碲镉汞p-on-n长波异质结探测器材料的制备研究

报道了碲镉汞p+-on-n长波双层异质结材料和异质结台面器件的研究结果,重点研究了p+-on-n型双层异质结材料制备技术。通过水平滑舟富碲液相外延生长的方法在碲锌镉衬底上原位生长In掺杂碲镉汞n型吸收层材料,然后再采用富汞垂直液相外延技术制备p型As原位掺杂的碲镉汞cap层材料,从而获得p+-on-n型双层异质结材料,并通过湿法腐蚀、台面刻蚀以及钝化等工艺得到碲镉汞 p+-on-n长波异质结台面型器件。p+-on-n异质结器件结构可以有效克服少子寿命偏低等问题,在长波及甚长波波段具有更低的暗电流和更高的R0A值,这对于解决目前长波碲镉汞红外探测器暗电流大、结阻抗低的问题,提高长波及甚长波波段碲镉汞红外焦平面器件的性能具有重要的意义。     

高工作温度中波红外碲镉汞焦平面研究

该文报道了昆明物理研究所高工作温度中波红外碲镉汞焦平面探测器器件的研究情况。通过优化焦平面器件结构参数,采用As离子注入形成p-on-n平面结器件技术,在液相外延生长的高质量原位In掺杂的碲镉汞薄膜上制备了阵列规格为640×512@15μm的中波红外焦平面探测器。利用变温杜瓦测试了焦平面芯片在不同工作温度下的光谱响应、器件暗电流、噪声等效温差、有效像元率以及盲元分布等,测试结果表明器件具备180K以上工作温度的能力。     

双层异质结碲镉汞甚长波红外焦平面探测器研究进展

报道了甚长波碲镉汞红外焦平面探测器的最新研究进展。采用水平液相外延In掺杂和垂直液相外延As掺杂技术生长p-on-n异质结材料,并基于湿法腐蚀、表侧壁钝化、In柱互连工艺,制备了第一支甚长波碲镉汞台面型焦平面器件。在60 K的工作温度下,该器件的截止波长达到14.28 μm,有效像元率为94.5%,平均峰值探测率达到8.98×10¹⁰ cm·Hz^1/2·W^-1。     

中波碲镉汞p-on-n高温工作技术研究

针对碲镉汞中波p-on-n技术进行研究,采用二次离子质谱仪分析注入后及退火后As离子在碲镉汞材料中的浓度分布,使用透射电镜表征激活退火后离子注入损伤修复状态,通过半导体参数测试仪评价pn结的IV特性,将探测器芯片装在变温杜瓦中测试其不同温度下的焦平面技术指标。研究结果表明,As离子注入后在碲镉汞体内形成大量缺陷,经过富汞退火后缺陷得到修复,同时As离子进一步向内扩散,制备的pn结工作稳定表明As离子得到有效激活,制备的中波p-on-n探测器芯片在120 K温度下有效像元率可以达到99%以上。     

液相外延碲镉汞中砷离子注入与激活表征研究

As在HgCdTe材料中具有较小的扩散系数,可以形成较为稳定的结构,广泛应用于HgCdTe的p型掺杂。在p-on-n型碲镉汞红外探测器的制备中As掺杂是重要的制备方法。针对在制备过程中存在无法精确测量As激活率的问题,提出采用低温弱p型退火辅助差分霍尔测试的方法,获得了载流子浓度分布,从而通过与SIMS测试结果对比得到长、中波液相外延HgCdTe样品中As的激活率,并分析了退火等工艺对As掺杂后激活率的影响。     

制备HgCdTe红外焦平面器件的离子注入技术

1 前言 啼镉汞光伏型红外焦平面列阵器件(IRF-PAs)是以外延材料为基础发展起来的,其基本工作原理利用了P-n结的光电效应。目前,碲镉汞光伏型红外焦平面的器件结构主要是离子注入形成的n-on-p和p-on-n平面结。虽然现在已     

微电子学、集成电路

TN42005040348碲镉汞p+-on-n长波异质结探测器的研究/叶振华,吴俊,胡晓宁,巫艳,王建新,李言谨,何力(中国科学院上海技术物理研究所材料器件中心)//红外与毫米波学报.―2004,23(6).―423～426.报道了HgCdTe p+-on-n长波异质结焦平面器件的研究结果.采用由分子束外延(MBE)和原位掺杂技术生长的P+-on-n异质结材料,通过湿法腐蚀、台面钝化、台面金属化、铟柱制备和互连等工艺,得到了HgCdTe p+-on-n长波异质结焦平面器件.根据,I-V实验结果和暗电流理论,拟合计算和分析了各种暗电流机制对器件性能的影响.且获得了器件的响应光谱和探测率。图…     

