基于非线性双路光耦的光耦放大器频响分析

频率响应是光电耦合隔离放大器的一个重要参数。首先介绍了光敏三极管光电导工作模式和集成运放宏模型,然后利用该原理对使用双路光耦设计的线性光耦隔离放大器电路进行了深入研究,分析并推导了电路频响的计算公式。对该电路的频响与电路中元件参数的关系进行了仿真和实验,最终得出结论。     

低功耗准线性CMOS光电耦合放大器

设计了一款CMOS光电耦合隔离放大器(简称光电耦合放大器),其中输入放大器采用"套筒式"共源一共栅CMOS运放A1,输出放大器选用两级共源一共源CMOS运放A2,A1的输出信号经过两个光电耦合器反馈到输入回路,且A1、A2分别引入负反馈.此外,还采取了其他的改进措施.实验结果表明,与BiCMOS光电耦合放大器相比,所设计的CMOS光电耦舍放大器的±3 dB带宽约增加14 kHz,功耗降低5.46 mW,增益线性度提高到5.9×10-5,因而特别适合于高线性度、低功耗的光电信号处理和智能检测系统中.     

光耦合线性隔离放大器ISO1OO及其应用

隔离放大器是输入端与输出端没有电气联系的放大器.光耦合隔离放大器利用LED与光电二极管传递信号而保证电气绝缘.本文分析了Burr-Brown公司生产的ISO100的性能、工作原理和各种电路形式,介绍了调整方法和使用注意事项,并给出了它的几个应用电路实例.     

MCU在显示器控制中的应用

隔离放大器是输入端与输出端没有电气联系的放大器.光耦合隔离放大器利用LED与光电二极管传递信号而保证电气绝缘.本文分析了Burr-Brown公司生产的ISO100的性能、工作原理和各种电路形式,介绍了调整方法和使用注意事项,并给出了它的几个应用电路实例.     

一种BiCMOS光电耦合隔离放大器的设计

设计了一种BiCMOS光隔离放大器,给出了其中两个运算放大器的设计电路.设计过程中只在推拉式输出级配置两个双极型晶体管(BJT),而在电路的其余部分则设置CMOS器件.为了提高放大器的增益线性度和稳定性,光电耦合部分和各运放中都引入了负反馈,并采取了优选元器件参数和提速等措施.实验结果表明所设计光隔离放大器的±3 dB带宽比双极型光隔离放大器ISO100增加了约20 kHz,当电源电压为8.6 V时,时延-功耗积比ISO100降低了约17.7 pJ,增益线性度提高到5.5×10-5,因此特别适用于高速通信系统中.     

光电线性隔离放大器的电离辐照特性

阐述了线性隔离放大器(线性光电耦合器)的工作原理,设计了线性隔离放大器的电离辐照试验,研究了线性隔离放大器的电离辐照效应,针对其结果进行了机理分析。     

线性光电耦合隔离放大器的分析及应用

本文从解决数据采集系统中模拟量的隔离问题入手,提高传输精度为关键,按反馈方式和运放接法对三种不同的放大器进行了理论分析和性能的讨论。最后给出实测结果以及一个简单、实用、精度可达±0.2％的线性光电耦合隔离放大电路。     

变压器耦合隔离放大器3656的原理及应用

隔离放大器是一种输入电路和输出电路之间电气绝缘的放大器,一般采用变压器或光耦合传递信号,在工业控制、信号测量和医疗器械等各个方面获得了广泛应用。本文介绍了Burr-Brown公司生产的变压器耦合集成隔离放大器3656的工作原理,使用和调试方法,以及它在心电图（ECG）仪和其它方面的应用。     

线性光电隔离电路的设计

光电隔离是数据采集和控制系统抗干扰的一项重要措施,由于光电耦合器件的非线性,对模拟量的光电隔离会带来较大信号失真。为了提高光电隔离电路的线性度,采用负反馈方法把光耦器件的输出电流反馈输入端。进行光电隔离电路的静态特性试验。试验结果表明：当输入信号在0～5 V时,光电隔离电路的输出失真最大为27 mV,线性度为0.014%。     

光电耦合器的发展及应用

半导体光电耦合器现已发展成为一类特殊的半导体隔离器件。它体积小、寿命长、无触点、抗干扰、能隔离，并且有单向信号传输和容易连接等功能。文中介绍了光电耦合器的典型结构和特点以及国内外的发展现状，最后给出了半导休光电隔离耦合器件的多种应用电路实例。     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.     

Analysis of error performance on Turbo coded FDPIM

Due to variable symbol length of digital pulse interval modulation（DPIM）, it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation（FDPIM） method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.     

A method for calculating the center position of collimated light

It is a key problem to accurately calculate beam spots＇ center of measuring the warp by using a collimated laser. A new method, named double geometrical center method （DGCM）, is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device （CCD） is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What＇s more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.