Mechanical,electrical, and thermal expansion properties of carbon nanotube-based silver and silver-palladium alloy composites

The mechanical, electrical, and thermal expansion properties of carbon nanotube（CNT）-based silver and silver–palladium（10：1, w/w） alloy nanocomposites are reported. To tailor the properties of silver, CNTs were incorporated into a silver matrix by a modified molecular level-mixing process. CNTs interact weakly with silver because of their non-reactive nature and lack of mutual solubility. Therefore, palladium was utilized as an alloying element to improve interfacial adhesion. Comparative microstructural characterizations and property evaluations of the nanocomposites were performed. The structural characterizations revealed that decorated type-CNTs were dispersed, embedded, and anchored into the silver matrix. The experimental results indicated that the modification of the silver and silver–palladium nanocomposite with CNT resulted in increases in the hardness and Young＇s modulus along with concomitant decreases in the electrical conductivity and the coefficient of thermal expansion（CTE）. The hardness and Young＇s modulus of the nanocomposites were increased by 30%？40% whereas the CTE was decreased to 50%-60% of the CTE of silver. The significantly improved CTE and the mechanical properties of the CNT-reinforced silver and silver–palladium nanocomposites are correlated with the intriguing properties of CNTs and with good interfacial adhesion between the CNTs and silver as a result of the fabrication process and the contact action of palladium as an alloying element.     

Analytical model of elastic modulus and coefficient of thermal expansion for 2.5D C/SiC composite

To make better use of 2.5D C/SiC composites in industry, it is necessary to understand the mechanical properties. A finite element model of 2.5D composites is established, by considering the fiber undulation and the porosity in 2.5D C/SiC composites. The fiber direction of warp is defined by cosine function to simulate the undulation of warp, and based on uniform strain assumption, analytical model of the elastic modulus and coefficient of thermal expansion (CTE) for 2.5D C/SiC composites were established by using dualscale model. The result is found to correlate reasonably well with the predicted results and experimental results. The parametric study also demonstrates the effects of the fiber volume fraction, distance of warp yarn, and porosity in micro-scale on the mechanical properties and the coefficients of thermal expansion.     

青铜-聚四氟乙烯复合材料温压新工艺

填充聚四氟乙烯以其优异的性能,成为具有广泛应用前景的粒子改性复合材料,在聚四氟乙烯中加入青铜后克服了纯聚四氟乙烯的耐磨性差、热膨胀系数大等缺点,扩大了聚四氟乙烯的应用范围.填充聚四氟乙烯温压成型性能的主要工艺参数是烧结温度、烧结时间、预压压力,常规的压缩模塑成型法,周期长、性能差、表面精度和光洁度不高,本研究的温压成型工艺工序少、周期短、机械性能得到明显提高.     

原位化学合成法制备氧化锆-白榴石复相烤瓷粉的研究

以ZrO(NO3)2、Al(NO3)3和K2SiO3等为原料,采用聚乙烯醇和氨水成冻先制备成凝胶,然后通过高温烧结法原位合成氧化锆/白榴石复合烤瓷粉,并对其力学性能进行了检测。结果表明,采用“原位化学合成法”制备的复合烤瓷粉的综合性能明显优于“间接合成法”制备的复合烤瓷粉,其抗弯强度达到105.3 MPa、断裂韧性达到3.3 MPa /m1/2、金瓷结合强度达到42.1 MPa;样品中同时存在白榴石和氧化锆两种晶相,这既有利于提高烤瓷材料的力学性能,又有助于调节烤瓷材料的膨胀系数,使之与牙用镍铬合金相匹配。     

Microstructure and properties of electronic packaging shell with high silicon carbide aluminum-base composites by semi-solid thixoforming

The electronic packaging shell with high silicon carbide aluminum-base composites was prepared by semi-solid thixoforming technique. The flow characteristic of the Si C particulate was analyzed. The microstructures of different parts of the shell were observed by scanning electron microscopy and optical microscopy, and the thermophysical and mechanical properties of the shell were tested. The results show that there exists the segregation phenomenon between the Si C particulate and the liquid phase during thixoforming, the liquid phase flows from the shell, and the Si C particles accumulate at the bottom of the shell. The volume fraction of Si C decreases gradually from the bottom to the walls. Accordingly, the thermal conductivities of bottom center and walls are 178 and 164 W·m-1·K-1, the coefficients of thermal expansion（CTE） are 8.2×10-6 and 12.6×10-6 K-1, respectively. The flexural strength decreases slightly from 437 to 347 MPa. The microstructures and properties of the shell show gradient distribution.     

Microstructure and thermal properties of SiCp/Cu composites with Mo coating on SiC particles

SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/(m·K) and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.     

