Microstructure and thermal properties of SiCp/Cu composites with Mo coating on SiC particles

SiCp/Cu composites with a compact microstructure were successfully fabricated by vacuum hot-pressing method. In order to suppress the detrimental interfacial reactions and ameliorate the interfacial bonding between copper and silicon carbide, molybdenum coating was deposited on the surface of silicon carbide by magnetron sputtering method and crystallized heat-treatment. The effects of the interfacial design on the thermo-physical properties of Si Cp/Cu composites were studied in detail. Thermal conductivity and expansion test results showed that silicon carbide particles coated with uniform and compact molybdenum coating have improved the comprehensive thermal properties of the Si Cp/Cu composites. Furthermore, the adhesion of the interface between silicon carbide and copper was significantly strengthened after molybdenum coating. Si Cp/Cu composites with a maximum thermal conductivity of 274.056 W/(m·K) and a coefficient of thermal expansion of 9 ppm/K were successfully prepared when the volume of silicon carbide was about 50%, and these Si Cp/Cu composites have potential applications for the electronic packageing of the high integration electronic devices.     

电子封装用高导热金刚石/铜复合材料的研究进展

金刚石/铜复合材料由于具有热导率高、热膨胀系数低等优异的特性,已经逐步替代传统的散热材料,成为新一代电子封装材料。近年来,价格不断下降的人造金刚石和铜这种相对价格低廉的金属结合,实现人们对电子封装材料性能优越、成本可控的要求。介绍了金刚石/铜复合材料的主要制备方法以及如何改善与提高这类材料的热导率。然而,对于当前工业化的迅猛发展以及5G时代的到来,如何实现高热导率的金刚石/铜复合材料的大规模工业生产,仍然是一个挑战。     

SiCp/Cu复合材料的热膨胀性和导热性

采用热等静压的方法制备了SiCp／Cu电子封装复合材料．材料热膨胀系数（CTE）和导热率的测定表明,增加SiC体积分数和减小SiC颗粒的尺寸有利于降低CTE值;SIC质量分数超过26％这一临界值后,材料导热率会明显下降．减小残余应力有利于降低材料的CTE值．     

Net-shape forming of composite packages with high thermal conductivity

The continuing miniaturization of electronic devices in microelectronics and semiconductors drives the development of new packaging materials with enhanced thermal conductivity to dissipate the heat generated in electronic packages. In recent years, several promising composite materials with high thermal conductivity have been developed successfully for high performance electronic equipment to replace the traditional Kovar and Cu/W or Cu/Mo alloys, such as SiCp/Al, SICp/Cu, diamond/Al and diamond/Cu. However, these materials with high content of reinforcements have not been widely used in packaging field because they are hard to be machined into complex-shaped parts due to their greater hardness and brittleness. So, it is necessary to explore a near-net shape forming technology for these composites. In this paper, a novel technology of powder injection molding-infiltration is introduced to realize the near-net shaped preparation of the composite packages with high thermal conductivity.     

Fabrication of solid-phase-sintered SiC-based composites with short carbon fibers

Solid-phase-sintered Si C-based composites with short carbon fibers（Csf/SSi C） in concentrations ranging from 0 to 10wt% were prepared by pressureless sintering at 2100°C. The phase composition, microstructure, density, and flexural strength of the composites with different Csf contents were investigated. SEM micrographs showed that the Csf distributed in the SSi C matrix homogeneously with some gaps at the fiber/matrix interfaces. The densities of the composites decreased with increasing Csf content. However, the bending strength first increased and then decreased with increasing Csf content, reaching a maximum value of 390 MPa at a Csf content of 5wt%, which was 60 MPa higher than that of SSi C because of the pull-out strengthening mechanism. Notably, Csf was graphitized and damaged during the sintering process because of the high temperature and reaction with boron derived from the sintering additive B4C; this graphitization degraded the fiber strengthening effect.     

Electric heating property from butyl rubber-loaded boron carbide composites

We researched the electric heating property from butyl rubber-loaded boron carbide composite. The effects of boron carbide content on bulk resistivity, voltage-current characteristic, thermal conductivity and thermal stability of boron carbide / butyl rubber （IIR） polymer composite were introduced. The analysis results indicated that the bulk resistivity decreased greatly with increasing boron carbide content, and when boron carbide content reached to 60%, the bulk resistivity achieved the minimum. Accordingly, electric heating behavior of the composite is strongly dependent on boron carbide content as well as applied voltage. The content of boron carbide was found to be effective in achieving high thermal conductivity in composite systems. The thermal conductivity of the composite material with added boron carbide was improved nearly 20 times than that of the pure IIR. The thermal stability test showed that, compared with pure IIR, the thermal stable time of composites was markedly extended, which indicated that the boron carbide can significantly improve the thermal stability of boron carbide / IIR composite.     

