共查询到19条相似文献,搜索用时 328 毫秒
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AlAs/AlGaAs湿法氧化技术是制备氧化物限制型VCSELs工艺中极为重要的一步,形成的氧化孔会直接影响到器件的各个特性参数,故有必要对氧化动力学规律进行深入地研究.首先根据大量氧化实验得到了一般氧化规律曲线,再通过结合一维Deal-Grove氧化动力学模型,对比一维条形、二维圆形凸、凹台面的氧化规律,推导出了简单实用的二维圆形台面的氧化模型,所得模型曲线与实验数据均吻合较好,并成功地运用此模型实现了对氧化孔大小的精确控制. 相似文献
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为实现精确控制VCSELs器件中氧化孔的大小,对Al0.98Ga0.02As的湿法氧化规律进行了分析研究.首先运用一维Deal-Grove模型分析了Al0.98Ga0.02As条形台面湿法氧化的一般规律,并在此基础上进一步分析推导,加以适当的简化,提出了适用于二维圆形台面的简单氧化模型,用此模型模拟得到的结果与实验数据十分吻合.同时,实验中观察到氧化孔径很小时氧化速率突增的现象.运用这些规律,将氧化长度的精度控制在0.5μm内,基本实现了氧化工艺的可控性及可重复性. 相似文献
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Al0.98Ga0.02As的湿法氧化规律 总被引:3,自引:0,他引:3
为实现精确控制VCSELs器件中氧化孔的大小,对Al0.98Ga0.02As的湿法氧化规律进行了分析研究.首先运用一维Deal-Grove模型分析了Al0.98Ga0.02As条形台面湿法氧化的一般规律,并在此基础上进一步分析推导,加以适当的简化,提出了适用于二维圆形台面的简单氧化模型,用此模型模拟得到的结果与实验数据十分吻合.同时,实验中观察到氧化孔径很小时氧化速率突增的现象.运用这些规律,将氧化长度的精度控制在0.5μm内,基本实现了氧化工艺的可控性及可重复性. 相似文献
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详细研究了凸形、凹形与条形台面的A1GaAs湿氮氧化规律。对三种形状的台面分别进行氧化长度的观察测试,发现凸形、条形及凹形台面的氧化速率顺次下降,且随氧化时间的加长,差距明显增大。运用氧化动力学方法分析,是由于不同形状台面内的氧化剂浓度及氧化剂扩散速率不同引起;并推导得出台面形状、尺寸与氧化速率的对应关系。所推导的氧化规律模拟曲线与实验数据基本吻合。进一步指出当台尺寸较小时,由于氧化剂在气相传送中也受到了限制,凹形台面氧化速率的实验值与理论值会出现较大偏差。 相似文献
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不同形状台面的AlGaAs湿氮氧化规律研究 总被引:1,自引:0,他引:1
详细研究了凸形、凹形与条形台面的AlGaAs湿氮氧化规律。对三种形状的台面分别进行氧化长度的观察测试,发现凸形、条形及凹形台面的氧化速率顺次下降,且随氧化时间的加长,差距明显增大。运用氧化动力学方法分析,是由于不同形状台面内的氧化剂浓度及氧化剂扩散速率不同引起;并推导得出台面形状、尺寸与氧化速率的对应关系。所推导的氧化规律模拟曲线与实验数据基本吻合。进一步指出当台尺寸较小时,由于氧化剂在气相传送中也受到了限制,凹形台面氧化速率的实验值与理论值会出现较大偏差。 相似文献
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基于二维直方图的曲线分割法 总被引:1,自引:0,他引:1
针对传统十字分割模型对于二维直方图的划分不合理,提出一种曲线分割模型,并通过多条线段拟合简化该模型.在分割阈值的求解过程中,将二维阈值转换为一维阈值,且为获得快速算法,采用了迭代和优化搜索策略.实验表明,曲线分割模型比十字分割模型具有更优的抗噪性能,对于图像边缘形状保持得好,并且此算法的运算量大大降低. 相似文献
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利用双势垒结构研究磁场下二维电子的态密度 总被引:2,自引:0,他引:2
势垒结构磁电容曲线,测量了垂直磁场下二维电子态密度。采用高斯型朗道态密度模型计算了双势垒结构的电容随磁场的变化曲线,与不同偏压和温度下的实验曲线符合得相当好,由此得到朗道能级模型态密度。根据拟合自洽地给出了二维浓度、费密能级、子带能量和有效Lande因子随场振荡变化的规律。 相似文献
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Osinski M. Svimonishvili T. Smolyakov G.A. Smagley V.A. Mackowiak P. Nakwaski W. 《Photonics Technology Letters, IEEE》2001,13(7):687-689
The Deal-Grove model of thermal oxidation kinetics is adapted to cylindrically symmetric mesa structures and applied to study steam oxidation of AlAs. Oxidation process parameters are extracted from available experimental data as functions of temperature and the AlAs layer thickness. The oxidation rate is found to be very sensitive not only to temperature, but also to the oxidation front position inside the mesa. The oxidation rate slows down as the oxidation front moves into the mesa, reaches a minimum, and then accelerates at the final stages of the oxidation process. Complex nonmonotonic dependence of the oxidation process on layer thickness is also revealed 相似文献
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Enhanced light output in nitride-based light-emitting diodes by roughening the mesa sidewall 总被引:1,自引:0,他引:1
Chia-Feng Lin Zhong-Jie Yang Jing-Hui Zheng Jing-Jie Dai 《Photonics Technology Letters, IEEE》2005,17(10):2038-2040
