共查询到17条相似文献,搜索用时 211 毫秒
1.
采用悬滴法测量了3种无铅钎料合金(Sn-3.0Ag-0.5Cu、Sn-0.7Cu与Sn-9.0Zn)在260℃时的表面张力,分别为525.5,534.8和595.4 mN/m;同时采用座滴法测量了其在260℃熔融状态下与Cu基板的接触角,分别为24.5°、28.0°和102.5°,并且与传统Sn-37.0Pb钎料进行了比较研究。结果表明,无铅钎料合金的表面张力与接触角均大于Sn-37.0Pb钎料。结合Young-Dupre公式讨论了钎料合金表面张力与其润湿性能的相关性,认为Sn基钎料合金在Cu基板上的润湿性能主要取决于其表面张力。 相似文献
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无铅电子钎料合金蠕变性能研究 总被引:7,自引:0,他引:7
设计制作了一种简单可靠的弯折蠕变测量装置,比较了两种无铅电子钎料合金Sn-9Zn和Sn-3.5Cu-0.7Ag与传统电子钎料合金Sn-40Pb的常温蠕变性能,以及冷却条件对其蠕变强度的影响。结果表明:两种无铅钎料的抗蠕变性能大大优于传统锡铅钎料;Sn-3.5Ag-0.7Cu合金的抗蠕变性能优于Sn-9Zn合金;冷却速率对Sn-9Zn合金和Sn-3.5Ag-0.7Cu合金组织的影响类似,然而对蠕变强度的影响却相反:水冷使两种合金的组织相对于空冷都明显细化,Sn-9Zn合金的蠕变强度因之降低,而Sn-3.5Ag-0.7Cu合金的蠕变强度却因之提高。对可能产生的原因进行了讨论。 相似文献
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Sn-Cu、Sn-Ag-Cu系无铅钎料的钎焊特性研究 总被引:17,自引:5,他引:12
制备了Sn-0.7Cu、Sn-3.5Ag-0.6Cu钎料,用润湿平衡法测量了钎料对铜的润湿曲线,研究了温度、钎剂活性、钎焊时间对润湿行为的影响,并与Sn-37Pb钎料进行了比较。结果表明:升高温度能显著改善无铅钎料对铜的钎焊性。当温度<270℃时,Sn-0.7Cu的钎焊性明显低于Sn-3.5Ag-0.6Cu钎料;而当温度≥270℃时,两种钎料对铜都会显示较好的润湿性,而Sn-0.7Cu略优于Sn-3.5Ag-0.6Cu钎料。提高钎剂活性能显著增强钎料对铜的润湿性,其卤素离子的最佳质量分数均为0.4%左右。随着浸渍时间的延长,熔融钎料与铜的界面间产生失润现象。无铅钎料的熔点和表面张力较高,是钎焊性较差的根本原因。 相似文献
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稀土改性的Sn-58Bi低温无铅钎料 总被引:1,自引:0,他引:1
研究了微量稀土对Sn-58Bi低温钎料的改性作用.试验添加质量分数为0.1 ?组混合稀土的无铅材料,并对比Sn-58Bi和Sn-58Bi0.5Ag合金.观察了钎料显微组织的变化并做了定量分析,采用DSC测试了钎料的熔化温度,同时测量了钎料的润湿性能、接头强度与硬度.结果表明,微量稀土添加细化了Sn-58Bi钎料合金的显微组织,对钎料的熔化温度几乎没有影响,能显著改善Sn-58Bi钎料的润湿性能和接头剪切强度,而且改善的程度优于添加微量Ag对Sn-58Bi钎料的作用. 相似文献
7.