Thermal expansion and mechanical properties of middle reinforcement content SiCp/Al composites fabricated by PM technology

Middle reinforcement content SiCp/Al composites(Vp=30%, 35% and 40%) for precision optical systems applications were fabricated by powder metallurgy technology. The composites were free of porosity and SiC particles distributed uniformly in the composites. The mean linear coefficients of thermal expansion(20-100 ℃) of SiCp/Al composites ranged from 11.6×10-6 to 13.3×10-6 K-1 and decreased with an increase in volume fraction of SiC content. The experimental coeffi cients of thermal expansion agreed well with predicted values based on Kerner's model. The Brinell hardness increased from 116 to 147, and the modulus increased from 99 to 112 GPa for the corresponding composites. The tensile strengths were higher than 320 MPa, but no signifi cant increasing trend between tensile strength and SiC content was observed.     

Mechanical,electrical, and thermal expansion properties of carbon nanotube-based silver and silver-palladium alloy composites

The mechanical, electrical, and thermal expansion properties of carbon nanotube（CNT）-based silver and silver–palladium（10：1, w/w） alloy nanocomposites are reported. To tailor the properties of silver, CNTs were incorporated into a silver matrix by a modified molecular level-mixing process. CNTs interact weakly with silver because of their non-reactive nature and lack of mutual solubility. Therefore, palladium was utilized as an alloying element to improve interfacial adhesion. Comparative microstructural characterizations and property evaluations of the nanocomposites were performed. The structural characterizations revealed that decorated type-CNTs were dispersed, embedded, and anchored into the silver matrix. The experimental results indicated that the modification of the silver and silver–palladium nanocomposite with CNT resulted in increases in the hardness and Young＇s modulus along with concomitant decreases in the electrical conductivity and the coefficient of thermal expansion（CTE）. The hardness and Young＇s modulus of the nanocomposites were increased by 30%？40% whereas the CTE was decreased to 50%-60% of the CTE of silver. The significantly improved CTE and the mechanical properties of the CNT-reinforced silver and silver–palladium nanocomposites are correlated with the intriguing properties of CNTs and with good interfacial adhesion between the CNTs and silver as a result of the fabrication process and the contact action of palladium as an alloying element.     

Experimental study on thermophysical properties of C/C composites at high temperature

Ablationthermalprotectivecompositesarethekeystructureofspacevehiclesprotectingthemfromaerody namicheatingduringtheirreentryintotheaerosphere.Thecarbonmatrixcompositesarethemostpromisingablationmaterialsusedinthisenvironmentduetotheirpotentiallyfavorablepr…     

底充胶导热系数预测及对倒装焊温度场的影响

根据导热的基本理论和Haiying Li的研究数据拟合出填加了碳纤维、Silica的环氧树脂封装材料的导热系数预测公式，依此公式可预测出相关复合材料的导热系数．利用有限元方法对电子封装倒装焊中不同导热系数的底充胶材料对温度场的影响进行了分析比较．表明高导热系数的底充胶可明显降低在芯片和基板之间的温度差，降低底充胶的热应力，进而提高电子封装的可靠性．     

离子喷涂W-Cu电子封装材料的组织与性能

采用等离子喷涂工艺制备了W Cu电子封装材料，并对该电子封装材料的微观组织和热物理性能进行了研究. 结果表明，在内部送粉条件下，复合材料中钨的收得率要高于外部送粉条件下复合材料中钨的收得率；在内部送粉条件下，功率对铜氧化的影响并不明显；而在外部送粉条件下，随着功率的提高，铜的氧化明显增多；由于氧化物和孔隙等的存在，利用大气等离子喷涂工艺制备的复合材料的导热率远远低于根据混合法则计算的理论值. 这为后续实验研究提供了重要的参考依据.     

纤维体积分数对单向C/C复合材料导热系数的影响

采用无维布叠层的方式获得不同纤维体积分数的单向长炭纤维预制体,以化学气相渗透(CVI)增密技术制备了单向C/C复合材料.讨论了C/C复合材料的导热机理以及纤维体积分数对单向C/C复合材料导热系数的影响.研究表明,材料沿纤维方向的导热系数约为垂直纤维方向的10倍;材料沿纤维方向的导热系数在不同热处理温度下都随纤维体积分数的增加而增加,而材料垂直纤维方向的导热系数在低热处理温度下随纤维体积分数的提高而略增,但在高热处理温度下随纤维体积分数的提高先增加再降低.     

SiCp/Cu复合材料热膨胀性能研究

以电子封装基片为应用背景,采用挤压铸造方法制备了体积分数为55％,不同颗粒粒径增强的SiCp／Cu复合材料,并分析测试了颗粒粒径和热处理状态对材料热膨胀性能的影响规律．显微组织观察表明,复合材料颗粒分布均匀,材料组织致密;热膨胀性能测试表明,随着温度升高,复合材料的热膨胀系数呈非线性增加;SiC体积分数相同时,减小SiC颗粒尺寸有利于降低复合材料的热膨胀系数;退火处理可以减小基体中的热残余应力,有助于降低复合材料的热膨胀系数．     

