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1.
基于TSMC 0.18 μm CMOS工艺,设计了一种新颖的恒跨导高增益轨到轨运算放大器。输入级仅由NMOS管差分对构成,采用电平移位及两路复用选择器控制技术,在轨到轨共模输入范围内实现了输入级恒跨导。中间级采用折叠式共源共栅放大器结构,运算放大器能获得高增益。输出级采用前馈型AB类推挽放大器,实现轨到轨全摆幅输出。利用密勒补偿技术进行频率补偿,运算放大器工作稳定。仿真结果表明,在1.8 V电源电压下,该运算放大器的直流开环增益为129.3 dB,单位增益带宽为7.22 MHz,相位裕度为60.1°,整个轨到轨共模输入范围内跨导的变化率为1.44%。  相似文献   

2.
基于国内某CMOS工艺设计了一种单一PMOS差分对的轨到轨输入、恒跨导CMOS运算放大器。输入级电路采用折叠共源共栅结构,通过体效应动态调节输入管的阈值电压扩展共模输入范围到正负电源轨,恒定共模输入范围内的跨导,自级联电流镜有源负载将差分输入转换为单端输出;输出级电路采用AB类结构实现轨到轨输出,线性跨导环确定输出管的静态偏置电流。在5 V电源电压,2.5 V共模电压,1 MΩ负载条件下,经Spectre仿真验证,该运算放大器开环增益为119 dB,相位裕度为58°,共模输入范围为0.0027~4.995 V,共模范围内跨导变化小于3%,实现了轨到轨输入共模范围内的跨导恒定。  相似文献   

3.
赵双  刘云涛 《微电子学》2016,46(3):302-305, 310
为了提高运算放大器对电源电压的利用率,基于GSMC 0.18 μm CMOS工艺模型,设计了一种高增益恒跨导轨对轨CMOS运算放大器。该运算放大器的输入级采用了互补差分对,并通过3倍电流镜法保证输入级总跨导在整个共模输入范围内恒定;为了获得较大的增益和输出摆幅,中间级采用了折叠式共源共栅结构;输出级采用了AB类输出控制电路,使输出摆幅基本实现了轨对轨。在3.3 V供电电压以及1.6 V输入电压下,该放大器的直流增益为126 dB,单位增益带宽为50 MHz,相位裕度为65°。电路结构简单,易于调试,可大大缩减设计周期和成本。  相似文献   

4.
薛超耀  韩志超  欧健  黄冲 《电子科技》2013,26(9):121-123,130
设计了一种新颖的恒跨导轨对轨CMOS运算放大器结构。输入级采用轨对轨的结构,在输入级采用4个虚拟差分对管来对输入差分对的电流进行限制,使运放的输入级跨导在工作范围内保持恒定。输出级采用前馈式AB类输出结构,以使输出达到全摆幅。仿真结果显示,在5 V电源电压和带有10 pF电容与10 kΩ电阻并联的负载下,该运放在共模输入范围内实现了恒跨导,在整个共模输入范围内跨导变化率仅为3%,输出摆幅也达到了轨对轨全摆幅,运放的开环增益为108.5 dB,增益带宽积为26.7 MHz,相位裕度为76.3°。  相似文献   

5.
设计了一款基于电荷泵高压内电源的恒定跨导轨到轨运算放大器.输入级采用PMOS差分对结构,通过电荷泵产生高于电源电压的输入级内电源,使运放在轨到轨输入范围能正常工作并保持输入跨导恒定.电荷泵电路所需的时钟信号通过内部振荡器电路产生,再通过电压自举电路和时序电路产生所需电平的非交叠开关控制信号,最后利用时间交织结构输出连续稳定的高压内电源.在电荷泵实现中还采用了辅助开关结合跟随运放的结构降低了主开关在切换时的毛刺.该运放在折叠式共源共栅结构中使用增益自举结构提高了总体增益,输出级采用class AB类输出结构实现轨到轨输出.该运算放大器基于0.5μm CMOS工艺完成电路与版图设计,仿真结果表明,在5 V电源电压下,直流增益为150.76 dB,单位增益带宽为53.407 MHz,相位裕度为96.1°,输入级跨导在轨到轨输入共模范围内的变化率为0.001 25%.  相似文献   

6.
介绍了一种采用0.5μm CMOS工艺的轨到轨输入共栅共源带输出阻抗增强结构的跨导放大器电路。该放大器用在一个8倍过采样率,输出速率500 kps的16位二阶Σ-Δ加流水线型结构的A/D转换器中,位于Σ-Δ环路的第一级,完成过采样、相减求差和残差放大的功能,是整个A/D转换器的重要模拟电路单元。在5 V电源电压下,该放大器的仿真结果为直流增益大于90dB,单位增益带宽大于100 MHz,相位裕度大于75°。  相似文献   