为了提高Sn9Zn共晶钎料的钎焊性能,通过合金化的方法添加了少量元素In,制备了Sn9Zn-xIn钎料。从钎料合金的熔化特性、润湿特性、界面显微结构和母材粗糙度这四个方面评价了不同In含量对Sn9Zn钎料润湿性能的影响。试验结果表明:少量元素In的添加可以降低钎料的熔点;随着In含量的增加,钎料的润湿力增大,润湿时间缩短,润湿性有明显提高;In含量增加,润湿界面层中Cu5Zn8化合物层厚度增加;对母材表面进行毛化处理,通过改变母材表面的微观几何结构,增大钎料与母材的相对接触面积,从而改善钎料的润湿性能。 相似文献
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《电子元件与材料》2017,(11):60-67
通过扫描电镜(SEM)等手段研究了Sn-9Zn/Cu在不同浸焊时间与时效时间等条件下的界面反应及其金属间化合物(IMC)生长行为。结果表明:在浸焊后,Sn-9Zn/Cu钎焊接头界面形成了扇贝状的界面化合物Cu5Zn8,IMC层厚度随着浸焊时间与时效处理时间的增加而增加,未时效处理的焊点界面IMC与铜基板接触的一面较为平直,而与钎料接触的一侧呈现出锯齿状,随着时效时间的增加,界面变得越来越不平整;另外在IMC层与焊料之间产生裂缝现象,分析认为是由于钎料与IMC之间的热膨胀系数差异导致热应力形成裂缝。浸焊600 s后的试样在时效15 d后IMC层与Cu基板接触侧产生了与初始金属间化合物Cu5Zn8不同的三元化合物Cu6(Sn,Zn)5。 相似文献
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通过在Sn-3Ag-0.5Cu钎料中添加不同含量的Ga,并采用差示扫描量热法(DSC)、万能试验机测试方法配制合金材料的熔化特性曲线、力学性能、金相结构、焊接润湿扩展率等性质,研究Ga含量对Sn-3Ag-0.5Cu钎料的熔化过程、焊接润湿扩展性以及组织和力学性能方面的影响。结果表明,Sn-3Ag-0.5Cu钎料中加入Ga元素以后,随着Ga增加,钎料的熔点显著降低,熔程也逐渐增大;适量的Ga元素可以改善Sn-3Ag-0.5Cu钎料的润湿性能;当Ga元素的添加量质量分数达到0.5%时,Sn-3Ag-0.5Cu钎料的组织均匀,晶粒明显细化,钎料的力学性能最佳,但Ga元素含量进一步增加时,在晶界处析出黑色富Ga相,对钎料力学性能产生了不利影响。 相似文献
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The effect of Ag content on the wetting behavior of Sn-9Zn-xAg on aluminum and copper substrates during soldering, as well as the mechanical properties and electrochemical corrosion
behavior of Al/Sn-9Zn-xAg/Cu solder joints, were investigated in the present work. Tiny Zn and coarsened dendritic AgZn3 regions were distributed in the Sn matrix in the bulk Sn-9Zn-xAg solders, and the amount of Zn decreased while that of AgZn3 increased with increasing Ag content. The wettability of Sn-9Zn-1.5Ag solder on Cu substrate was better than those of the
other Sn-9Zn-xAg solders but worse than that of Sn-9Zn solder. The wettability of Sn-9Zn-1.5Ag on the Al substrate was also better than
those of the other Sn-9Zn-xAg solders, and even better than that of Sn-9Zn solder. The Al/Sn-9Zn/Cu joint had the highest shear strength, and the shear
strength of the Al/Sn-9Zn-xAg/Cu (x = 0 wt.% to 3 wt.%) joints gradually decreased with increasing Ag content. The corrosion resistance of the Sn-9Zn-xAg solders in Al/Sn-9Zn-xAg/Cu joints in 5% NaCl solution was improved compared with that of Sn-9Zn. The corrosion potential of Sn-9Zn-xAg solders continuously increased with increasing Ag content from 0 wt.% to 2 wt.% but then decreased for Sn-9Zn-3Ag. The
addition of Ag resulted in the formation of the AgZn3 phase and in a reduction of the amount of the eutectic Zn phase in the solder matrix; therefore, the corrosion resistance
of the Al/Sn-9Zn-xAg/Cu joints was improved. 相似文献
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Sn-9Zn合金无铅钎料用助焊剂研究 总被引:10,自引:1,他引:9
通过测量润湿面积和润湿角,研究不同助焊剂对Sn-9Zn焊料润湿性的影响。结果表明:助焊剂对Sn-9Zn焊料润湿性影响很大,由乳酸、聚乙二醇和SnCl2所构成的助焊剂与Sn-9Zn焊料有很好适应性;同时扫描电镜和能谱分析也表明焊料与Cu基体界面的IMC为Cu5Zn8相,比Sn-37Pb焊料具有更高的剪切强度。 相似文献
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The effect of flux on the wetting characteristics of four lead-free solders, Sn-3.5Ag, Sn-0.7Cu, Sn-3.5Ag-4.8Bi, and Sn-3.8Ag-0.7Cu
(wt.%), on copper substrates have been studied at 240, 260, and 280°C. The fluxes investigated were rosin (R), mildly activated
rosin (RMA), and activated rosin (RA). The wetting tests were conducted using the sessile-drop method. Results showed that
fluxes significantly affect the wetting properties of the solders. Contact angles ranging from 10° to 30° for RMA, 20° to
30° for RA, and 35° to 60° for R were obtained. The effect of temperature on contact angle depended on the type of flux used.
