voltage is improved using a new circuit technique of offset cancellation that involves a two-phase clocking scheme with a frequency of 20 kHz. Channel charge injection is cancelled by the symmetrical circuit topology. With the wide-swing cascode bias circuit design, this amplifier realizes a very high power-supply rejection ratio (PSRR), and can be operated at single supply voltage in the range between 2.5-7.5 V. It was fabricated using 0.5-/spl mu/m double-poly double-metal n-well CMOS technology, and occupies a die area of 0.2 mm/sup 2/. This amplifier achieves a 160-/spl mu/V typical input offset voltage, 0.05% gain linearity, greater than 102-dB PSRR, an input-referred rms noise voltage of 45 /spl mu/V, and a current consumption of 61 /spl mu/A at a low supply voltage of 2.5 V. Experimental results indicate that the proposed amplifier can process the input electrocardiogram signal of a patient monitoring system and other portable biomedical devices.     

Self-aligned InP DHBT with f/sub /spl tau// and f/sub max/ over 300 GHz in a new manufacturable technology

We report self-aligned indium-phosphide double-heterojunction bipolar transistor devices in a new manufacturable technology with both cutoff frequency (f/sub /spl tau//) and maximum oscillation frequency (f/sub max/) over 300 GHz and open-base breakdown voltage (BV/sub ceo/) over 4 V. Logic circuits fabricated using these devices in a production integrated-circuit process achieved a current-mode logic ring-oscillator gate delay of 1.95 ps and an emitter-coupled logic static-divider frequency of 152 GHz, both of which closely matched model-based circuit simulations.     

A low-phase-noise 900-MHz CMOS ring oscillator with quadrature output

A 900-MHz two-stage CMOS voltage controlled ring oscillator (VCRO) with quadrature output is presented. The circuit is designed in a 0.18-um CMOS technology and operated on a 1.8-V supply voltage. The VCRO have a tuning range of 730 MHz to 1.43 GHz and good tuning linearity. Between 0 V and 1.1 V of control voltage, the gain of VCRO is around −620 MHz/V. At 900 MHz, the phase noise of the VCRO is −106.1 dBc/Hz at 600-KHz frequency offset with power consumption of 65.5 mW.     

Self-aligned SiGe NPN transistors with 285 GHz f/sub MAX/ and 207 GHz f/sub T/ in a manufacturable technology

This paper reports on SiGe NPN HBTs with unity gain cutoff frequency (f_T) of 207 GHz and an f_MAX extrapolated from Mason's unilateral gain of 285 GHz. f_MAX extrapolated from maximum available gain is 194 GHz. Transistors sized 0.12×2.5 μm² have these characteristics at a linear current of 1.0 mA/μm (8.3 mA/μm²). Smaller transistors (0.12×0.5 μm²) have an f_T of 180 GHz at 800 μA current. The devices have a pinched base sheet resistance of 2.5 kΩ/sq. and an open-base breakdown voltage BV_CEO of 1.7 V. The improved performance is a result of a new self-aligned device structure that minimizes parasitic resistance and capacitance without affecting f_T at small lateral dimensions     

A Frequency Divider Implemented With a Subharmonic Mixer and a Divide-by-Two Divider

This letter proposes a divide-by-four injection-locked frequency divider (ILFD) with the use of a subharmonic mixer and a divide-by-two frequency divider (D2FD). The D2FD circuit consists of a two-stage differential CMOS ring oscillator with n-MOS switches directly coupled to its differential outputs, the measured phase noise of the D2FD is -97 dBc/Hz at 1-MHz offset from the free running frequency of 1.08GHz. The low-voltage CMOS divide-by-four FD (D4FD) has been implemented with the UMC 0.18-mum 1P6M CMOS technology and the power consumption is 9 mW at the supply voltage of 1.2 V. At the input power of 0 dBm, the D4FD can function properly with about 330-MHz locking range from 4.15 to 4.48GHz     