Effect of microstructure on the mechanical,thermal, and electronic property measurement ofceramic coatings

Ceramic materials were investigated as thermal barrier coatings and electrolytes. Electrophoretic deposition（EPD） and physical vapor deposition（PVD） were employed to fabricate samples, and the mechanical properties and microstructure were examined by nanoindentation and microscopy, respectively. Yttria-stabilized zirconia/alumina（YSZ/Al2O3） composite coatings, a candidate for thermal barrier coatings, yield a kinky, rather than smooth, load–displacement curve. Scanning electron microscope（SEM） examination reveals that the kinky curve is because of the porous microstructure and cracks are caused by the compression of the indenter. Li0.34La0.51 Ti O2.94（LLTO） on Si/Sr Ru O3（Si/SRO） substrates, an ionic conductor in nature, demonstrates electronic performance. Although SEM images show a continuous and smooth microstructure, a close examination of the microstructure by transmission electron microscopy（TEM） reveals that the observed spikes indicate electronic performance. Therefore, we can conclude that ceramic coatings could serve multiple purposes but their properties are microstructure-dependent.     

Experimental study on thermophysical properties of C/C composites at high temperature

Ablationthermalprotectivecompositesarethekeystructureofspacevehiclesprotectingthemfromaerody namicheatingduringtheirreentryintotheaerosphere.Thecarbonmatrixcompositesarethemostpromisingablationmaterialsusedinthisenvironmentduetotheirpotentiallyfavorablepr…     

Thermotics Study of the Semimetallic Nylon1010 Composite

Thermal expansion characteristics of semimetal nylon composites （nylon 1010 incorporated with metal oxides） were analyzed with thermal expansion instrument. The changes of composite weight after being heated and the heat absorption and release of the composites were analyzed by carrying out TG-DSC experiments. Experimental results show that the average thermal expansion coefficient of the composites rises as the average diameter of the metal oxides decrease from room temperature to 160 ℃. Thermal dynamics and physical properties of the nylon composites change with the addition of the oxides; the crystallization temperature rises from 180 ℃ of pure nylon to 190 ℃ （maximum） and the melting point of the oxide composites also increases continuously with the addition of the oxides. The water content of the oxide/nylon composite is related to the kind and content of the oxide. The water content reaches its maximum when the content of oxide is 10%, and the 10% Al2O3/nylon composite has a water absorption ratio up to 1%.     

竹粉高温蒸煮对竹粉/ABS木塑复合材料性能的影响

采用高温蒸煮法对竹粉的主要组分木质素与纤维素进行分离,并将其分别与ABS混合制备木塑复合材料,研究了纤维素含量不同的两种竹粉及竹粉中木质素、纤维素对竹粉/ABS木塑复合材料力学性能和热稳定性的影响。结果表明,纤维素含量高的竹粉与ABS复合制得的复合材料力学性能较好;竹粉的组分中纤维素的热稳定性优于木质素,由纤维素制备的复合材料综合力学性能较好,热稳定性较高。     

加捻纤维复合材料固化界面应力分析

含有加捻纤维束的复合材料由于固化而产生的热残余应力问题,可以用能量法获得解答。这种热残余应力可以表示为纤维、基体材料性质以及纤维束几何参数的函数。分析结果表明:加捻纤维束构成的复合材料,由于纤维适当加捻,可以大大减弱纤维与基体各具不同的热膨胀系数而产生的固化残余应力。     

Effect of Al_2O_(3np) on the Properties and Microstructure of B_4C_p/Al Composites

Aluminum-matrix boron carbide (B_4C_p/Al) is a kind of neutron absorbing material widely used in nuclear spent fuel storage.In order to improve the tensile property of B_4C_p/Al composites,a new type of nano-Al_2O_3 particle (Al_2O_(3np)) reinforced B_4C_p/Al + Al_2O_(3np) composites were prepared by powder metallurgy method.The Monte Carlo particle transport program (MCNP) was used to determine the influence of Al_2O_(3np )on the thermal neutron absorptivity of composites.The universal material testing machine and scanning electron microscope (SEM) were used to study the mechanical properties,microstructure and fracture morphology of B_4C_p/Al composites.The results indicated that the neutron absorption properties of B_4C_p/Al composites were not affected by the addition of nano-Al_2O_3 particles in the range of 1 wt%-15 wt%.The addition of Al_2O_(3np) can obviously reduce the grain size of B_4C_p/Al matrix metals thus improve the tensile strength of the composites.The addition threshold of Al_2O_(3np) is about 2.5 wt%.Both B_4C_p and Al_2O_(3np) change the fracture characteristics of the composites from toughness to brittleness,and the latter is more important.     

Spark Effect on the Densification of SiCp/Al Composites by SPS

1 IntroductionSiCp/Al composites have aroused considerable inter-ests in manyfields of industry due to their tailorable me-chanical and thermophysical properties .SiCp/Al compos-ites have been developed mainly as structural materials inapplicationfor automobile industries and aerospace indus-tries . However ,thermal management applicationsin elec-tronic packaging,such as substrates ,heat slugs and heatspreads have been focused on. Electronic componentsused in thermal management applications …     

