利用X射线衍射研究Mg掺杂的InN的快速退火特性

研究了不同的快速退火(RTA)温度对Mg掺杂的InN材料的影响。根据马赛克微晶模型,利用X射线衍射(XRD)技术,对样品的对称面和非对称面做ω扫描,并且通过倒异空间图(RSM)扫描,拟合得到了刃位错与螺位错密度,并且根据在不同快速退火温度条件下位错密度的比较,同时结合迁移率的测量结果,发现快速退火温度采用400℃能有效地提高晶体的质量。原因在于快速退火能有效地激活Mg原子活性,降低材料中的载流子浓度,同时快速退火采用的氮气气氛能补偿部分起施主作用的氮空位,降低材料中载流子浓度的同时也降低了缺陷。同时,(002)面的摇摆曲线半峰全宽(FWHM)也很好地验证了所得结果。     

退火温度对ZnO薄膜晶体管电学性能的影响

采用光刻剥离法和射频磁控溅射技术在带有热氧化层的硅衬底上制备了以氧化锌(ZnO)为沟道层的薄膜晶体管(ZnO-TFT).研究了不同温度退火处理对ZnO-TFT电学性能的影响,发现随着ZnO薄膜退火温度的增加,ZnO-TFT的阈值电压减小,电子的场效应迁移率增大.用原子力显微镜(AFM)对ZnO薄膜的微区结构进行观察,发现ZnO薄膜的平均粒径随退火温度的增加而增大,表明ZnO-TFT电学性质和沟道层薄膜晶粒大小密切相关.     

分子束外延GaAs基M-HEMT与Si基HEMT材料研究北大核心

在GaAs基渐变缓冲层高迁移率晶体管(M-HEMT)器件中,二维电子气的输运性能对器件性能有决定性作用。系统研究了GaAs M-HEMT材料中不同In组分沟道和生长温度对沟道电子迁移率和薄层电子浓度的影响。结果表明,沟道In组分为0.65时,材料电学性能最好;提高生长温度能有效提高材料的迁移率。为了后续将Si CMOS技术与HEMT材料结合实现高集成度应用,将M-HEMT结构外延在硅衬底上并得到了初步的研究结果,室温下电子迁移率为3300 cm^(2)/(V·s),薄层电子浓度为4.5×10^(12)cm^(-2)。     

As~+、Si~+双注入GaAs瞬态退火的行为

研究了不同能量、剂量As~+、Si~+双注入于SI GaAs中,As~+注入对注Ss~+有源层的影响.首次给出了双注入样品瞬态退火后有源层的激活率和载流子迁移率,退火前后材料的沟道谱.实验表明,As~+、Si~+双注入样品比Si~+单注入样品在较低退火温度下就能激活Si~+,在适当高温下能得到性能良好的有源层.     

GaAs PHEMT材料中2DEG浓度的控制与测试研究

设计并使用分子束外延(MBE)方法制备了不同帽层厚度、不同掺杂浓度的双平面掺杂GaAs PHEMT外延材料,采用不同工艺手段控制InGaAs沟道异质结界面的平滑程度。采用非接触霍尔方法对样品二维电子气(2DEG)浓度及迁移率进行测试,并用范得堡法对实验结果加以验证。结果表明,平整异质结界面生长技术能有效控制高迁移率2DEG浓度分布;与范德堡法相比,非接触霍尔方法无破坏性、测试结果可靠,该结果可以用来分析多层结构的PHEMT外延材料中InGaAs沟道界面的生长情况。     

GaAs PHEMT材料电子迁移率的非接触测试

非接触迁移率测试是一种测试载流子浓度以及迁移率的新型方法,与传统的范德堡霍尔测试相比,具有无损测量和分层测试等诸多优点。分别采用传统的范德堡霍尔测试法和新型的非接触迁移率测试法对不同帽层厚度、不同掺杂浓度的GaAs PHEMT样品进行测试分析。结果表明,在盖帽层很薄的情况下,两种测试方法所测得的电子浓度以及迁移率一致,而在盖帽层较厚的情况下,由于受盖帽层重掺杂电子的影响,范德堡霍尔测试无法测得沟道内二维电子气(2DEG)浓度和迁移率,而非接触式迁移率测试法可以将盖帽层和沟道层分开,准确地测得沟道内2DEG浓度和迁移率。     

GaAs/Al_xGa_(1-x)As调制掺杂材料的高温退火特性

本文对调制掺杂GaAs/Al_xGa_(1-x)As异质结材料进行无包封过砷压下高温退火。与未经退火材料相比较,高温退火会引起调制掺杂材料的电学性质明显退化.基于Hall和I-V特性测量结果,对造成二维电子气(2-DEG)迁移率下降的原因进行了分析和讨论.     

