表面微机械结构的氧化锌压电薄膜器件的工艺研究

本文对表面微机械结构的氧化锌压电薄膜器件的关键工艺进行了研究。研究了表面微机械工艺，探索了合适的工艺规范。对如何在表面微机械结构上采用Ｓ枪磁控反应溅射生长出ｃ轴定向的ＺｎＯ薄膜工艺进行了研究。     

体声波复合谐振器新结构的研究

本文报道了一种由氧化锌薄膜和多晶硅膜片构成的体声波复合谐振器的新结构，与传统制作在硅支撑膜片上的压电复合谐振器不同，多晶硅支撑膜采用表面微机械技术获得，因而是完全平面工艺，不需要双面光刻和背面腐蚀。采用Ｓ枪磁控反应溅射在多晶硅膜片上获得了ｃ轴取向良好的氧化锌薄膜。所得的谐振器的基波工作频率在５６０ＭＨｚ左右，而尺寸小于２５０×２５０μｍ２。     

氧化锌压电薄膜改性研究

氧化锌压电薄膜是一种新型的声学器件材料.为了扩大应用范围,要求薄膜有足够高的电阻率.然而,过去人们惯用的方法是在氧化锌陶瓷靶体中添加Li_2CO_3实践证明,添加Li_2CO_3的氧化锌陶瓷靶体不仅烧结温度高而且致密度低.另外,当用这种靶体溅射沉积时,获得的薄膜晶粒粗,表面粗糙,故制作的薄膜器件传输损耗大.尤其是当Li~(1+)离子吸收了空气中水份时,在薄膜的表面会产生LiOH并降低了器件的稳定性和可靠性.本报告提出用RF二极溅射装置沉积高电阻率,细晶率的添MnO_2,Cu_2Oc轴择优取向的压电薄膜.采用反射电子衍射(RED),X射线衍射(XRD)和扫描电镜照片(SEM)来研究薄膜的C轴取向和微观结构.并且用DTA,TGA.HEA等热过程曲线研究了添MnO_2,Cu_2O氧化锌陶瓷靶体对薄膜性能的影响.测量了这种薄膜的有效机电耦合系数,其值接近于氧化锌单晶.因此,为了获得高阻氧化锌压电膜,探索比Li_2CO_3更适用的添加剂不仅是必要的,而且是可能的.最后,文中对某些试验结果作了分析和讨论.     

氧化锌薄膜体声波谐振器的研制

介绍了一种薄膜体声波谐振器和它的制备流程.该谐振器采用氧化锌压电薄膜作为压电材料,通过从硅片背部体刻蚀硅衬底的方法得到谐振器的支持层.为了避免残余应力引起的支持层起皱现象,采用氮化硅/二氧化硅/氮化硅复合膜作为支持层.采用直流磁控溅射的方法制备氧化锌压电薄膜,X射线衍射结果显示,氧化锌压电薄膜C轴择优取向明显,衍射峰半高宽为0.227 3°,显示出较好的结晶质量;扫描电镜观察到氧化锌垂直于薄膜表面的柱形晶粒结构,薄膜表面平整、致密.采用HP8753D射频网络分析仪对该薄膜体声波谐振器样品进行了测试,结果表明,谐振器具有明显的厚度伸缩振动模式,其基频在750 MHz左右,二次谐频在1.5 GHz左右.进一步提高氧化锌压电薄膜的性能,该谐振器可用于射频振荡源和射频前端滤波器中.     

硅基PZT压电驱动微开关的设计和优化

采用压电多层微悬臂梁理论分析模型，研究了一种新型PZT压电复合多层膜微悬臂梁驱动微开关的机械性能，提出了一种新的硅基PZT压电复合多层薄膜微悬臂梁驱动微开关的制作方法。利用有限元分析软件ANSYS7.O对微悬臂梁结构进行了模态分析，探讨了结构参数与微悬臂梁运动特性的关系及影响压电薄膜微开关性能的因素，进一步模拟了0．3V工作电压下微开关的位移。结果表明，经优化后的压电薄膜微开关可进一步应用到集成化芯片系统中。     

