Eu3+掺杂CaO-MgO-SiO2透明微晶玻璃的制备及表征

采用熔融退火技术制备了CaO-MgO-SiO2:Eu3+基质玻璃,通过在不同热处理制度下使基质玻璃受控析晶制备了CaO-MgO-SiO2:Eu3+微晶玻璃。利用差热分析、X射线衍射(XRD)分析、扫描电子显微镜(SEM)以及荧光光谱等手段研究了透明微晶玻璃的热处理工艺、晶相组成和显微结构以及荧光性能,通过析晶动力学分析了基质玻璃的析晶机理,探讨了热处理制度同基质玻璃晶化以及显微结构之间的联系。掺杂Eu3+的玻璃和微晶玻璃样品,在394nm激发下观测到其5个发射峰分别位于在578(5 D0→7F0)、592(5 D0→7F1)、615(5 D0→7F2)、644(5 D0→7F3)和693nm(5 D0→7F4),Eu3+在微晶玻璃样品中的发射峰强度均大于基质玻璃。     

Ho3+/Yb3+共掺的SiO2-Al2O3-BaO-BaF2微晶玻璃上转换发光研究

制备了Ho3+/Yb3+共掺的氧氟硅酸盐玻璃, 根据玻璃样品的差热分析进行微晶化处理, 测试了Ho3+/Yb3+共掺微晶玻璃的X射线衍射(XRD)图谱、吸收光谱和上转换发光光谱。结果发现, 在980 nm LD激发下, Ho3+/Yb3+共掺的含BaF2纳米晶的氧氟硅酸盐微晶玻璃可以同时观察到绿光(544 nm)和红光(656, 748 nm)上转换发光, 分别对应于Ho3+ 离子的5F4/5S2→5I8, 5F5→5I8和5F4/5S2→5I7能级跃迁, 与未热处理的玻璃样品相比, 微晶玻璃样品的绿光发光强度增强约347倍。研究结果表明含BaF2纳米晶的氧氟硅酸盐微晶玻璃是一种潜在的上转换基质材料。     

共沉淀法制备Y2O2SO4:Eu3+荧光粉及其光致发光研究

采用商业Y(NO3)3·6H2O、Eu(NO3)3·6H2O、(NH4)2SO4和NaOH为实验原料,通过共沉淀法制备了Y2O2SO4:Eu3+荧光粉。利用热分析(DTA-TG-DTG)、傅里叶变换红外(FT-IR)光谱、X射线衍射(XRD)、扫描电子显微镜(SEM)和光致发光(PL)光谱等手段对合成的粉体进行了表征。结果表明,当(NH4)2SO4引入到反应体系中时,前驱体具有非晶态结构,且在空气气氛中800℃煅烧2h能转化为单相的Y2O2SO4粉体,该Y2O2SO4粉体呈准球形,粒径范围分布在0.5~1.0μm之间,团聚较严重。PL光谱分析表明,在270nm紫外光激发下,Y2O2SO4:Eu3+荧光粉呈红光发射,主发射峰位于620nm,归属于Eu3+的5D0→7F2跃迁。Eu3+的猝灭浓度是5 mol%,其对应的荧光寿命为1.22 ms。另外,当(NH4)2SO4未引入到反应体系中时,采用类似的方法合成了Y2O3:Eu3+荧光粉,并对Y2O2SO4:Eu3+和Y2O3:Eu3+荧光粉的PL性能进行了比较。     

Al3+/Eu2+共掺杂高硅氧玻璃的荧光特性

由纳米多孔玻璃制备了Al3+/Eu2+共掺杂的高硅氧玻璃,并研究了在纳米多孔玻璃基质中共掺杂Al3+离子对Eu2+离子450 nm处蓝色荧光强度和荧光峰位的影响。结果表明,共掺杂Al3+离子可分散多孔玻璃中丛聚的Eu2+离子,加之Al2O3较低的声子能量,使Eu2+离子的蓝色荧光发射显著增强;并且由于共掺杂的Al3+降低了Eu2+离子5d轨道劈裂幅度,随着Al3+离子含量的增加,Eu2+离子荧光峰蓝移。     

