TiZrNiCu钎料真空钎焊TZM合金接头界面组织及力学性能

采用Ti-Zr-Ni-Cu非晶钎料箔实现了TZM合金的真空钎焊连接,研究了钎焊温度和保温时间对接头界面微观组织结构及力学性能的影响。通过扫描电镜(SEM)、能谱仪(EDS)分析了接头界面组织及物相成分、确定接头的断裂位置和断裂方式,通过X射线衍射仪(XRD)分析确定接头中存在的物相。研究结果表明:接头典型界面组织为TZM/Ti-Mo固溶体+(Ti,Zr)2(Ni,Cu)/TZM,随着钎焊温度或保温时间的增加,钎缝中Ti-Mo固溶体的含量增加,(Ti,Zr)2(Ni,Cu)相含量减少,且Ti-Mo固溶体中Mo元素的原子比例增加,钎缝与母材连接界面处、母材中的裂纹状结构含量增加。随钎焊温度或保温时间的增加,接头剪切强度先增大后减小,当钎焊温度1020℃,保温时间20 min时,接头具有最大剪切强度105 MPa。断口分析表明,断裂位置为钎缝与母材连接界面,断裂方式为解理断裂兼部分沿晶断裂。     

TiZrNiCu钎料钎焊TZM合金与ZrC_p-W复合材料界面组织与性能

采用TiZrNiCu非晶钎料实现了TZM合金与ZrC_p-W复合材料的真空钎焊连接,通过扫描电镜(SEM)、能谱仪(EDS)及X射线衍射(XRD)等方法分析了接头界面的微观组织结构、生成产物及钎焊温度对界面组织及接头性能的影响,确定了接头的断裂位置和断裂方式。研究结果表明:钎焊接头的典型界面结构为TZM/Mo(s,s)+Ti(s,s)+(Ti,Zr)_2(Ni,Cu)/Ti(s,s)+(Ti,Zr)_2(Ni,Cu)/(Ti,Zr)_2(Ni,Cu)/ZrC_pW。随钎焊温度升高,TZM一侧扩散层逐渐变宽,其内部的线状条纹变多、增宽,而钎缝逐渐变窄,靠近ZrC_p-W一侧反应层宽度变化不大,钎料向TZM一侧扩散增快、Mo及W颗粒向钎料中的溶解加快。接头的抗剪强度随钎焊温度升高先升高后降低,当钎焊温度为1020℃、保温10 min时,接头获得最大抗剪强度为121 MPa。断口分析表明,断裂位置位于TZM母材与钎缝之间的反应层,断裂方式为脆性断裂。     

Ni元素对Al-Si-Cu基真空钎焊料接头性能的影响

研究了添加Ni的Al-Si-Cu基钎料真空钎焊LF21铝合金接头的力学性能、微观组织形貌.结果表明,采用添加Ni元素的真空钎料,可提高钎焊接头的剪切强度,其机制在于Ni元素能够改善LF21铝合金真空钎焊接头焊缝及其基体组织的分布.但随着Ni元素含量的增加,其钎料的熔点也有所提高.     

SiC纤维增强SiC陶瓷基复合材料与40Cr钢的连接

采用Ag-Cu-Ti钎料对化学气相渗积方法制造的SiC纤维增强SiC陶瓷基复合材料与40Cr钢进行了真空钎焊。对接头的微观组织进行了观察，研究了不同钎料厚度及中间层对接头的影响。结果表明，利用Ag-Cu-Ti钎料可以实现二者的连接；中间层Cu以及钎料中的Ti、Ag、Cu有利于提高连接强度；不同钎料厚度影响连接强度，加两层钎料时，接头具有最高室温强度。     

Ti-25Cu-15Ni钎料钎焊的TA0钛接头界面微观组织及拉伸性能

采用真空电弧熔炼法制备钛基钎料Ti-25Cu-15Ni(at.%),通过DSC、SEM和XRD分析确认该钎料的焊接温度和微观组织结构及形貌。采用该钎料钎焊工业纯钛TA0,并分析焊接接头的微观组织结构。结果表明,该钎料主要由α-Ti和Ti2Cu共晶组织构成,在1 000℃焊接温度下,在钎料/焊接母材接头界面,有大量的Ti2Cu和TiNi化合物形成。同时,在靠近母材部分存在α-Ti+TiNi共晶组织,Ni元素扩散到钛合金母材中形成针状TiNi化合物,有利于连接强度的提高。测试了在1 000℃下的不同保温时间对试样拉伸强度的影响,结果表明,1 000℃下保温30 min制备的连接件最大拉伸强度为185.65 MPa。     