基于ZnO压电薄膜的柔性MEMS超声波换能器

该文提出一种柔性的微机电系统(MEMS)超声波器件。该器件由下电极、ZnO薄膜、上电极及聚酰亚胺柔性基底构成。其制作过程简单,采用直流磁控溅射制作上、下电极,反应射频磁控溅射制作氧化锌压电薄膜。薄膜间粘合牢固,可反复弯折。SEM和XRD结果表明,氧化锌薄膜厚度可达4~8μm,具有高度(002)择优取向的柱状晶结构。根据XRD所得的结果计算了薄膜平均晶粒尺寸和内应力大小,结果表明,晶粒尺寸约为22nm,薄膜内压应力约为-1.248 4GPa。利用激光多普勒测得其共振频率约为5MHz。同时,研究发现,较厚的ZnO薄膜使振幅变大,导致振动品质因数(Q)值增加。     

表面加工多晶硅薄膜热导率测试结构

提出了一种使用表面加工工艺设计多晶硅薄膜热导率的测试结构，论文推导了热学模型，给出了测试方法。由于其制造工艺能和其它微机械器件制造工艺完全兼容，因而能够达到监控MEMS器件制造工艺和在线检测的目的。     

TC4钛合金上制备c轴取向AlN薄膜研究

采用中频磁控反应溅射,提出了在TC4钛合金基片上制备c轴取向AlN薄膜的两步法工艺。利用扫描电镜分析(SEM)、X线衍射(XRD)、原子力显微镜(AFM)对薄膜的表面及断面形貌、晶体结构、表面粗糙度进行了表征。研究结果表明,利用该文提出的两步法工艺可在TC4钛合金衬底上制备出表面粗糙度为2.3nm、c轴XRD摇摆曲线半高宽为4.1°的AlN薄膜,满足制作压电微机电系统(MEMS)器件或薄膜声表面波(SAW)和体声波器件的需求。     

用于微传感器中PZT压电薄膜的制备和图形化

采用溶胶-凝胶法在Si/Si3N4/Poly-Si/Ti/Pt基片上制备PZT压电薄膜, 为了选择更适合微电子机械系统(MEMS)器件的压电薄膜,采用一般热处理和快速热处理对锆钛酸铅(PZT)压电薄膜进行干燥和结晶.首先,采用V(H2O):V(HCL):V(HF)＝280 mL:120 mL:4drops(4滴HF溶液)配比的腐蚀液在室温下对未结晶的PZT压电薄膜进行了湿法腐蚀微细加工;然后,对图形化好的压电薄膜进行再结晶的热处理,实验结果表明这种方法可用于压电薄膜微器件的制备.     

气相沉积聚酰亚胺在微型电子器件中的应用

采用气相沉积聚合法制备了聚酰亚胺(PI)薄膜及PI与金属颗粒(Cr)复合(PI/Cr)薄膜,所制备PI薄膜表面平整,随着金属颗粒体积百分数增加,PI/Cr薄膜介电常数逐渐增大;当将PI薄膜应用于压电微机械超声换能器(pMUTs)中时,pMUTs机电耦合系数显著提高,所研制pMUTs在光声成像演示中探测到了较强的光声信号;当将PI/Cr薄膜应用于AlGaN/GaN高电子迁移率场效应晶体管(HEMTs)中时,HEMTs的击穿电压由156 V提高到248 V,HEMTs器件的耐压能力显著改善。     

Al薄膜对(002)ZnO/Al/Si结构基片中ZnO薄膜特性影响的实验研究

采用射频磁控溅射法沉积制备了(002)ZnO/A l/Si复合结构。研究了Al薄膜对(002) ZnO/Al/Si复合结构的声表面波器件(SAWD)基片性能影响以及当ZnO 薄膜厚度一定时的Al膜最佳厚度。采用X射线衍射(XRD)对Al和ZnO薄膜进行了结构表征 ,采用 扫描电镜(SEM)对ZnO薄膜进行表面形貌表征,并从薄膜生长机理角度进行了分析。结果 表明,加Al薄膜有利于ZnO薄膜按(002)择优取向生长,并且ZnO 薄膜的结晶性能提高;与(002)ZnO/Si结构基片相比,当Al薄膜 厚为100nm时,(002)ZnO/Al/Si结构中ZnO薄 膜的机电耦合系数提高 了65%。     

The fabrication of thin-film bulk acoustic wave resonatorsemploying a ZnO/Si composite diaphragm structure using porous siliconlayer etching

Thin-film bulk acoustic wave resonators (FBARs) are used in monolithic microwave integrated circuits (MMICs) for semiconductor devices. FBARs are more attractive than surface acoustic wave resonators since they have the advantages of small size, low cost, and mass-production ability. In this letter, an FBAR with an air gap is fabricated by a surface micromachining technique which utilizes porous silicon layer (PSL) etching. This FBAR has a forward reflection coefficient of -18.912 dB when the thickness of the ZnO thin film measures 1 μm. The FBAR is composed of a piezoelectric zinc oxide (ZnO) thin film and top and bottom electrode thin films of Au(1000 Å)/Ni-Cr(50 Å). The ZnO thin film is deposited by RF magnetron sputtering. This fabrication process is compatible with conventional IC processes, thereby enabling the development of monolithic-integrated FBAR's on Si or GaAs substrates     