7.
介绍了一种低电压、低功耗、动态摆幅大、高频带的运算放大器,电路采用恒定跨导的轨对轨输入级,偏置电路采用折叠共源共栅电流镜结构,采用0.35uM CMOS工艺实现,有较好的兼容性,可应用于基带数字通信芯片设计及其相关领域。  相似文献   

8.
郭仲杰 《电子器件》2021,44(1):72-76
为了解决轨对轨运算放大器输入级跨导随共模输入电压变化的影响,采用实时共模电压监测技术,动态跟踪轨对轨运放输入级的跨导变化,通过对偏置电流的高精度定量补偿,从而实现了对输入级跨导的恒定性控制。基于0.18μm CMOS工艺进行了具体电路的设计实现,结果表明:在电源电压3.3 V、负载电阻100Ω、负载电容1 nF的条件下,运放增益为148 dB、相位裕度为61°、功耗为39.6μW,共模输入范围高达0~3.3 V,输入级跨导变化率仅为2.1%。  相似文献   

9.
刘华珠  黄海云  宋瑞 《半导体技术》2011,36(6):463-465,482
设计了一个1.5 V低功耗轨至轨CMOS运算放大器。电路设计中为了使输入共模电压范围达到轨至轨性能,采用了NMOS管和PMOS管并联的互补差动对输入结构,并采用成比例的电流镜技术实现了输入级跨导的恒定。在中间增益级设计中,采用了适合在低压工作的低压宽摆幅共源共栅结构;在输出级设计时,为了提高效率,采用了简单的推挽共源级放大器作为输出级,使得输出电压摆幅基本上达到了轨至轨。当接100 pF电容负载和1 kΩ电阻负载时,运放的静态功耗只有290μW,直流开环增益约为76 dB,相位裕度约为69°,单位增益带宽约为1 MHz。  相似文献   

10.
本文在分析MOS管恒跨导输入级和AB类输出级运算放大器的基础上设计了一个高摆率、恒跨导的轨对轨运算放大器。在输入级中采用了齐纳二极管的稳压原理,保证Rail-to-Rail运算放大器的输入跨导恒定。为了实现高转换率,本文采用了一种新型的压摆率提高电路。另外,为了提高系统的稳定性,采用了控制零点的米勒补偿进行频率补偿。采...  相似文献   

11.
Waveguide multilayer optical card (WMOC) is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling & processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic (VB) language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.  相似文献   

12.
IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…  相似文献   

13.
The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.  相似文献   

14.
Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.  相似文献   

15.
A doping system consisting of NPB and PVK is employed as a composite hole transporting layer (CHTL). By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK : NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK : NPB at 1:3.  相似文献   

16.
An insert layer structure organic electroluminescent device(OLED) based on a new luminescent material (Zn(salen)) is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn(salen)/Liq/LiF/A1/CuPc/NPD/Zn(salen)/Liq/LiF/A1. Effective insert electrode layers comprising LiF(1nm)/Al(5 nm) are used as a single semitransparent mirror, and bilayer cathode LiF(1 nm)/A1(100 nm) is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.  相似文献   

17.
Due to variable symbol length of digital pulse interval modulation(DPIM), it is difficult to analyze the error performances of Turbo coded DPIM. To solve this problem, a fixed-length digital pulse interval modulation(FDPIM) method is provided. The FDPIM modulation structure is introduced. The packet error rates of uncoded FDPIM are analyzed and compared with that of DPIM. Bit error rates of Turbo coded FDPIM are simulated based on three kinds of analytical models under weak turbulence channel. The results show that packet error rate of uncoded FDPIM is inferior to that of uncoded DPIM. However, FDPIM is easy to be implemented and easy to be combined, with Turbo code for soft-decision because of its fixed length. Besides, the introduction of Turbo code in this modulation can decrease the average power about 10 dBm, which means that it can improve the error performance of the system effectively.  相似文献   

18.
It is a key problem to accurately calculate beam spots' center of measuring the warp by using a collimated laser. A new method, named double geometrical center method (DGCM), is put forward for the first time. In this method, a plane wave perpendicularly irradiates an aperture stop, and a charge couple device (CCD) is employed to receive the diffraction-beam spots, then the geometrical centers of the fast and the second diffraction-beam spots are calculated respectively, and their mean value is regarded as the center of datum beam. In face of such adverse instances as laser intension distributing defectively, part of the image being saturated, this method can still work well. What's more, this method can detect whether an unacceptable error exits in the courses of image receiving, processing and calculating. The experimental results indicate the precision of this method is high.  相似文献   

19.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

20.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

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