模拟钛合金TC4表面复合铝基碳化硅材料的研究

在钛合金表面复合一层铝基碳化硅材料,可以获得一种兼顾钛合金及铝基碳化硅材料性能优势的新型复合材料,为提高复合件的质量,通过模拟仿真,获得复合的数据。为确保数据的准确性,将测试的钛合金及铝基碳化硅材料热膨胀系数作为参数导入仿真,观察影响钛合金及铝基碳化硅材料复合的主要因素在于两者的热膨胀系数的差异,这一差异可以通过调整钛合金或铝基碳化硅材料的成分获得改善,这为分析钛合金及铝基碳化硅材料复合件的质量提供了指导。     

用于降低接触热阻的复合黏结材料的制备优化

基于提高吸附床的导热性能,研制一种可涂于吸附床与吸附剂之间降低接触热阻的耐高温耐腐蚀的高导热复合黏结材料。通过稳态试验研究导热填料、稀释剂与偶联剂等因素对复合黏结材料热导率的影响,采用正交试验方法优化复合黏结材料的配制方案。研究结果表明:复合黏结材料的导热性能随着Al₂O₃导热填料的质量分数的增加而提高,采用10 μm Al₂O₃导热填料粒子的导热性能略高于采用35 μm Al₂O₃导热填料粒子的复合黏结材料,10 μm Al₂O₃导热填料粒子用质量分数8%的偶联剂处理,复合黏结材料的热导率最高。采用适当配比的导热填料、稀释剂与偶联剂能显著提高复合黏结材料的热导率。     

Effects of Microstructure Modification on Properties of AIN/BN Composites

It is very difficult to prepare full-densified aluminum nitride-boron nitride(AIN/BN)composite ceramics with homogeneous microstructure and high thermal conductivity.Spark plasma sintering(SPS)was used to fully densify the AIN/BN composites in this work.Microstructure,mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated.The results show that the microstructure of composites is fine and homogenous,and the AIN/BN composites exhibit high mechanical properties.To promote the growth of AIN grains and modify the distribution of grain boundary in AIN/BN composites,a heat treating methodology was introduced through gas pressure sintering(GPS).This processing was significantly beneficial to enhancing the thermal conductivity of the specimen.The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.     

Effects of Mierostructure Modification on Properties of MN/BN Composites

It is very difficult to prepare full-densified aluminum nitride-boron nitride(AIN/BN) composite ceramics with homogeneous microstructure and high thermal conductivity.Spark plasma sintering (SPS)was used to fully densify the AlN/BN composites in this work.Microstructure,mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated.The results show that the microstructure of composites is fine and homogenous,and the AIN/BN composites exhibit high mechanical properties.To promote the growth of AlN grains and modify the distribution of grain boundary in AIN/BN composites,a heat treating methodology was introduced through gas pressure sintering(GPS).This processing was significantly beneficial to enhancing the thermal conductivity of the specimen.The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.     

Effects of thermal transport properties on temperature distribution within silicon wafer

A combined conduction and radiation heat transfer model was used to simulate the heat transfer within wafer and investigate the effect of thermal transport properties on temperature non-uniformity within wafer surface. It is found that the increased conductivities in both doped and undoped regions help reduce the temperature difference across the wafer surface. However, the doped layer conductivity has little effect on the overall temperature distribution and difference. The temperature level and difference on the top surface drop suddenly when absorption coefficient changes from 104 to 103 m-1. When the absorption coefficient is less or equal to 103 m-1, the temperature level and difference do not change much. The emissivity has the dominant effect on the top surface temperature level and difference. Higher surface emissivity can easily increase the temperature level of the wafer surface. After using the improved property data, the overall temperature level reduces by about 200 K from the basis case. The results will help improve the current understanding of the energy transport in the rapid thermal processing and the wafer temperature monitor and control level.     

Spark Effect on the Densification of SiCp/Al Composites by SPS

1 IntroductionSiCp/Al composites have aroused considerable inter-ests in manyfields of industry due to their tailorable me-chanical and thermophysical properties .SiCp/Al compos-ites have been developed mainly as structural materials inapplicationfor automobile industries and aerospace indus-tries . However ,thermal management applicationsin elec-tronic packaging,such as substrates ,heat slugs and heatspreads have been focused on. Electronic componentsused in thermal management applications …     

Effects of microstructure modification on properties of AlN/BN composites

It is very difficult to prepare full-densified aluminum nitride-boron nitride （AIN/BN） composite ceramics with homogeneous microstructure and high thermal conductivity. Spark plasma sintering （SPS） was used to fully densify the AIN/BN composites in this work. Microstructure, mechanical properties and thermal conductivity of the SPS sintered AIN/BN composites with 5-30 vol% BN were investigated. The results show that the microstructure of composites is fine and homogenous, and the AIN/BN composites exhibit high mechanical properties. To promote the growth of AIN grains and modify the distribution of grain boundary in AIN/BN composites, a heat treating methodology was introduced through gas pressure sintering （GPS）. This processing was significantly beneficial to enhancing the thermal conductivity of the specimen. The thermal conductivity of AIN/BN composites with 5-30 vol% BN reached 60 W/m K after the samples were treated by GPS.