Ti-Ni-Nb钎料钎焊βNb-Ti合金接头的微观组织及力学性能

采用65Ti-25Ni-10Nb (%,质量分数)钎料对体心立方结构的βNb-Ti固溶体合金进行钎焊,研究了钎焊条件对接头微观组织和力学性能的影响规律。研究发现,接头焊缝组织主要由{(Nb,Ti)+TiNi}共晶组织、(Nb,Ti)固溶体相、 TiNi相、 Ti_2Ni相和富Ti相组成。随着钎焊温度的升高和钎焊时间的延长,钎焊过程中钎料和基体中的合金元素发生互扩散,焊缝组织中的{(Nb, Ti)+TiNi}共晶组织和TiNi相逐向Ti_2Ni相转变,并在Ti_2Ni相内部逐渐析出富Ti相。同时,基体中的其他合金元素如Al, V和Cr元素向钎料中扩散。随钎焊温度的升高或保温时间的延长,钎焊接头的剪切强度呈先增加后降低的趋势。这主要是由于Ti_2Ni相具有较高的剪切模量,其含量的增加使钎焊接头的剪切强度增加,但随后Ti_2Ni相内部析出富Ti相使焊缝内应力增加,导致钎焊接头的剪切强度迅速降低。在1150℃钎焊15 min时, 65Ti-25Ni-10Nb/Nb-Ti钎焊接头的室温剪切强度可达到617.7 MPa。     

CoFeCrNiCu高熵钎料钎焊ZrB2-SiC/Nb接头组织及性能研究

采用CoFeCrNiCu高熵合金钎料实现了ZrB₂-SiC陶瓷与Nb合金的有效连接。通过扫描电镜(SEM)、能谱仪(EDS)及X射线衍射(XRD)等方法分析了接头界面的微观组织结构、生成产物及保温时间对界面组织及接头性能的影响,确定了接头的断裂位置和断裂方式。研究结果表明：钎焊接头的典型界面结构为ZrB₂-SiC/Cr₂B/(Cr,Fe)₂B+fcc+Cr₂B+Laves+Cu₍(s,s))/Nb。钎焊过程中,Nb合金向液态钎料中的溶解量以及液态钎料中Cr向ZrB₂-SiC陶瓷富集的数量决定了钎焊接头界面组织的形成及其演化。随着保温时间的延长,ZrB₂-SiC陶瓷侧的Cr₂B反应层增厚,钎缝中Laves相随着Nb合金向液态钎料中的溶解量增加而增加。陶瓷侧界面反应层的厚度及形态和钎缝中Laves相的形态及分布共同决定着接头的抗剪强度。当钎焊温度为1160℃,保温60 min时,接头的抗剪强度最...     

SiCf/SiC与GH5188钎焊接头的界面产物及机制研究

使用CuTi+NbB₂活性钎料成功实现了碳化硅纤维增强碳化硅(SiC_f/SiC)复合材料与GH5188钴基高温合金二者的连接，研究了钎焊温度对接头界面微观组织以及力学性能的影响，并对连接机制展开了分析。接头典型的界面结构为GH5188/Cu+(Ni,Co,Cu)₃Ti₂₊(Co,Ni,Cu)Ti₂/Cu₄Ti/Cu+Cu₃Ti₂+(Ni,Co)-Si+(Ni,Co,Cu)Ti₂/TiC+Cr-C/SiC+Cu/SiC_f/SiC。由于NbB₂粉末的引入，导致形核点的增加，金属间化合物倾向于以小颗粒相的形态析出并弥散分布在钎缝中。而随着温度的升高，金属的溶解情况以及元素的互扩散以及反应情况均有所加强，但温度的改变基本上不改变各层的占比；同时，陶瓷侧的补充活性元素(Co,Cr,Ni)随着温度而增多，这在一定程度上有利于陶瓷与焊缝之间的连接。因此，在105...     