YAlO3∶Eu3+发光纳米纤维的制备与表征

采用静电纺丝技术制备了聚乙烯吡咯烷酮PVP/[Y(NO3)3+Al(NO3)3+Eu(NO3)3]复合纤维,将其进行热处理,得到了YAlO3:Eu3+发光纳米纤维。采用X射线衍射(XRD)、扫描电镜(SEM)、荧光光谱等技术对样品进行了表征。PVP/[Y(NO3)3+Al(NO3)3+Eu(NO3)3]复合纤维经1200℃焙烧2h后,获得了YAlO3:Eu3+纳米纤维,属于正交晶系,空间群为Pnma。用Shapiro-Wilk方法检验了纤维直径分布情况,在95%的置信度下,纤维直径属于正态分布。PVP/[Y(NO3)3+Al(NO3)3+Eu(NO3)3]复合纤维表面光滑,纤维分散性较好,有很好的长径比,尺寸均一,平均直径为(152.9±26.0)nm;YAlO3:Eu3+纳米纤维的平均直径为(106.7±20.2)nm。在234nm的紫外光激发下,YAlO3:Eu3+纳米纤维的主要发射峰位于590nm和609nm处,分别属于Eu3+的5 D0→7F1跃迁和5 D0→7F2跃迁,Eu3+掺杂离子浓度对YAlO3:Eu3+发射峰的峰型与位置均没有影响,当Eu3+掺杂离子浓度为5%时,YAlO3:Eu3+纳米纤维发光最强。     

Er3+/Yb3+共掺氟氧微晶玻璃的光谱性质及Judd-Ofelt理论分析

制备了新的Er3+/Yb3+共掺氟氧硅酸盐微晶玻璃,测试了荧光光谱、吸收光谱。研究了氟氧化物微晶玻璃中Er3+离子的上转换发光特性,采用Judd-Ofelt理论对样品光谱进行了分析,拟合得到了强度参数,Ω2=4.4756,Ω4=1.0059,Ω6=1.2098。计算了样品的辐射寿命、跃迁几率、荧光分支比等光谱参数。结果表明,样品通过热处理形成了氟化物微晶,降低了声子能量,提高了上转换效率。绿光、红光上转换荧光强度比玻璃样品增强约2到3倍。Judd-Ofelt理论分析表明Er3+/Yb3+共掺氟氧微晶玻璃具有较高的上转换效率,是制作微型激光器和三维立体显示的优良材料之一。     

GdCOB:Eu~(3+)晶体的生长及其光谱性能研究

生长了新型激光晶体 Gd Ca4O( BO3) 3:Eu3+ (简称 Gd COB:Eu3+ ) ,测量了室温透过谱。确定了室温下 Eu3+ 在 Gd COB晶体中的能级结构。在 46 5 nm的 Ar3+ 离子激光泵浦下 ,测量了晶体 5 D0 → 7F1 ,2 跃迁和 5 D1 → 7F0 ,1 ,2 跃迁的荧光发射 ,揭示了晶体内部的多声子弛豫机制和能级跃迁途径     

Tm3+/Ho3+共掺碲酸盐玻璃的中红外发光及能量传递机理

用高温熔融法制备了Tm3+/Ho3+共掺碲酸盐玻璃(TeO2-ZnO-Na2O),根据测量得到的吸收光谱,应用Judd-Ofelt理论计算分析了玻璃样品中Ho3+离子的强度参数Ωt(t=2,4,6)、自发辐射跃迁几率A、荧光分支比β和荧光辐射寿命τrad等各项光谱参数。同时,测量得到了不同Ho3+离子掺杂浓度下玻璃样品的荧光发射谱。结果显示,在808nm抽运光激励下Tm3+/Ho3+共掺碲酸盐玻璃样品发射出较强的2.0μm中红外荧光。分析表明,较强的Ho3+离子中红外荧光来自于Tm3+/Tm3+离子间共振的能量传递过程,以及Tm3+/Ho3+离子间基于零声子和单声子辅助非共振的两部分能量传递过程。由此进一步计算得到了Tm3+/Tm3+、Tm3+/Ho3+离子间的能量传递微观速率、临界半径和声子的贡献。最后,计算分析了Ho3+…5I7→5I8能级间跃迁的2.0μm波段吸收截面、受激发射截面和增益系数。研究表明,Tm3+/Ho3+共掺TeO2-ZnO-Na2O玻璃可以作为2.0μm波段中红外固体激光器的潜在增益基质。     