A parallel structure for CMOS four-quadrant analog multipliers andits application to a 2-GHz RF downconversion mixer

A parallel structure for a CMOS four-quadrant analog multiplier is proposed and analyzed. By applying differential input signals to a set of combiners, the multiplication function can be implemented. Based on the proposed structure, a low-voltage high-performance CMOS four-quadrant analog multiplier is designed and fabricated by 0.8 μm N-well double-poly-double-metal CMOS technology. Experimental results have shown that, under a single 1.2 V supply voltage, the circuit has 0.89% linearity error and 1.1% total harmonic distortion under the maximum-scale input 500 mV_p-p at both multiplier inputs. The -3 dB bandwidth is 2.2 MHz and the DC current is 2.3 mA. By using the proposed multiplier as a mixer-core and connecting a newly designed output buffer, a CMOS RF downconversion mixer is designed and implemented by 0.5 μm single-poly-double-metal N-well CMOS technology. The experimental results have shown that, under 3 V supply voltage and 2 dBm LO power, the mixer has -1 dB conversion gain, 2.2 GHz input bandwidth, 180 MHz output bandwidth, and 22 dB noise figure. Under the LO frequency 1.9 GHz and the total DC current 21 mA, the third-order input intercept point is +7.5 dBm and the input 1 dB compression point is -9 dBm     

The impact of semiconductor technology scaling on CMOS RF and digital circuits for wireless application

The impact of CMOS technology scaling on the various radio frequency (RF) circuit components such as active, passive and digital circuits is presented. Firstly, the impact of technology scaling on the noise and linearity of the low-noise amplifier (LNA) is thoroughly analyzed. Then two new circuits, i.e., CMOS complementary parallel push-pull (CCPP) circuit and vertical-NPN (V-NPN) circuit for direct-conversion receiver (DCR), are introduced. In CCPP, the high RF performance of pMOS comparable to nMOS provides single ended differential RF signal processing capability without the use of a bulky balun. The use of parasitic V-NPN bipolar transistor, available in triple well CMOS technology, has shown to provide more than an order of magnitude improvement in 1/f noise and dc offset related problems, which have been the bottleneck for CMOS single chip integration. Then CMOS technology scaling for various passive device performances such as the inductor, varactor, MIM capacitor, and switched capacitor, is discussed. Both the forward scaling of the active devices and the inverse scaling of interconnection layer, i.e., more interconnection layers with effectively thicker total dielectric and metal layers, provide very favorable scenario for all passive devices. Finally, the impact of CMOS scaling on the various digital circuits is introduced, taking the digital modem blocks, the various digital calibration circuits, the switching RF power amplifier, and eventually the software defined radio, as examples.     

采用新的T型发射极技术的自对准InP/GaInAs单异质结双极晶体管的性能

研究了一种采用新的T型发射极技术的自对准InP/GaInAs单异质结双极晶体管.采用了U型发射极图形结构、选择性湿法腐蚀、LEU以及空气桥等技术,成功制作了U型发射极尺寸为2μm×12μm的器件.该器件的共射直流增益达到170,残余电压约为0.2V,膝点电压仅为0.5V,而击穿电压超过了2V.器件的截止频率达到85GHz,最大振荡频率为72GHz,这些特性使此类器件更适合于低压、低功耗及高频方面的应用.     

A low power 3-5 GHz CMOS UWB receiver front-end

A novel low power RF receiver front-end for 3-5 GHz UWB is presented. Designed in the 0.13μm CMOS process, the direct conversion receiver features a wideband balun-coupled noise cancelling transconductance input stage, followed by quadrature passive mixers and transimpedance loading amplifiers. Measurement results show that the receiver achieves an input return loss below-8.5 dB across the 3.1-4.7 GHz frequency range, max-imum voltage conversion gain of 27 dB, minimum noise figure of 4 dB, IIP3 of-11.5 dBm, and IIP2 of 33 dBm. Working under 1.2 V supply voltage, the receiver consumes total current of 18 mA including 10 mA by on-chip quadrature LO signal generation and buffer circuits. The chip area with pads is 1.1 × 1.5 mm2.     

