ZnO缓冲层改善Rubrene/C70有机太阳能电池的性能

通过制备结构为ITO/ZnO/C₇₀ /Rubrene/MoO₃/Al 的有机太阳能电池(OSCs),研究了ZnO作为阴极 修饰层对Rubrene/C70有机太阳能电池性能的改善。同时通过 优化ZnO的厚度研究了ZnO的工作机理。 从实验结果可以看出,随着ZnO厚度的变化,器件的短路电流密度(J_sc)、开路电压(V_oc)、填充因子 (FF)、光电转换效率(PCE)和串联电阻(R_s)等性能参数呈现出了规律 性变化,当ZnO层厚度比较 薄时,器件PCE随着厚度的增加不断增大,当ZnO层厚度为53nm时,器件PCE达到最高为1.13%, 对应的J_sc、V_oc、FF分别为2.82mA·cm－2、0. 84V、45.86%,R_s为66.2Ω·cm²,当ZnO层厚度继续增 加时,器件PCE开始减小。对比没有ZnO阴极修饰层,器件最优时 的Jsc、V_oc、FF和PCE 分别提高了49%、17%,R_s降低了56%。     

基于PIN结构的Rubrene/C70太阳能电池的性能研究

实验制备了ITO/V₂O₅/Rubrene/C₇₀:Rub rene/C₇₀/BCP/Al的PIN结构有机太阳能电池(OSC),其中 Rubrene、Rubrene:C₇₀和C₇₀分别作为P、I和N层。通过改变I层厚度,研究了I 层对OSC性能的影响及作用机理。实验显示,I层厚为5nm时器件的功率转换效率η达到最大值为1.580%,同时 获得了较大的短路电流密度Jsc为4.365mA· cm－2;相对PN结构器件,功率转化效率η短路电流密度Jsc和填充因子FF分别提 高了40.3%、29.7%和8.2%。我们认为,I层中激子分离效率的提高导 致了器件性能的改善。     

双阴极修饰层改善Rubrene/C70有机太阳能电池的性能

采用NTCDA/PTCBI双阴极修饰层制备了结构为ITO /MoO₃/Rubrene/C70/NTCDA/PTCBI/Al有机太阳能 电池(OSC),研究了双阴极修饰层对Rubrene/C70 OSC性能的影 响。实验结果表明,引入双阴极修饰层 后,器件的各性能参数有了显著提高。通过对PTCBI厚度优化发现,当PTCBI厚为5nm时器件 的各性 能参数最佳,器件的功率转换效率(PCE)=3.19%,电流密度Jsc=8.99mA·cm－2,开路电 压Voc=0.85V, 填充因子(FF)=41.58%,与未插入PTCBI 层相比器件的各性能分别提高了538%、338.5% 、13.3%和16.5%。     

Ca3Y2(Si3O9)2:Tb3+绿色荧光粉的光谱特性

采用高温固相法制备了Ca₃Y₂(Si₃O₉)₂: Tb³⁺绿色荧光粉,研究了材料的光学性能。X 射线衍射(XRD)结果显示,掺杂少量的Tb³⁺,并未影响Ca₃Y₂(Si₃O₉)₂材料 的晶相结构。Ca₃Y₂(Si₃O₉)₂:Tb³⁺ 荧光粉的激发光谱由较强的4f^75d1宽带吸收(200～300 nm )和较弱的4f-4f电子跃迁吸收 (300～500 nm)构成,主激发峰位于236nm。取波长分别为236、376和482nm的光 作为激发源时,发现样品的主发射峰均位于544 nm,对应Tb³⁺的⁵D 4→⁷F₅跃迁发射。以236nm 紫外光作为激发源,监测544nm主发射峰,随Tb³⁺浓度 的增大,Ca₃Y₂(Si ₃O₉)₂:Tb³⁺的荧光寿命逐渐减小,但在实验范围内并未出现浓度猝灭现象。     