Y3MgAl3SiO12:Dy 3+,Eu 3+荧光粉的能量传递与暖白光实现

采用高温固相法合成了Dy ³⁺、Eu ³⁺共掺杂Y₃MgAl₃SiO₁₂石榴石型荧光粉。采用XRD、荧光光谱仪等仪器对样品的结构以及光谱特性进行表征,探究了Dy ³⁺/Eu ³⁺在Y₃MgAl₃SiO₁₂基质结构中的光谱特征以及离子间的能量传递机制。在367 nm近紫外光激发下,Y₃MgAl₃SiO₁₂:Dy ³⁺,Eu ³⁺的发射光谱包含Dy ³⁺的6F9/2到6H15/2和6H13/2的电子跃迁特征发射(487 nm蓝光和592 nm黄光)和Eu ³⁺的5D0 7F2 and 5D0 7F4特征发射峰(616 nm和710 nm红光)。在400~500 nm范围内Dy ³⁺发射谱与Eu ³⁺激发谱重叠,表明Dy ³⁺与Eu ³⁺之间存在着能量传递,能量传递的机理为电四极-电四极相互作用。该荧光粉通过调整Dy ³⁺和Eu ³⁺的掺杂浓度比封装近紫外LED芯片,可以实现单基质暖白光LED照明。     

Er3 /Yb3 共掺TeO2-WO3-Bi2O3玻璃的光谱性质

用高温熔融法制备了Er3+/Yb3+共掺的TeO2-WO3-Bi2O3玻璃,研究了该玻璃的吸收和荧光光谱性质.应用Judd-Ofelt(JO)理论计算了Er3+的谱线强度、自发辐射跃迁几率、荧光分支比和辐射寿命等光谱参数,并拟合了相应的强度参数Ωt(t＝2,4,6).Er3+在该玻璃中4I13/2→4I15/2发射的荧光半高宽(FWHM)为77nm,应用McCumber理论计算的受激发射截面为1.03×10-20cm2.其带宽特性FWHM×σpeake乘积优于掺Er3+的硅酸盐、磷酸盐和铋酸盐玻璃,说明这是一种制备宽带光纤放大器的优良基质材料.Er3+在400～850nm波长范围存在着5个上转换发射峰,分别对应Er3+的激发态4I7/2、2H11/2、4S3/2、4F9/2和4I9/2到基态4I15/2的发射,分析了其可能存在的上转换过程.     

Performance improvement in tensile-strained In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As metamorphic HEMT

This paper proposes a In/sub 0.5/Al/sub 0.5/As/In/sub x/Ga/sub 1-x/As/In/sub 0.5/Al/sub 0.5/As (x=0.3-0.5-0.3) metamorphic high-electron mobility transistor with tensile-strained channel. The tensile-strained channel structure exhibits significant improvements in dc and RF characteristics, including extrinsic transconductance, current driving capability, thermal stability, unity-gain cutoff frequency, maximum oscillation frequency, output power, power gain, and power added efficiency.     

Very low-noise Al/sub 0.3/Ga/sub 0.7/As/Ga/sub 0.65/In/sub 0.35/As/GaAs single quantum-well pseudomorphic HEMTs

AlGaAs/GaInAs/GaAs pseudomorphic HEMTs with an InAs mole fraction as high as 35% in the channel has been successfully fabricated. The device exhibits a maximum extrinsic transconductance of 700 mS/mm. At 18 GHz, a minimum noise figure of 0.55 dB with 15.0 dB associated gain was measured. At 60 GHz, a minimum noise figure as low as 1.6 dB with 7.6 dB associated gain was also obtained. This is the best noise performance yet reported for GaAs-based HEMTs.<>     

A 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode array

We report a 12 /spl times/ 12 In/sub 0.53/Ga/sub 0.47/As-In/sub 0.52/Al/sub 0.48/As avalanche photodiode (APD) array. The mean breakdown voltage of the APD was 57.9 V and the standard deviation was less than 0.1 V. The mean dark current was /spl sim/2 and /spl sim/300 nA, and the standard deviation was /spl sim/0.19 and /spl sim/60 nA at unity gain (V/sub bias/ = 13.5 V) and at 90% of the breakdown voltage, respectively. External quantum efficiency was above 40% in the wavelength range from 1.0 to 1.6 /spl mu/m. It was /spl sim/57% and /spl sim/45% at 1.3 and 1.55 /spl mu/m, respectively. A bandwidth of 13 GHz was achieved at low gain.     