The contact angle decreased with increasing temperature; however, in some cases the contact angle was independent of temperature.
The Sn-3.5Ag-4.8Bi exhibited the lowest contact angles indicating improved wettability with addition of bismuth. The microstructure
of the solder/copper interface was analyzed by scanning electron microscopy. 相似文献
15.
The thermal property of lead-free Sn-8.55Zn-1Ag-XAl solder alloys and their wetting interaction with Cu 总被引:1,自引:0,他引:1
The wetting behaviors between the quaternary Sn-8.55Zn-1Ag-XAl solder alloys and Cu have been investigated with the wetting
balance method. The Al contents, x, of the quaternary solder alloys investigated were 0.01–0.45 wt.%. The results of differential
scanning calorimeter (DSC) analysis indicate that the solders exhibit a solid-liquid coexisting range of about 7–10°C. The
solidus temperature of the quaternary Sn-8.55Zn-1Ag-XAl solder alloys is about 198.2°C, while the liquidus temperatures are
205–207°C. The experimental results showed that the wettability of the Sn-8.55Zn-1Ag-XAl solder alloys is improved by the
addition of Al. The mean maximum wetting force of the solders with Cu is within 0.75–1.18 mN and the mean wetting time is
around 1.0–1.1 sec, better than the ∼1.3 sec of eutectic Sn-9Zn and Sn-8.55Zn-1Ag solder alloys. The addition of Al also depresses
the formation of ε-Ag-Zn compounds at the interface between Sn-8.55Zn-1Ag-XAl solders and copper. 相似文献
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The effect of surface roughness of copper substrate on the reactive wetting of Sn-Ag-Cu solder alloys and morphology of intermetallic compounds (IMCs) was investigated. The spreading behavior of solder alloys on smooth and rough Cu substrates was categorized into capillary, diffusion/reaction, and contact angle stabilization zones. The increase in substrate surface roughness improved the wetting of solder alloys, being attributed to the presence of thick Cu3Sn IMC at the interface. The morphology of IMCs transformed from long needle shaped to short protruded type with an increase in the substrate surface roughness for the Sn-0.3Ag-0.7Cu and Sn-3Ag-0.5Cu solder alloys. However, for the Sn-2.5Ag-0.5Cu solder alloy the needle-shaped IMCs transformed to the completely scallop type with increase in the substrate surface roughness. The effect of Ag content on wetting behavior was not significant. 相似文献
17.
In this study, the contact angles of four lead-free solders, namely, Sn-3.5Ag, Sn-3.5Ag-4.8Bi, Sn-3.8Ag-0.7Cu, and Sn-0.7Cu
(wt.%), were measured on copper substrates at different temperatures. Measurements were performed using the sessile-drop method.
Contact angles ranging from 30° to 40° after wetting under vacuum with no fluxes and between 10° and 30° with rosin mildly
activated (RMA) and rosin activated (RA) fluxes were obtained. The Sn-3.5Ag-4.8Bi exhibited the lowest contact angles, indicating
improved wettability with the addition of bismuth. For all soldering alloys, lower contact angles were observed using RMA
flux. Intermetallics formed at the solder/Cu interface were identified as Cu6Sn5 adjacent to the solder and Cu3Sn adjacent to the copper substrate. The Cu3Sn intermetallic phase was generally not observed when RMA flux was used. The effect of temperature on contact angle was dependent
on the type of flux used. 相似文献