氧化锆对白榴石基烤瓷粉性能的影响

采用两种不同方法引入氧化锆合成牙用白榴石基复合烤瓷粉。方法一是以钾长石、碳酸钾和氧化锆为主要原料,通过高温固相法一步合成烤瓷粉;方法二是先合成白榴石基烤瓷粉,然后再加入氧化锆合成烤瓷粉。利用X-射线衍射仪和扫描电镜分析烤瓷粉的物相结构;利用万能试验机测试烤瓷粉的弯曲强度;利用热膨胀仪测定烤瓷粉的热膨胀系数。结果表明,后一种方法不利于提高烤瓷粉的性能,而前一种采用一次性合成的复合烤瓷粉中,氧化锆的加入既有利于烤瓷粉的弯曲强度的提高,又有助于调节烤瓷粉的热膨胀系数。当氧化锫的添加量为8％、合成烤瓷粉的煅烧温度为1200℃、烤瓷粉的熔附温度为900℃时,样品的弯曲强度为112MPa。高温固相一步合成法具有原料成本低、制备方法简单、产品性能良好等优点。     

Determination of the Thermal Expansion Coefficient of Concrete at Early Ages by Using Temperature-stress Testing Machine

By using the uptodate temperatuer-stress testing machine, the thermal expansion coefficient of concrete at early ages was studied and indicative conclusions were achieved ： temperature rising due to hydration heat is not directly correlated with cracking, but the temperature and stress evolation process should be taken into consideration in the same time. Proper chemical admixtures and mineral cornpasitions can improve the mechanical properties of concrete such as thermal expansion coefficient, which is very indicative in practice.     

电子封装用高导热金刚石/铜复合材料的研究进展

金刚石/铜复合材料由于具有热导率高、热膨胀系数低等优异的特性,已经逐步替代传统的散热材料,成为新一代电子封装材料。近年来,价格不断下降的人造金刚石和铜这种相对价格低廉的金属结合,实现人们对电子封装材料性能优越、成本可控的要求。介绍了金刚石/铜复合材料的主要制备方法以及如何改善与提高这类材料的热导率。然而,对于当前工业化的迅猛发展以及5G时代的到来,如何实现高热导率的金刚石/铜复合材料的大规模工业生产,仍然是一个挑战。     

Behavior of oxygen in DG? invar-Cu alloys and its effects on mechanical and physical properties

The invar alloy powder, mixed with different Cu powder contained different content of oxygen, was compacted and sintered into four sorts of DG™ invar-Cu low expansion and high conductivity alloy specimens. The mechanical and physical properties of the alloys were tested and analyzed. The behavior of oxygen and its effect mechanism were discussed. The results show that the ultimate strength decreases with the increase of oxygen content, so does the coefficient of thermal expansion (α) whereas the α platform is shortened. Project supported by the Natural Science Foundation of Hunan Province Synopsis of the first author Wang Zhifa, Senior Engineer, born in 1946, specializing in electronic packing materials. His studied group developed the first W disc and the first invar-Cu plate of the country for power semiconductor devices.     

PHBV/PBAT复合阻燃材料的燃烧性能、 力学性能及流变性能研究

采用熔融共混的方法,将MMT和聚磷酸铵基阻燃剂添加到PHBV/PBAT复合材料中,研究复合阻燃材料的力学性能、流变性能以及燃烧性能。极限氧指数和垂直燃烧结果表明,聚磷酸铵基阻燃剂的添加提高了复合材料的极限氧指数,MMT的加入使得极限氧指数进一步提高,当MMT的质量分数为1%时通过了UL-94垂直燃烧V-0级别测试。结合流变性能测试与力学性能测试表明,聚磷酸铵基阻燃剂恶化了复合材料的力学性能,而MMT提高了粉体在基体材料中的分散性能,提高了复合阻燃材料的力学性能。锥形量热测试表明,MMT的加入明显降低了复合材料的热释放速率以及产烟量。     

Synergistic antiflaming of expandable graphite on the sealing silicone rubber

To study the effects of different proportions of aluminum hydroxide and expandable graphite (EG) composites on flame retardation, sealing, mechanical, electrical and other properties of RTV-1, aluminum hydroxide/ expandable graphite (ATH/EG) and silicone rubber composites were prepared by the compression molding method. The experimental results show that heat resistance improves with the increase of proportion of EG. Although the resistance coefficient changes, the composite materials still keep good electrical insulating property. Moreover, oxygen index and expansion index rise first then fall. When ATH/EG is 1:1, the oxygen index reaches the highest; the mechanical property of the silicone rubber is not affected under various environments such as acid, alkali, oily, artificial sea water environments, etc.     

Thermal expansion properties and hygroscopicity of Y2-xSmxW3O12 (x = 0.0-0.4) compounds

A novel class of solid solutions of Y2-xSmxW3O12 (x = 0.0-0.4) were synthesized and studied by means of powder X-ray diffraction. All samples crystallize in an orthorhombic space group Pnca. The lattice parameters a, b and c of Y2-xSmxW3O12 increase with increasing Sm content. Since the compounds of this series hydrate at room temperature, thermogravimetric (TG) analysis was carried out. The result shows that the compound stores less water with increasing Sm content. The thermal expansion properties of Y2-xSmxW3O12 (x = 0.1, 0.3 and 0.4) were investigated with high temperature X-ray diffraction. Negative thermal expansion coefficient -α becomes less negative from -6.644×10-6 to -6.211×10-6℃-1 when x changes from 0.1 to 0.4.