合金条件对Al/n~+-Ge欧姆接触的影响

Ge比Si具有更高的电子和空穴迁移率,且Ge材料可以应用于1.3～1.5μm近红外波段,因此Ge成为制备微电子和光电子器件的主要材料。然而由于Ge的费密能级钉扎效应以及难以获得高浓度的磷(P)原位掺杂,使得n-Ge的欧姆接触成为一个难题。采用P+离子注入获得高掺杂浓度的n-Ge材料,掺杂浓度为1.5×1019cm-3;依据圆形传输线模型(CTLM)制备了一系列Al/n+-Ge样品,研究了不同退火温度和退火方式对其接触特性的影响。实验结果表明,Al/n+-Ge样品通过400℃快速热退火(RTA)30 s表现出欧姆接触特性,并且接触电阻率ρc最低,为1.3×10-5Ω·cm2。     

HEMT太赫兹探测器的二维电子气特性分析

采用分子束外延技术(MBE)对GaAs/Al_xGa_(1-x)As二维电子气(2DEG)样品进行了制备,样品制备过程中,通过改变Al的组分含量、隔离层厚度、对比体掺杂与δ掺杂两种方式,在300 K条件下对制备的样品进行了霍尔测试,获得了室温迁移率7.205E3cm~2/Vs,载流子浓度为1.787E12/cm~3的GaAs/Al_xGa_(1-x)As二维电子气沟道结构,并采用Mathematica软件分别计算了不同沟道宽度时300 K、77 K温度下GaAs基HEMT结构的太赫兹探测响应率,为HEMT场效应管太赫兹探测器的研究和制备提供了参考依据.     

自由电子激光对GaAs/AlGaAs异质结构材料电学性质的影响

自由电子激光(FEL)辐照样品前和辐照样品时,使用变温霍尔测量系统测试了这种n型调制掺杂GaAs/AlGaAs异质结构材料中准二维电子气(2DEG)的迁移率、电子浓度和电阻率。对比这两种情况下的结果可以发现:1)迁移率随温度升高而降低,光照使迁移率增大;2)电子浓度随温度变化关系相对较为复杂,但是平均而言,光照会使电子浓度减小;3)电阻率随温度升高而升高,光照使电阻率减小,但这种影响不明显。对这些现象给出了具体的分析。     

The correlation of channel mobility with interface state measurements on InP MOSFET structures

The channel mobilities of InP MOSFETS fabricated using three different types of insulator (viz. Al₂O₃, as deposited SiO₂ and annealed SiO₂.) have been measured. The interface state densities for each type of insulator-InP interface have been determined by the conductance technique. The results have been compared and a strong correspondence has been found between low interface state density and high channel mobility. A drastic reduction in interface state density was produced by annealing the SiO₂ insulator at high temperature and this process also produced transistors with the highest mobility.     

Electron and hole mobilities in inversion layers on thermally oxidized silicon surfaces

Extensive measurements of electron and hole mobilities in inversion layers on thermally oxidized silicon surfaces were performed using the field effect conductance technique. It was found that both electron and hole mobilities are practically constant and approximately equal to one half of their respective bulk values up to a surface field of about 1.5 × 10⁵volts/cm, corresponding to about 10¹²electronic charges/cm²induced in the silicon. At higher fields the inversion layer mobilities begin to decrease slightly. The temperature dependence of inversion layer mobilities follows a T^-1.5rule at the upper range of the interval -196 to 200°C, indicating a scattering mechanism similar to lattice scattering. This observation is further supported by the lack of a significant effect of an order-of-magnitude variation in the bulk impurity concentration (10¹⁵- 10¹⁶cm³) on the inversion layer mobilities. No significant effect of structural and geometrical parameters (such as channel length and shape, oxide type and thickness, and surface charge density) was found on the inversion layer mobilities.     