In this letter, we will report on a nitride-based light emitting diode with a mesa sidewall roughening process that increases light output power. The fabricated GaN-based light-emitting diode (LED) wafers were first treated through a photoelectrochemical (PEC) process. The Ga/sub 2/O/sub 3/ layers then formed around the GaN : Si n-type mesa sidewalls and the bottoms mesa etching regions. Selective wet oxidation occurred at the mesa sidewall between the p- and the n-type GaN interface. The light output power of the PEC treated LED was seen to increase by about 82% which was caused by a reduced index reflectance of GaN-Ga/sub 2/O/sub 3/-air layers, by a rough Ga/sub 2/O/sub 3/ surface, by a microroughening of the GaN sidewall surface, and by a selective oxidation step profile of the mesa sidewall that increases the light-extraction efficiency from the mesa sidewall direction. Consequently, this wet PEC treated process is suitable for high powered nitride-based LEDs lighting applications. 相似文献
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提出了在 n- 区中采用掺杂浓度三层渐变式结构 Si Ge/Si功率二极管及台面结构的 Si Ge/Si功率二极管。由 Medici模拟所得的特性表明 ,在采用 n- 区渐变掺杂结构的 p+ ( Si Ge) -n- -n+ 功率二极管中 ,在正向特性基本不发生变化的前提下 ,与 n-区固定掺杂结构相比反向恢复过程加快 ,二极管下降时间 t A 缩短近 1 /2 ;在采用台面结构的 p+ ( Si Gi) -n- -n+功率二极管中 ,反向恢复特性也有明显改进 ,电流反向恢复时间缩短近 1 /3 ,而电压反向恢复时间缩短近 1 /2。 相似文献
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A simple physical model is developed for the thermal oxidation process of AlGaAs using the continuity equation. The model is based on the principle of oxidant mass conservation. Theoretical calculations are compared with experimental data to a good agreement. The model is then applied to the study of VCSEL batch fabrication. Several control parameters are discussed including AlGaAs layer thickness, aluminum composition, initial mesa size, spacing between two adjacent devices, oxidation time, and oxidation temperature. 相似文献
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《Electron Devices, IEEE Transactions on》1971,18(1):54-57
This paper describes a new process for the fabricating of semiconductor devices, using a silicon nitride (Si3 N4 -masked thermally oxidized post-diffused mesa process (SIMTOP), which combines the advantages of both the mesa and planar processes while eliminating the disadvantages peculiar to each. An IMPATT diode was fabricated as a model vehicle for the process and the physical and electrical data are presented. A comparison is made of voltage breakdown on rectifier devices made by the mesa, planar, and SIMTOP process. Other applications of this new process are discussed and scanning electron microphotographs of the IMPATT structure are included. 相似文献
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In this report, we propose the guard-ring structure as the edge termination for the high-voltage SiC Schottky barrier diodes. The local oxidation process is used to form the mesa of a p-n junction as the guard-ring. The comparison between the Al/Ti Schottky barrier diodes with and without the guard-ring indicates the effectiveness of the guard-ring to relax the electric field, from the results that the breakdown voltage is about two times larger with high yield 相似文献