Ti（C,N）—Mo2C—Ni金属陶瓷的微观组织研究

本文用电子探针等对Ti（C,N）-Mo_2C-Ni的微观组织进行了分析。结果表明:其显微组织是不均匀的。对于Ti（C,N）陶瓷颗粒有固溶Mo、无固溶Mo及有周边组织SS相;某些区域Ni与Ti（C,N）有成分过渡;部分Mo还固溶于Ni中,但未见Mo_2C颗粒。关于Mo_2C的行为与机理有待于更进一步的研究。     

无熔剂钎焊钛导管的可行性研究

在俄罗斯用钛合金焊料（BПP16，BПP28），铜焊料（接触一反应针焊）和银焊料（BПP15）在真空中或氨中，实现了钛合金装配部件的高温针焊。但在较高的温度（高于90℃）下针焊，易发生晶粒长大，从而导致工作性能降低。在较低温度下采用银基焊料（ПCP72）针焊。为了防止基本材料与针焊料之间形成化合物，通常需用电镀方法加以保护，明显增加了钛装配部件钎焊的工作量。此工艺也很少用于针焊钛合金导管。用含有4．8％Si，3．8％Cu，0．2％Fe，0．2％Ni的铝基焊料，在真空度为133X10－5Pa的真空炉中，实现了钛合金装配部件的钎焊。加…     

Microstructural Evolution of Brazed CP-Ti Using the Clad Ti-20Zr-20Cu-20Ni Foil

Microstructural evolution of the clad Ti-20Zr-20Cu-20Ni foil brazed CP-Ti alloy has been investigated. For the specimen furnace brazed below 1143?K (870???C), the joint is dominated by coarse eutectic and fine eutectoid structures. Increasing the brazing temperature above 1163?K (890???C) results in disappearance of coarse eutectic structure, and the joint is mainly comprised of a fine eutectoid of (Ti,Zr)₂Ni, Ti₂Cu, Ti₂Ni, and ??-Ti.     

微量Sc、Zr和Er对5182铝合金焊缝组织与性能的影响

在ER5356铝合金焊丝中添加了微量的Sc、Zr和Er,制备出微合金化ER5356铝合金焊丝.使用微合金化焊丝焊接4 mm厚的5182铝合金板材,焊接采用手工钨极惰性气体保护焊.利用金相显微镜,X射线衍射以及透射电镜研究了微量的Sc、Zr和Er对5182铝合金焊缝处显微组织的影响.结果表明,在ER5356铝合金焊丝中添加的Sc、Zr和Er可以有效改善5182铝合金板材焊后焊缝处的显微组织,显著细化组织晶粒.其中,ER5356铝合金焊丝中单独添加0.3%Sc焊后效果最佳.     

Microstructural Evolution of the Interface Between Pure Titanium and Low Melting Point Zr-Ti-Ni(Cu) Filler Metals

Low melting point Zr-based filler metals with melting point depressants (MPDs) such as Cu and Ni elements are used for titanium brazing. However, the phase transition of the filler metals in the titanium joint needs to be explained, since the main element of Zr in the filler metals differs from that of the parent titanium alloys. In addition, since the MPDs easily form brittle intermetallics, that deteriorate joint properties, the phase evolution they cause needs to be studied. Zr-based filler metals having Cu content from 0 to 12 at. pct and Ni content from 12 to 24 at. pct with a melting temperature range of 1062 K to 1082 K (789 °C to 809 °C) were wetting-tested on a titanium plate to investigate the phase transformation and evolution at the interface between the titanium plate and the filler metals. In the interface, the alloys system with Zr, Zr₂Ni, and (Ti,Zr)₂Ni phases was easily changed to a Ti-based alloy system with Ti, Ti₂Ni, and (Ti,Zr)₂Ni phases, by the local melting of parent titanium. The dissolution depths of the parent metal were increased with increasing Ni content in the filler metals because Ni has a faster diffusion rate than Cu. Instead, slow diffusion of Cu into titanium substrate leads to the accumulation of Cu at the molten zone of the interface, which could form undesirable Ti _x Cu _y intermetallics. This study confirmed that Zr-based filler metals are compatible with the parent titanium metal with the minimum content of MPDs.     

Cu-9.5Ni-2.3Sn-0.15Si合金组织与性能研究

研究了在Cu-9.5Ni-2.3Sn合金中添加质量分数为0.15%的Si后对该合金铸态及时效态微观组织、电导率和硬度的影响.结果表明:添加0.15%的Si后,合金出现发达的树枝状晶体,且有Ni_2Si、Ni_3Si、Ni_3Sn和Ni_4Sn相出现.经400℃×4 h时效处理后,Ni_2Si、Ni_3Si相的析出使得合金得到强化.合金电导率随时效时间的延长和温度的提高而升高,硬度在时效初期随时效温度的提高和时效时间的延长而提高,在430℃时效2 h和在400℃时效8 h得到峰值,较佳时效工艺为400℃×8 h.     