GaAs衬底上Mn／Sb多层铁磁膜的磁光克尔效应

利用超高真空电子束蒸发技术GaAs(100）上生长Mn/Sb多层膜,并经短时间热退火处理分别研究了其退火前后的磁性、磁光克尔效应及相应规律,退火前Mn/Sb膜在室温下即具有较强的铁磁特性,其易磁化轴在膜面内,样品表面由密集的岛状铁磁颗粒组成,未能观测到纵向（H//平面）克尔效应,经350℃、20min退火的样品显示了最大饱和磁化强度Ms和最小矫顽力Hc,X射线衍射测量表明膜为MnSb单晶并具有均匀的铁磁特性,能观测到显著的要有向和纵向磁光克尔效应,其随磁场变化表现出相应于磁化强度的磁带行为。     

Effect of the post-gate annealing on the gate reliability of AlGaN/GaN HEMTs

In this paper,we investigated the effect of post-gate annealing (PGA) on reverse gate leakage and the reverse bias reli-ability of Al0.23Ga0.77N/GaN high electron mobility transistors (HEMTs).We found that the Poole-Frenkel (PF) emission is domin-ant in the reverse gate leakage current at the low reverse bias region (Vth ＜ VG ＜ 0 V) for the unannealed and annealed HEMTs.The emission barrier height of HEMT is increased from 0.139 to 0.256 eV after the PGA process,which results in a reduction of the reverse leakage current by more than one order.Besides,the reverse step stress was conducted to study the gate reliabil-ity of both HEMTs.After the stress,the unannealed HEMT shows a higher reverse leakage current due to the permanent dam-age of the Schottky gate.In contrast,the annealed HEMT shows a little change in reverse leakage current.This indicates that the PGA can reduce the reverse gate leakage and improve the gate reliability.     

Defects in molecular beam epitaxial GaAs grown at low temperatures

We have utilized a variable energy positron beam and infrared transmission spectroscopy to study defects in GaAs epilayers grown at low temperatures (LT-GaAs) by molecular beam epitaxy. We have measured the Doppler broadening of the positron-electron annihilation gamma ray spectra as a function of positron implantation energy. From these measurements, we have obtained results for the depth profiles of Ga monovacancies in unannealed LT-GaAs and Ga monovacancies and arsenic cluster related defects in annealed LT-GaAs. We have also studied the effects of the Si impurities in annealed LT-GaAs. The infrared transmission measurements on unannealed LT-GaAs furnish a broad defect band, related to As antisites, centered at 0.370 eV below the conduction band.     

Application of quantitative mobility-spectrum analysis to multilayer HgCdTe structures

For modern semiconductor heterostructures containing multiple populations of distinct carrier species, conventional Hall and resistivity data acquired at a single magnetic field provide far less information than measurements as a function of magnetic field. However, the extraction of reliable and accurate carrier densities and mobilities from the field-dependent data can present a number of difficult challenges, which were never fully overcome by earlier methods, such as the multicarrier fit, the mobility-spectrum analysis of Beck and Anderson, and the hybrid mixed-conduction analysis. More recently, to overcome the limitations of those methods, several research groups have contributed to development of the quantitative mobility-spectrum analysis (QMSA), which is now available as a commercial product. The algorithm is analogous to a fast Fourier transform in that it transforms from the magnetic-field (B) domain to the mobility (μ) domain. The QMSA converts the field-dependent Hall and resistivity data into a visually meaningful transformed output, comprising the conductivity density of electrons and holes in the mobility domain. In this article, we apply QMSA to both synthetic and real experimental data that are representative of modern multilayer HgCdTe structures. We discuss such features as the accuracy of the extraction of individual layer conductivities and average mobilities, reconstruction of the carrier mobility distribution within a particular layer, the resolution of two carriers with similar mobilities, and limits of the sensitivity.     

A simple parallel conduction extraction method (SPCEM) for MODFETs and undoped GaN-based HEMTs

We report a simple method to extract the mobility and sheet carrier densities of conduction channels in conventional modulation doped field-effect transistor (MODFET) structures and unintentionally doped GaN-based high-electron mobility transistor (HEMT) structures for a special case. Extraction of the conduction channels from the magnetic field-dependent data can present number of problems; even the most recent methods encounter great difficulties. For the GaN-based HEMT structures which have lower mobilities and larger effective masses than that of GaAs-based counterparts, these difficulties become more prominent. In this study, we describe a simple method for magnetotransport analysis to extract conduction channels successfully for a special case that is commonly encountered: one bulk channel and one two-dimensional electron gas (2DEG) channel. Advantage of this method is mainly its simplicity. The analysis can be done with only two magnetic field-dependent measurements per temperature step. The method is applied to the magnetotransport results of an unintentionally doped AlGaN/AlN/GaN/AlN heterostructure over a temperature range of 29-350 K and in a magnetic field range of 0-1.5 T (μB<1). The results are then compared with those obtained using a commercial package for these calculations namely: quantitative mobility spectrum analysis (QMSA).     