适用SAW器件的ZnO/Ti/Si薄膜制备及缺陷分析

在Si(100)衬底和Ti/Si(100)衬底上分别制备了ZnO薄膜,探讨了Ti缓冲层对ZnO薄膜结构和缺陷的影响,利用X射线衍射(XRD)测试了ZnO薄膜的晶体结构及择优取向,利用原子力显微镜(AFM)观察ZnO薄膜的表面粗糙度(RMS),利用光致发光(PL)光谱检测了ZnO薄膜的缺陷,利用四探针法测试了ZnO薄膜的电阻率。结果表明,在Ti/Si(100)衬底上、衬底温度350℃的条件下,制备的ZnO薄膜表面光滑、缺陷少、电阻率高且具有高C轴取向。本文这一工作对于压电薄膜缺陷分析及高性能ZnO的声表面波(SAW)器件研制有重要意义。     

Piezoelectric zinc oxide by electrostatic spray pyrolysis

Zinc oxide (ZnO) possesses many interesting properties, such as a wide energy band gap, large photoconductivity, and high excitonic binding energy. Piezoelectric (ZnO) film has a high electro-mechanical coupling coefficient, which makes it a promising material for high frequency and low surface acoustic wave (SAW), bulk acoustic wave, and microelectromechanical system devices. In this work, we present the first results obtained for piezoelectric ZnO thin films prepared on corning 7059 glass substrate by electrostatic spray pyrolysis (ESP), a simple, cheap and efficient technique not widely used for ZnO deposition, using zinc nitrate in a mixture of deionised water and isopropyl alcohol. The structural morphologic and optical properties of the films have been studied and the effect of the preparation conditions, such as substrate temperature and substrate-nozzle distance, discussed. Highly c-axis preferred orientation, which is critical for piezoelectric applications (ultrasonic oscillators and transducers devices), ZnO thin films are obtained at 350 °C growth temperature and at 4.5 cm substrate-nozzle distance.     

薄膜声表面波器件的制备研究进展

介绍了薄膜声表面波器件的发展历史和特点,以及压电薄膜声表面波器件近年来国际上的研究进展,包括理论研究与实验进展的一些概况,并展望了其今后的发展趋势。     

Self‐Compensated Insulating ZnO‐Based Piezoelectric Nanogenerators

Remarkable enhancement of piezoelectric power output from a nanogenerator (NG) based on a zinc oxide (ZnO) thin film is achieved via native defect control. A large number of unintentionally induced point defects that act as n‐type carriers in ZnO have a strong influence on screening the piezoelectric potential into a piezoelectric NG. Here, additional oxygen molecules bombarded into ZnO lead to oxygen‐rich conditions, and the n‐type conductivity of ZnO is decreased dramatically. The acceptor‐type point defects such as zinc vacancies created during the deposition process trap n‐type carriers occurring from donor‐type point defects through a self‐compensation mechanism. This unique insulating‐type ZnO thin film‐based NGs (IZ‐NGs) generates output voltage around 1.5 V that is over ten times higher than that of an n‐type ZnO thin film‐based NG (around 0.1 V). In addition, it is found that the power output performance of the IZ‐NG can be further increased by hybridizing with a p‐type polymer (poly(3‐hexylthiophene‐2,5‐diyl):phenyl‐C₆₁‐butyric acid methyl ester) via surface free carrier neutralization.     

Design and fabrication of a MEMS Lamb wave device based on ZnO thin film

This paper presents the design and fabrication of a Lamb wave device based on ZnO piezoelectric film. The Lamb waves were respectively launched and received by both Al interdigital transducers.In order to reduce the stress of the thin membrane,the ZnO/Al/LTO/Si₃N₄/Si multilayered thin plate was designed and fabricated.A novel method to obtain the piezoelectric constant of the ZnO film was used.The experimental results for characterizing the wave propagation modes and their frequencies of the Lamb wave device indicated that the measured center frequency of antisymmetric A₀ and symmetric S₀ modes Lamb wave agree with the theoretical predictions.The mass sensitivity of the MEMS Lamb wave device was also characterized for gravimetric sensing application.