Interfacial phenomena and joint strength in resistance microwelding of crossed Au-plated Ni wires

Resistance microwelding (RMW) of crossed Au-plated Ni wires has been performed at welding currents from 250 to 800 A and welding times from 1 to 80 ms under 4-kg welding force. The interfacial phenomena and the joint breaking force were investigated using an optical microscope (OM), a scanning electron microscope (SEM), an energy-dispersive X-ray (EDX) spectroscope, and a tensile-shear test. The results showed that mechanisms of joint formation involve brazing at low welding current, brazing and solidstate bonding at medium welding current, and solid-state bonding and fusion welding at high welding current. The joint breaking force first increased with increasing welding current, and after reaching a peak value, subsequently decreased due to recrystallization and softening of the Ni wire. With Au plating on the wire surfaces, the joint breaking force was remarkably improved. Comparisons among the RMW of Au-plated Ni wires, Au-plated Ni sheets, and bare Ni wires are also discussed.     

Ag-28Cu钎焊TiNiSMA接头的微观组织特征

为充分发挥SMA的高阻尼特性,制作高性能的新型阻尼器,本文开展了TiNiSMA的钎焊制备及其性能研究。研究结果表明:焊接接头的界面组织主要为a-Ti+Ti2Cu(TiCu2及Ti(Ni,Cu))+Ag一次固溶体+Ag-Cu共晶。随着钎焊温度的不断升高,焊缝尺寸不断减小。钎焊温度为870℃时,连接层与母材界面以小型锯齿状结合,而生成的Ti2Cu相对形状记忆效应有利,组织致密。     

感应钎焊工艺对黄铜接头组织的影响

研究了感应钎焊时 ,不同钎焊参数对零件内外表面温度的影响 ,分析了钎焊工艺参数对母材组织和接头质量的影响。缓慢升温可使工件内外表面温度达到平衡 ,钎焊温度在 780℃以下 ,保温时间小于 2 0s的工艺参数可获得优良钎缝和不损伤母材组织。     

Infrared brazing of Ti-6Al-4V and 17-4 PH stainless steel with a nickel barrier layer

Infrared brazing of Ti-6Al-4V and 17-4 PH stainless steel using the BAg-8 filler metal was performed in this study. A nickel barrier layer 10 μm thick was introduced on the 17-4 PH stainless steel before infrared brazing. For the specimen that was infrared brazed at 800 °C and 850 °C for less than 300 seconds, the Ni layer served as an effective barrier layer to prevent the formation of Ti-Fe intermetallics. Experimental results show that the average shear strength of the joint can be greatly improved for the specimen by Ni plating. Comparing the specimens with and without electroless-plated Ni film, the former has no Ti-Fe intermetallic compound, but interfacial CuNiTi and NiPTi phases are observed in the latter. The fractured location of the joint after the shear test is changed from the interfacial TiFe (without Ni plating) into the TiCu reaction layer (with Ni plating). The plated Ni layer is consumed for the specimen that was infrared brazed at 880 °C for 300 seconds, and its bonding strength is impaired. Consequently, a lower brazing temperature and/or time are still preferred even though a plated Ni barrier layer is applied.     

Brazing of hot isostatically pressed-Al<Subscript>2</Subscript>O<Subscript>3</Subscript> to stainless steel (AlSl 304L) by Mo-Mn route using 72Ag-28Cu braze

Joining of stainless steel (AISI 304L) to hot isostatically pressed alumina (HIP-Al₂O₃) using the brazing alloy 72Ag-28Cu was investigated. The microstructural characterization at various stages of joining, including metallization, annealing of overlaid Ni coating, and brazing, was comprehensively evaluated. The interface structure and the growth of phases were analyzed with optical microscope, scanning electron microscope, and electron probe microanalyzer (EPMA). Additionally, the leak tightness of these joints was assessed using a He-leak detector. Experimental results indicated the development of the manganese aluminate spinel (MnAl₂O₄) layer at the metallizing stage, which penetrated into HIP-Al₂O₃. The Ni overlaid coating further resulted in the formation of the Ni(Mo) solid solution layer followed by the Mo-rich phase. During the solid-state reaction and subsequent brazing cycle, the growth of the spinel layer close to HIP-Al₂O₃ was not adversely affected. The microstructure of the brazed joint was complex. It showed a eutectic structure within the brazed zone and a thin layer of Mo-rich, Ni-rich phases close to HIP-Al₂O₃. Increasing the brazing time resulted in the excessive growth of the thin layer that seriously affected the leak tightness of the joint.