Gd2O3:Yb3+,Er3+纳米粉体的水热合成及上转换发光研究

采用Gd₂O₃,Yb₂O₃,Er₂O₃,HNO₃,CO(NH₂)₂和C ₁₂H₂₅SO₄Na为实验原料,通过水热法合成了纳米Gd₂O₃:Yb³⁺,Er ³⁺上转换发光粉体。通过X射线衍射(XRD )、差示扫描量热 -热重分析(DSC-TGA )、傅里叶变换红外光谱(FT-IR ) 、透射电子显微镜(TEM )和 上转换发射光谱(UCL )等对样品进行表征。研究结果表明:CO(NH₂)₂与Gd ³⁺ 离子的摩尔比m影响前驱体的组成,当m=4时,前驱体是由晶态的 Gd₂(CO₃)₃·xH₂O构成。该 前驱体在空气气氛下800℃煅烧2h可获得单相的Gd₂O₃纳米粉体 ,粉体呈近球状,平均粒 径约为30～40nm。上转换发光光谱表明,在980nm波长红外光激发下,Gd₂O₃:Yb³⁺,Er³⁺的主发射峰 位于664nm波长处,呈红光发射,对应于Er³⁺的 ⁴F9/2→⁴I15/2跃迁。在波长为539 nm和562nm附近呈现绿光发射,分别对应于Er³⁺的²H11/2→⁴I15/2和⁴S3/2→⁴I15/2跃迁。Er³⁺的猝 灭浓度为1%。800℃煅烧合成的Gd₂O₃:Yb³⁺,Er³⁺ 纳米粉体的上转换发光机制为双光子模型, 而1200℃煅烧合成的Gd₂O₃:Yb³⁺,E r³⁺纳米粉体的上转换发光机制则为三光子模型。     

CaSi2O2N2:Ce3+/Eu2+荧光粉的发光性能研究

采用高温固相反应法制备了CaSi₂O₂N₂:C e³⁺/Eu ²⁺荧光粉,研究了分别掺杂Ce³⁺、Eu²⁺及Ce³⁺/Eu²⁺共掺 杂时荧光粉 的发光特性。CaSi₂O₂N₂:Ce³⁺在333 nm激发下得到宽波段的发射谱,发射峰 位于395nm,随着Ce³⁺浓度的增大,发 射波长出现明显的红移,猝灭浓度为1mol%。CaSi₂O₂N₂:Eu²⁺在397nm激发下得到峰值位于540nm处的宽波段发射谱, 猝灭浓度为1mol%。对于Ca0.99－2xSi₂O₂N₂:xCe ³⁺,xLi⁺,0.01Eu²⁺荧光粉,在333nm激发下,位于395nm处的发射峰十分微 弱,在540nm处有宽带发射,随着Ce³⁺浓度增大,位于540nm处的Eu²⁺的特征 发射显著增强。对于Ca0.98－ySi₂O₂N₂: 0.01Ce³⁺,0.01Li⁺,yEu²⁺荧光粉,在激发光波长 为333nm,Eu²⁺浓度较低时,可以观察到两个发射带,峰值分 别位于395nm及540nm,随着Eu²⁺浓度增加,位于395nm的 发射强度一直减小,而540nm处的发射强度先增加后减小,猝灭浓 度为0.4mol%。证实了Ce³⁺,Eu²⁺之间发生了有效的能 量传递。计算出Ce 3+、Eu²⁺之间能量传递的效率ηT,在Eu²⁺浓 度为 1mol%时ηT趋于饱和,达到97.7%。通过计算,得到Ce3+ 与Eu²⁺之间的能量传递方式为电偶极-电偶极相互作用。     