碲镉汞高工作温度红外探测器

基于当前红外探测器技术的发展方向,从高工作温度红外探测器应用需求的角度分析了碲镉汞高工作温度红外探测器在组件重量、外形尺寸、功耗、环境适应性及可靠性方面的优势。总结了欧美等发达国家在碲镉汞高工作温度红外探测器研究方面的技术路线及研究现状。从器件暗电流和噪声机制的角度分析了碲镉汞光电器件在不同工作温度下的暗电流和噪声变化情况及其对器件性能的影响;总结了包括基于工艺优化的Hg空位p型n-on-p结构碲镉汞器件、基于In掺杂p-on-n结构和Au掺杂n-on-p结构的非本征掺杂碲镉汞高工作温度器件、基于nBn势垒阻挡结构的碲镉汞高工作温度器件及基于吸收层热激发载流子俄歇抑制的非平衡模式碲镉汞高工作温度器件在内的不同技术路线碲镉汞高工作温度器件的基本原理,对比分析了不同技术路线碲镉汞高工作温度器件的性能及探测器制备的技术难点。在综合分析不同技术路线高温器件性能与技术实现难度的基础上展望了碲镉汞高工作温度器件技术未来的发展方向,认为基于低浓度掺杂吸收层的全耗尽结构器件具备更好的发展潜力。     

MBE生长碲镉汞的砷掺入与激活

采用As掺杂和激活技术制备的p+-on-n异质结材料是获得高性能长波碲镉汞红外焦平面器件的关键技术之一,得到了广泛关注.采用变温IV拟合的方法,对不同As掺入浓度与器件结性能相关性进行了分析,发现降低结区内As掺杂浓度可以有效抑制器件的陷阱辅助隧穿电流.拟合结果表明,较高浓度的Nt很可能与高浓度As掺入相关.因此As的稳定均匀掺入和激活被认为是主要技术挑战.实验研究了分子束外延过程中Hg/Te束流比与As掺入效率的关系,发现相对富Hg的外延条件有助于提高As掺杂效率.研究还发现As的晶圆内掺杂均匀性与Hg/Te束流比的均匀性密切相关.对As的激活退火进行了研究,发现在饱和Hg蒸汽压中采用300℃/16h+420℃/1 h+240℃/48 h的退火条件能明显提升碲镉汞中As原子的激活率.     

分子束外延碲镉汞薄膜的砷掺杂技术

Ⅴ族元素As在碲镉汞中具有较小的扩散系数,在非本征p型掺杂中得到广泛应用,在p-on-n型高性能探测器及双色或多色探测器应用方面优势明显。对分子束外延掺As碲镉汞薄膜的几种生长技术的基本原理进行了简单介绍,并对各方法存在的优缺点进行了对比分析;同时对As杂质在碲镉汞材料中的掺杂形态、杂质激活退火工艺及杂质激活率等进行了总结分析。对MBE As掺杂在第三代多层膜结构器件的应用方面提出了建议。     

Comparison of characterization techniques in p-on-n HgCdTe LWIR photodiodes technology

In this paper standard techniques for characterization of HgCdTe liquid phase epitaxial layers (LPE) were presented. The performance of long wavelength p-on-n HgCdTe photodiodes fabricated by arsenic diffusion was described. The correlation between LPE HgCdTe material parameters and properties of the infrared photodiodes was demonstrated.     

碲镉汞高温红外探测器组件进展

高工作温度红外探测器组件是第三代红外探测器技术的重要发展方向,可用于高工作温度红外探测器的基础材料主要有锑基和碲镉汞两大类。介绍了昆明物理研究所在高工作温度红外焦平面探测器组件方面的最新研究进展,其中基于碲镉汞材料p-on-n技术研制的高工作温度中波640×512探测器组件在150 K温区性能优异,探测器的噪声等效温差(NETD)小于20 mK,配置了高效动磁式线性制冷机的高温探测器组件(IDDCA结构),质量小于270 g,探测器组件光轴方向长度小于70 mm(F4),室温环境下组件稳态功耗小于2.5 Wdc,降温时间小于80 s,声学噪声小于27 dB,探测器光轴方向自身振动力最大约1.1 N。目前正在进行环境适应性和可靠性验证,完成后就可实现商用量产。     

Minority carrier lifetime in p-HgCdTe

High operating temperature (HOT) detector concepts using midwave infrared (MWIR) (x∼0.3) p-type HgCdTe operating at temperatures within the thermoelectric cooler range are of significant interest at the present time. However, it is apparent that much work remains to be done in the areas of material, diode passivation, and diode formation technologies before the “holy grail” of photon detection at room temperature for all infrared wavelengths is achieved. Over the years, at DRS, we have developed a technology base for both n- and p-type HgCdTe materials parameters that are relevant to photodiode design and fabrication. This paper will discuss data that we have taken recently on minority carrier lifetime in MWIR and long wave infrared (LWIR) HgCdTe, particularly p type, and how it compares to current theories of Auger 7, radiative, and Shockley-Read recombination in this material. Extrinsic group IB (Cu, Au) and group V (arsenic) p-type dopants were used, together with group III (In) for n-type. The impact of the data on future HOT detector work is discussed.     