Current Reusing VCO and Divide-by-Two Frequency Divider for Quadrature LO Generation

For low-power and accurate quadrature local oscillator (LO) signal generation, an LC-tank voltage controlled oscillator (VCO) operating at double the required LO-frequency reuses the bias current of divide-by-two frequency divider. The current reusing VCO and divide-by-two frequency divider are targeted to generate the LO signals for a 1.57 GHz global positioning system receiver. Implemented in a 0.18 mum CMOS technology, the current reusing VCO and divide-by-two frequency divider consumes 1.7mA from a 1.8 V supply. The measured phase noise is -120dBc/Hz at 1 MHz offset when the carrier frequency is 1.57GHz.     

60-GHz SOI CMOS traveling-wave amplifier with NF below 3.8 dB from 0.1 to 40 GHz

In this paper, the design and the results of a CMOS traveling-wave amplifier (TWA) optimized for minimum noise figure is presented. Design tradeoffs and optimization guidelines for maximum operation frequency, gain and minimum noise are discussed by means of analytical calculations and simulations. The MMIC is fabricated using digital 90-nm silicon on insulator (SOI) technology and requires a chip area of only 0.3 mm/sup 2/. At a supply voltage of 2 V and a supply current of 66 mA, a gain of 9.7 dB/spl plusmn/1.6 dB is measured over a frequency range from 10 to 59 GHz. Toward dc, the gain increases up to 16 dB. The unity gain cutoff frequency is 71 GHz. At 20 and 40 GHz, the circuit has a 1-dB output compression point of 12.5 and 9.5 dBm, respectively. From 0.1 to 40 GHz, a noise figure below 3.8 dB is measured. The results are achieved at source/load impedances of 50 /spl Omega/ and include the pad parasitics. To the author's knowledge, the TWA has by far the lowest noise figure achieved for a silicon-based amplifier with comparable bandwidth.     

A 2.4-GHz Low-Power Low-IF Receiver and Direct-Conversion Transmitter in 0.18-μm CMOS for IEEE 802.15.4 WPAN Applications

In this paper, a low-power low-IF receiver and a direct-conversion transmitter (DCT) suitable for the IEEE standard 802.15.4 radio system at the 2.4-GHz band are presented in 0.18-mum deep n-well CMOS technology. By using vertical NPN (V-NPN) bipolar junction transistors in the baseband analog circuits of the low-IF receiver, the image rejection performance is improved and the power consumption is reduced. In addition, by applying the V-NPN current mirrored technique in a DCT, the carrier leakage is reduced and the linearity performance is improved. The receiver has 10 dB of noise figure, -15 dBm of third-order input intercept point, and 35 dBc of image rejection. The transmitter has more than -2 dBm of transmit output power, -35 dBc of local oscillator leakage, and -46 dBc of the transmit third harmonic component. The receiver and transmitter dissipate 6 and 9 mA from a 1.8-V supply, respectively     

K-band low-noise amplifiers using 0.18 /spl mu/m CMOS technology

Two K-Band low-noise amplifiers (LNAs) are designed and implemented in a standard 0.18 /spl mu/m CMOS technology. The 24 GHz LNA has demonstrated a 12.86 dB gain and a 5.6 dB noise figure (NF) at 23.5 GHz. The 26 GHz LNA achieves an 8.9 dB gain at the peak gain frequency of 25.7 GHz and a 6.93 dB NF at 25 GHz. The input referred third-order intercept point (IIP3) is >+2 dBm for both LNAs with a current consumption of 30 mA from a 1.8 V power supply. To our knowledge, the LNAs show the highest operation frequencies ever reported for LNAs in a standard CMOS process.