石墨烯掺杂Cs2CO3作为高效电子注入层的OLEDs性能研究

研制了石墨烯掺杂Cs₂CO₃(Cs₂CO₃:Graphe ne )作为高效电子注入层、结构为ITO/N,N′-bis-(1-naphthyl) -N,N′-diphenyl-1,1′-biphenyl-4,4′-diamine (NPB)(50 nm)/tris-(8-hydroxy quinoline)-aluminum Alq₃(80 nm)/Cs₂CO₃:Gra phene (mss 20% 1nm)/Al(120 nm)的OLEDs。将其与标准器件ITO/NPB(50 nm)/Alq₃(80 n m)/LiF(0.5 nm)/Al(120 nm)作性能比较,研究石墨烯掺杂在Cs₂CO₃中作为电子注入层 对 OLEDs性能的影响。结果表明,基于Cs₂CO₃:Graphene结构作为电子注入层的器 件效率要高于LiF作为电子注入层的器件,其最大电流效率达到2.02 cd/A, 是标准器件的2.59倍;亮度也高于LiF作为电子注入层的器件,在10 V时达 到最大值7690cd/m²,是标准器件最大亮度 的2.07倍。性能得到提高的主要机理是由于Cs₂CO₃:Graphene的引入提高了电子注入效率。     

白光LED用Ba0.955Al2Si2-xGexO8∶Eu2+荧光粉的晶体结构和光谱特性研究

采用高温固相法在弱还原气氛下制备了Ba0.955Al₂Si2－xGexO₈∶E u²⁺(x=0.0～1.0)系列荧 光粉,研究了Ge⁴⁺置换Si⁴⁺对其晶体结构和光谱特性的影响。Ge⁴⁺以类 质同相替代Ba长石(BaAl₂Si₂O₈) 晶格中的Si⁴⁺形成连续固溶体,晶胞参数a、b、c、β和晶胞体积V随Ge⁴⁺置换量呈线性递 增。荧光激发谱为宽带,位于230～400nm处,可拟合成4个峰,最大 峰值位于332nm;随着 Ge⁴⁺置换量的增加,半高宽(FWHM)从93nm减小到80nm。发射光谱位于375～600nm,可由422nm 和456nm两峰拟合而成,最大峰值位于434nm;随着Ge⁴⁺置换量Si⁴⁺进入基质晶格,造成 Eu-O距离变小,发光中心Eu²⁺所处晶体场增强,5d轨道 能级分裂变大,最低发射能级下移,两拟合峰均线性红移。     

YPO4:Dy3+,Eu3+荧光粉的水热合成及白光发射

采用水热法,合成了YPO₄:xDy³⁺,0.06Eu³⁺系列荧光粉。通过X射线衍射(XRD )、扫 描电子显微镜(SEM)、电子散射能谱(EDS)、光致发光(PL)谱和长余辉光谱,分别对样品的物 相、结构和PL进行了表征。 XRD检测表明,合成的样品属四方晶系;荧光光谱测试表明,在234nm紫外光激发下, YPO₄:xDy³⁺,0.06Eu³⁺的 发射光谱呈现Eu3+ 的⁵D₀→⁷F₁(592nm,橙光)和 ⁵D₀→ ⁷F₂(618nm,红光) 的发光峰;而在354nm的激发波长下,YPO₄:0.06Dy³⁺,0.06Eu³⁺的发射光谱 呈现Dy³⁺的4F9/2→⁶H15/2(486nm、蓝 光)和⁴F9/2→⁶H13/2(575nm、黄光)的发光 峰,以及Eu³⁺的⁵D₀→⁷F₁(592nm、 橙光)和⁵D₀→⁷F₂(619nm、红光 )的发光峰。对荧光 衰减谱的双参数拟合证实了Dy³⁺→Eu³⁺能量 传递的存在。色坐标图显示,在234nm紫外光激发下,YPO₄:0.05Dy ³⁺,0.06Eu3+ 是很好的近紫外光激发下的白色荧光粉。     