Photo‐induced Charge Transfer and Relaxation of Persistent Charge Carriers in Polymer/Nanocrystal Composites for Applications in Hybrid Solar Cells

The photo‐induced charge transfer and the dynamics of persistent charge carriers in blends of semiconducting polymers and nanocrystals are investigated. Regioregular poly(3‐hexylthiophene) (P3HT) is used as the electron donor material, while the acceptor moiety is established by CdSe nanocrystals (nc‐CdSe) prepared via colloidal synthesis. As a reference system, organic blends of P3HT and [6,6]‐phenyl C₆₁‐butyric acid methyl ester (PCBM) are studied as well. The light‐induced charge transfer between P3HT and the acceptor materials is studied by photoluminescence (PL), photo‐induced absorption (PIA) and light‐induced electron spin resonance spectroscopy (LESR). Compared to neat P3HT samples, both systems show an intensified formation of polarons in the polymer upon photo‐excitation, pointing out successful separation of photogenerated charge carriers. Additionally, relaxation of the persistent charge carriers is investigated, and significant differences are found between the hybrid composite and the purely organic system. While relaxation, reflected in the transient signal decay of the polaron signal, is fast in the organic system, the hybrid blends exhibit long‐term persistence. The appearance of a second, slow recombination channel indicates the existence of deep trap states in the hybrid system, which leads to the capture of a large fraction of charge carriers. A change of polymer conformation due to the presence of nc‐CdSe is revealed by low temperature LESR measurements and microwave saturation techniques. The impact of the different recombination behavior on the photovoltaic efficiency of both systems is discussed.     

The effect of post-oxygen-implant annealing temperature on the channel mobilities of CMOS devices in oxygen-implanted silicon-on-insulator structures

The effects of post-oxygen-implant annealing temperature on the characteristics of MOSFET's in oxygen-implanted silicon-on-insulator (SOI) substrates are studied. The results show significant improvements in the electron and hole mobilities near the silicon/buried-oxide interface and in the electron mobility of the front-gate n-channel transistors in SOI substrates with higher post-oxygen-implant annealing temperature. The improvements in the transistor characteristics hence are attributed to the annihilation of oxygen precipitates and the reduction of defect density in the residual silicon film. By comparing the ring oscillators fabricated in SOI substrates annealed at 1150°C and 1250°C after oxygen implantation, a speed improvement of 15 percent is observed in substrates annealed at higher temperature.     

Investigation of Multicarrier Transport in LPE-Grown Hg<Subscript>1−<Emphasis Type="Italic">x</Emphasis></Subscript>Cd<Subscript><Emphasis Type="Italic">x</Emphasis></Subscript>Te Layers

A detailed study is presented of multicarrier transport properties in liquid-phase epitaxy (LPE)-grown n-type HgCdTe films using advanced mobility spectrum analysis techniques over the temperature range from 95 K to 300 K. Three separate electron species were identified that contribute to the total conduction, and the temperature-dependent characteristics of carrier concentration and mobility were extracted for each individual carrier species. Detailed analysis allows the three observed contributions to be assigned to carriers located in the bulk long-wave infrared (LWIR) absorbing layer, the wider-gap substrate/HgCdTe transition layer, and a surface accumulation layer. The activation energy of the dominant high-mobility LWIR bulk carrier concentration in the high temperature range gives a very good fit to the Hansen and Schmit expression for intrinsic carrier concentration in HgCdTe with a bandgap of 172 meV. The mobility of these bulk electrons follows the classic μ ~ T ^−3/2 dependence for the phonon scattering regime. The much lower sheet densities found for the other two, lower-mobility electron species show activation energies of the order of ~20 meV, and mobilities that are only weakly dependent on temperature and consistent with expected values for the wider-bandgap transition layer and a surface accumulation layer.