Al/sub 0.3/Ga/sub 0.7/As/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) doped-channel field-effect transistors (DCFET's)

The properties of both lattice-matched and strained doped-channel field-effect transistors (DCFET's) have been investigated in AlGaAs/In/sub x/Ga/sub 1-x/As (0/spl les/x/spl les/0.25) heterostructures with various indium mole fractions. Through electrical characterization of grown layers in conjunction with the dc and microwave device characteristics, we observed that the introduction of a 150-/spl Aring/ thick strained In/sub 0.15/Ga/sub 0.85/As channel can enhance device performance, compared to the lattice-matched one. However, a degradation of device performance was observed for larger indium mole fractions, up to x=0.25, which is associated with strain relaxation in this highly strained channel. DCFET's also preserved a more reliable performance after biased-stress testings.<>     

Morphological and electrical characterization of SixCryCzBv thin films

Si_xCr_yC_zB_v thin films with several compositions have been studied for integration of high precision resistors in 0.8 μm BICMOS technology. These resistors, integrated in the back-end of line, have the advantage to provide high level of integration and attractive electrical behavior in temperature, for analog devices. The film morphology and the structure have been investigated through transmission electron microscopy analysis and have been then related to the electrical properties on the base of the percolation theory. According to this theory, and in agreement with experimental results, negative thermal coefficient of resistance (TCR) has been obtained for samples with low Cr content, corresponding to a crystalline volume fraction below the percolation threshold.Samples with higher Cr content exhibit, instead, a variation of the TCR as a function of film thickness: negative TCR values are obtained for thickness lower than 5 nm, corresponding to a crystalline volume fraction below the percolation threshold; positive TCR are obtained for larger thickness, indicating the establishment of a continuous conductive path between the Cr rich grains. This property seems to be determinant in order to assure the possibility to obtain thin film resistors almost independent on the temperature.     

Highly linear Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMTs

We report an Al/sub 0.3/Ga/sub 0.7/N-Al/sub 0.05/Ga/sub 0.95/N-GaN composite-channel HEMT with enhanced linearity. By engineering the channel region, i.e., inserting a 6-nm-thick AlGaN layer with 5% Al composition in the channel region, a composite-channel HEMT was demonstrated. Transconductance and cutoff frequencies of a 1 /spl times/100 /spl mu/m HEMT are kept near their peak values throughout the low- and high-current operating levels, a desirable feature for linear power amplifiers. The composite-channel HEMT exhibits a peak transconductance of 150 mS/mm, a peak current gain cutoff frequency (f/sub T/) of 12 GHz and a peak power gain cutoff frequency (f/sub max/) of 30 GHz. For devices grown on sapphire substrate, maximum power density of 3.38 W/mm, power-added efficiency of 45% are obtained at 2 GHz. The output third-order intercept point (OIP3) is 33.2 dBm from two-tone measurement at 2 GHz.     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

Broadband microwave noise characteristics of high-linearity composite-channel Al/sub 0.3/Ga/sub 0.7/N/Al/sub 0.05/Ga/sub 0.95/N/GaN HEMTs

We report broadband microwave noise characteristics of a high-linearity composite-channel HEMT (CC-HEMT). Owing to the novel composite-channel design, the CC-HEMT exhibits high gain and high linearity such as an output third-order intercept point (OIP3) of 33.2 dBm at 2 GHz. The CC-HEMT also exhibits excellent microwave noise performance. For 1-/spl mu/m gate-length devices, a minimum noise figure (NF/sub min/) of 0.7 dB and an associated gain (G/sub a/) of 19 dB were observed at 1 GHz, and an (NF/sub mi/) of 3.3 dB and a G/sub a/ of 10.8 dB were observed at 10 GHz. The dependence of the noise characteristics on the physical design parameters, such as the gate-source and gate-drain spacing, is also presented.