新型红色荧光粉Ca0.5Sr0.5MoO4:Sm3+的制备及光学性能

为了得到发光效率较好的长波长红色荧光粉,采用 高温固相法成功地合成了适合紫外激发的红色荧光粉 Ca0.5－xSr0.5MoO₄:xSm³⁺,研究了其晶体结构和发 光性质。X射线衍射(XRD)测量结果显示,制备的样品为纯相Ca0.5Sr0.5MoO₄晶体。其激发 光谱包括一个宽带峰和一系列尖峰,通过不同波长激发的发射谱和与Ca0. 5－xSr0.5MoO₄:xEu³⁺的发射 谱比较分析得出激 发宽带为最有效激发带,归属于Mo⁶⁺－O2－的电荷迁移跃迁。在275nm的激发 下,发射峰由峰值为564nm(⁴G5/2→⁶H 5/2)、 606nm(4G5/2→⁶H7/2) 、647nm (⁴G5/2→⁶H9/2)、707nm(4G5/2→⁶H11/2)的4个峰组成,最大发射 峰位于647nm处,呈现红光 发射。Sm³⁺掺杂高于6%时Ca0.5－xSr0.5Mo O₄:xSm³⁺出现浓度猝灭,分析表明,其猝灭机 理是最邻近离子间的能量传递。同时,添加电荷补偿剂可增强材料的发射强度,以添加Na +的效果最明显。     

混响室中混响时间测量测点位置的探讨

在分析了混响室中引起混响时间测量随机误差之后,提出将测点置于混响室角点上,这是更为合理的测量方法。     

Sensor effect in YBa2 Cu3 Oy

The high-T_c superconducting material YBa₂ Cu₃ O_y, well known as a 1–2–3 compound, shows other very interesting properties. One of them is very strong conductivity-oxygen content dependence. On the basis of our previous measurements, an investigation of dilatation synthesis, X-ray diffraction (XRD) analysis and conductivity measurements were performed. The results on quenched and slowly cooled samples show a phase transition region and an obvious interdependence between conductivity, unit cell volume and oxygen content.     

Materials characterization of WNxCy, WNx and WCx films for advanced barriers

A ternary WN_xC_y system was deposited in a thermal ALD (atomic layer deposition) reactor from ASM at 300 °C in a process sequence using tungsten hexafluoride (WF₆), triethyl borane (TEB) and ammonia (NH₃) as precursors. The WC_x layers were deposited by a novel ALD process at a process temperature of 250 °C. The WN_x layers were deposited at 375 °C using bis(tert-butylimido)-bis-(dimethylamido)tungsten (^tBuN)₂(Me₂N)₂W (imido-amido) and NH₃ as precursors. WN_x grows faster on plasma enhanced chemical vapor deposition (PECVD) oxide than WC_x does on chemical oxide. WN_xC_y grows better on PECVD oxide than on thermal oxide, which is opposite of what is seen for WN_x. In the case of the ternary WN_xC_y system, the scalability towards thinner layers and galvanic corrosion behavior are disadvantages for the incorporation of the layer into Cu interconnects. ALD WC_x based barriers have a low resistivity, but galvanic corrosion in a model slurry solution of 15% peroxide (H₂O₂) is a potential problem. Higher resistivity values are determined for the binary WN_x layers. WN_x shows a constant composition and density throughout the layer.     

具有SiO2/SiNX/SiO2 复合绝缘层的有机薄膜晶体管

We have investigated a SiO_2/SiN_x/SiO_2 composite insulation layer structured gate dielectric for an organic thin film transistor(OTFT) with the purpose of improving the performance of the SiO_2 gate insulator. The SiO_2/SiN_x/SiO_2 composite insulation layer was prepared by magnetron sputtering.Compared with the same thickness of a SiO_2 insulation layer device,the SiO_2/SiN_x/SiO_2 composite insulation layer is an effective method of fabricating OTFT with improved electric characteristics and decrease...     

Comparison between Pt/TiO2/Pt and Pt/TaOX/TaOY/Pt based bipolar resistive switching devices

Nonvolatile memories have emerged in recent years and have become a leading candidate towards replacing dynamic and static random-access memory devices. In this article, the performances of TiO₂ and TaO₂ nonvolatile memristive devices were compared and the factors that make TaO₂ memristive devices better than TiO₂ memristive devices were studied. TaO₂ memristive devices have shown better endurance performances (10⁸ times more switching cycles) and faster switching speed (5 times) than TiO₂ memristive devices. Electroforming of TaO₂ memristive devices requires~4.5 times less energy than TiO₂ memristive devices of a similar size. The retention period of TaO₂ memristive devices is expected to exceed 10 years with sufficient experimental evidence. In addition to comparing device performances, this article also explains the differences in physical device structure, switching mechanism, and resistance switching performances of TiO₂ and TaO₂ memristive devices. This article summarizes the reasons that give TaO₂ memristive devices the advantage over TiO₂ memristive devices, in terms of electroformation, switching speed, and endurance.     