昆明物理研究所大面积水平推舟液相外延碲镉汞薄膜技术进展

报道了近年来昆明物理研究所在富碲水平推舟液相外延碲镉汞外延薄膜制备技术方面的进展。2019年以来,突破了?120 mm碲锌镉晶体定向生长技术,使碲锌镉衬底沉积相和夹杂相密度≤5×103 cm－2,位错腐蚀坑密度（EPD）≤4.0×104 cm－2,?120 mm（111）晶圆衬底的Zn组份分布极差≤0.36%。基于碲锌镉衬底技术的进步,液相外延碲镉汞薄膜的最大生长尺寸达到了70 mm×75 mm,薄膜位错腐蚀坑密度均值为5×104 cm－2,X射线双晶回摆曲线半峰宽（DCRC-FWHM）≤35 arcsec,部分可控制到25 arcsec以下;50 mm×60 mm尺寸长波碲镉汞薄膜的厚度极差≤±1.25 μm,室温截止波长极差≤±0.1 μm,中波碲镉汞薄膜相应指标分别为≤±1 μm、≤±0.05 μm。材料技术的进展促进了制冷型碲镉汞探测器产能提升和成本的降低,也支撑了高性能长波/甚长波探测器、高工作温度（HOT）探测器以及2048×2048、4096×4096等甚高分辨率高性能探测器的研制。     

Enhanced arsenic diffusion and activation in HgCdTe

Temperature and time dependent Hg-annealing studies for arsenic activation have been carried out on As-doped molecular beam epitaxy HgCdTe eitherin situ or by ion implantation to determine the extent of arsenic activation in the single layer. Enhanced As diffusion and activation in double layer heterostructures have also been investigated to further our understanding of the effects on zero bias resistance-area product (R_oA) and quantum efficiency. The results show that the arsenic activation anneal is limited by Hg self-diffusion into the HgCdTe epilayer. Using this arsenic activation process for eitherin situ doped arsenic or implanted arsenic, high performance p-on-n double layer heterostructure photodiodes have been demonstrated on both mesa and planar device structures.     

MOCVD grown CdZn Te/GaAs/Si substrates for large-area HgCdTe IRFPAs

Large-area HgCdTe 480×640 thermal-expansion-matched hybrid focal plane arrays were achieved by substituting metalorganic chemical vapor deposition (MOCVD)-grown CdZnTe/GaAs/Si alternative substrate in place of bulk CdZnTe substrates for the growth of HgCdTe p-on-n double-layer heterojunctions by controllably-doped mercury-melt liquid phase epitaxy (LPE). (100) CdZnTe was grown by MOCVD on GaAs/Si using a vertical-flow high-speed rotating disk reactor which incorporates up to three two-inch diameter substrates. Layers having specular surface morphology, good crystalline structure, and surface macro defect densities <50 cm⁻² are routinely achieved and both the composition uniformity and run-to-run reproducibility were very good. As the composition of the CdZnTe layers increases, the x-ray full width at half maximum (FWHM) increases; this is a characteristic of CdZnTe grown by VPE techniques and is apparently associated with phase separation. Despite a broader x-ray FWHM for the fernary CdZnTe, the FWHM of HgCdTe grown by LPE on these substrates decreases, particularly for [ZnTe] compositions near the lattice matching condition to HgCdTe. An additional benefit of the ternary CdZnTe is an improved surface morphology of the HgCdTe layers. Using these silicon-based substrates, we have demonstrated 78K high-performance LWIR HgCdTe 480×640 arrays and find that their performance is comparable to similar arrays fabricated on bulk CdZnTe substrates for temperatures exceeding approximately 78K. The performance at lower temperatures is apparently limited by the dislocation density which is typically in the low-mid 10⁶ cm⁻² range for these heteroepitaxial materials.     

Issues in HgCdTe Research and Expected Progress in Infrared Detector Fabrication

The purpose of this paper is to review the trends in HgCdTe research, illustrating the discussed ideas with the latest results obtained at DEFIR (CEA-LETI and Sofradir joint laboratory). The beginning of this paper is devoted to an extended introduction to today’s issues concerning HgCdTe photodiode performance enhancement. In fact, very high-quality material is mandatory for ultrahigh performance at low temperature as well as for high noise operability at high operating temperature (HOT). Therefore, a strong effort has been carried out during the last few years for lattice-matched CdZnTe substrate and HgCdTe active layer growth improvement, leading to very large substrates and ultraflat liquid-phase epitaxy layers. The same analysis holds for diode process quality and passivation. Therefore, the photodiode process has been completely revisited in order to optimize HOT operability. Also necessary for the next generation of HOT devices, some significant progress has been made in small-pixel-pitch interconnection on silicon read-out circuits. Indeed, the first 10-μm focal-plane arrays (FPAs) have been successfully fabricated this year in the mid-wave infrared (IR) band. The latest avalanche photodiode (APD) realizations are also presented with 15-μm-pitch FPAs for passive imaging and 30-μm-pitch ultrafast arrays running at 1.5 kHz full frame rate. Linear-mode photon counting using APDs is also briefly discussed. Finally, the paper concludes on more complex structures for the third generation of IR detectors, discussing the latest achievements in dual-band FPA fabrication in various spectral bands.