H2/O2 plasma on polysilicon thin-filmtransistor

It is reported for that H₂ plasma followed by O₂ plasma is more effective for passivating grain boundary states in polysilicon thin film. Polysilicon thin-film transistors (TFTs) made after H₂/O₂ plasma treatment can exhibit a turn-on threshold voltage of -0.1 V, a subthreshold swing of 0.154 V/decade, an ON/OFF current ratio I_on/I_off over 1×10⁸, and an electron mobility of 40.2 cm² /V-s     

SiNx/SiOxNy叠层结构防潮能力的研究

研究了等离子体增强化学气相沉积(PECVD)工艺参数对SiN_x及SiO_xN_y防潮能力的影响,并测试了SiN_x/SiO_xN_y叠层薄膜的水汽渗透速率(WVTR)。实验结果表明:单层SiN_x薄膜和SiO_xN_y薄膜都存在临界厚度,当膜厚大于临界值时,继续增大厚度不会明显改善薄膜的WVTR。当沉积温度从50℃提高到250℃,SiN_x薄膜的WVTR从0.031g/(m²·day)降至0.010g/(m²·day)。SiO_xN_y沉积时,增大N₂O通入量对薄膜的WVTR影响不明显,但可以有效改善薄膜的弯曲性能。最后,4个SiN_x/SiO_xN_y叠层膜的WVTR下降到了4.4×10-4g/(m²·day)。叠层膜防潮能力的显著提升归因于叠层结构可以有效解耦层与层之间的缺陷,延长水汽渗透路径。     

Kinetics of chemical vapor deposition of WSix films from WF6 and SiH2Cl2: Effect of added H2, SiH4, and Si2H6

This paper describes reaction kinetics of chemical vapor deposition of WSi_x films from WF₆ and SiH₂Cl₂, focusing on the effect of added H₂, SiH₄, and Si₂H₆ as an active reaction initiator. Our studies indicate that the temperature at which film formation is extinguished, T_ex, can be lowered by introducing H₂ instead of the standard Ar carrier gas. For a SiH₂Cl₂/WF₆ pressure ratio of 20, H₂ addition changed the deposition mode from selective W deposition to blanket WSi_x deposition. The added H₂ also improved the step-coverage profile for substrate temperatures below 600 °C. Measured step coverage profiles indicate that the activation energy of deposition species was 147 kJ/mol. Adding either SiH₄ or Si₂H₆ can assist the film-forming reactions to achieve acceptable Si/W atomic composition ratios. Under these conditions, the residual fluorine concentration remained at acceptably low levels that are typical of conventional WF₆/SiH₂Cl₂ CVD processes.     

TiO_2/SiO_2、ZrO_2/SiO_2多层介质膜光学损耗及激光损伤研究

以TiO_2/SiO_2及ZrO_2/SiO_2多层介质膜为例,测试了不同工艺条件及不同膜系结构下薄膜样品的光学损耗及激光损伤阈值,同时对实验结果作了初步的分析讨论.     

Characterization of the annealing impact on La2O3/HfO2 and HfO2/La2O3 stacks for MOS applications

The impact of various rapid thermal annealing used during the integration on the La₂O₃/HfO₂ and HfO₂/La₂O₃ stacks deposited by Atomic Layer deposition was analyzed. The consequences of lanthanum localization in such stacks on the evolution of the films during the rapid thermal annealing are investigated in term of morphology, crystalline structure, silicate formation and film homogeneity as a function of the depth. It appeared that the La₂O₃ location has an impact on the temperature of the quadratic phase formation which could be linked to the formation of SiOHfLa silicate and the resistance of the films to dissolution in HF 0.05 wt%.