共查询到18条相似文献,搜索用时 140 毫秒
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硅衬底结构LED芯片阵列封装热可靠性分析 总被引:1,自引:0,他引:1
海洋 《电子工业专用设备》2010,39(11):31-34,45
LED阵列封装是高密度电子封装的解决方案之一,LED的光集成度得到提高,总体输入功率提高,但同时其发热量大,封装结构如果不合理,那么在温度载荷下各层材料热膨胀系数的差异将会导致显著的热失配现象,从而将会大大缩短LED的寿命。为此,兼顾散热和封装的可靠性设计与表面贴装式将芯片直接焊接在铝基板上不同的是采用硅衬底过渡,同时在硅衬底上布置电路这一结构。这种结构的优点是可以通过硅衬底的过渡来降低热失配对封装结构的影响,同时硅衬底作为电路层则省去了器件引脚。通过对4×4的LED芯片阵列结构进行有限元模拟,分析了温度对带有硅衬底的LED芯片阵列封装可靠性影响,同时对硅衬底进行分析和总结。 相似文献
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介绍了Si衬底功率型GaN基LED芯片和封装制造技术,分析了Si衬底功率型GaN基LED芯片制造和封装工艺及关键技术,提供了产品测试数据。Si衬底LED芯片制备采用上下电极垂直结构与Ag反射镜工艺,封装采用仿流明大功率封装,封装后白光LED光通量达80 lm,光效达70 lm/W,产品已达商品化。与蓝宝石和SiC衬底技术路线相比,Si衬底LED芯片具有原创技术产权,可销往任何国家而不受国际专利的限制。产品抗静电性能好,寿命长,可承受的电流密度高,具有单引线垂直结构,器件封装工艺简单,而且生产效率高,成本低廉。其应用前景广阔,是值得大力发展的一门新技术。 相似文献
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LED封装中的散热研究 总被引:4,自引:1,他引:3
文章论述了大功率LED封装中的散热问题,说明它对器件的输出功率和寿命有很大的影响,分析了小功率、大功率LED模块的封装中的散热对光效和寿命的影响。对封装及应用而言,增强它的散热能力是关键技术,指出对大功率LED和LED模块散热设计很重要,因为大功率白光LED的光效和寿命取决于其散热。目前大功率LED的重点是提高散热能力,说明封装结构和封装材料在提高大功率LED散热中的影响,LED模块的散热是未来的重点。通过选用高热导率材料可以使温度得到显著控制,重点论述了封装的关键技术,最后指出了未来LED封装技术的发展趋势。 相似文献
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一种高功率白光LED灯具的封装热设计研究 总被引:1,自引:0,他引:1
建立了一种大功率白光LED照明灯具的封装结构,采用ANSYS有限元软件对其进行热分析,根据热分析的结果逐步改进封装结构,在考虑成本和尺寸限制的条件下,对LED的封装散热结构进行了优化. 相似文献
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介绍了一种带有凹槽和硅通孔(through silicon via,TSV)的硅基制备以及晶圆级白光LED的封装方法。针对硅基大功率LED的封装结构建立了热传导模型,并通过有限元软件模拟分析了这种封装形式的散热效果。模拟结果显示,硅基封装满足LED芯片p-n结的温度要求。实验结合半导体制造工艺,在硅基板上完成了凹槽和通孔的制造,实现了LED芯片的有效封装。热阻测试仪测得硅基的热阻为1.068K/W。实验结果证明,这种方法有效实现了低热阻、低成本、高密度的LED芯片封装,是大功率LED封装发展的重要方向。 相似文献
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Design and Simulation of High-power LED Array Packaging 总被引:2,自引:0,他引:2
Thermal management is one of the key technologies for high-power Light emitting diode(LED) entering into the general illuminating field. Successful thermal management depends on optimal packaging structure and selected packaging materials. In this paper, the aluminum is employed as a substrate of LED, 3×3 array chips are placed on the substrate, heat dissipation performance is simulated using finite element analysis(FEA) software, analyzed are the influences on the temperature of the chip with different convection coefficient, and optical properties are simulated using optical analysis software. The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency. 相似文献
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散热是大功率LED封装的关键技术之一,散热不良将严重影响LED器件的出光效率、亮度和可靠性。影响LED器件散热的因素很多,包括芯片结构、封装材料(热界面材料和散热基板)、封装结构与工艺等。文章具体分析了影响大功率LED热阻的各个因素,指出LED散热是一个系统概念,需要综合考虑各个环节的热阻,单纯降低某一热阻无法有效解决LED的散热难题。文中还对国内外降低LED热阻的最新技术进行了介绍。 相似文献
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The status and prospects for high-power, phosphor-based white light-emitting diode (LED) pack-aging have been presented. A system view for packaging design is proposed to address packaging issues. Four aspects of packaging are reviewed: optical control, thermal management, reliability and cost. Phosphor materials play the most important role in light extraction and color control. The conformal coating method improves the spatial color distribution (SCD) of LEDs. High refractive index (RI) encapsulants with high transmittance and modified surface morphology can enhance light extraction. Multi-phosphor-based packaging can realize the control of correlated color temperature (CCT) with high color rendering index (CRI). Effective thermal management can dissipate heat rapidly and reduce thermal stress caused by the mismatch of the coefficient of thermal expansion (CTE). Chip-on-board (COB) technology with a multi-layer ceramic substrate is the most promising method for high-power LED packaging. Low junction temperature will improve the reliability and provide longer life. Advanced processes, precise fabrication and careful operation are essential for high reliability LEDs. Cost is one of the biggest obstacles for the penetration of white LEDs into the market for general illumination products. Mass production in terms of CoB, system in packaging (SIP), 3D packaging and wafer level packaging (WLP) can reduce the cost significantly, especially when chip cost is lowered by using a large wafer size. 相似文献
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Flexible light-emitting diodes(LEDs)are highly desired for wearable devices,flexible displays,robotics,biomedicine,etc.Traditionally,the transfer process of an ultrathin wafer of about 10–30μm to a flexible substrate is utilized.However,the yield is low,and it is not applicable to thick GaN LED chips with a 100μm sapphire substrate.In this paper,transferable LED chips utilized the mature LED manufacture technique are developed,which possesses the advantage of high yield.The flexible LED array demonstrates good electrical and optical performance. 相似文献
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《Microelectronics Reliability》2014,54(6-7):1223-1227
3D-integration becomes more and more an important issue for advanced LED packaging solutions as it is a great challenge for the thermo-mechanical reliability to remove heat from LEDs to the environment by heat spreading or specialized cooling technologies. Thermal copper-TSVs provide an elegant solution to effectively transfer heat from LED to the heat spreading structures on the backside of a substrate. But, the use of copper-TSVs generates also novel challenges for reliability as well as also for reliability analysis and prediction, i.e. to manage multiple failure modes acting combined – interface delamination, cracking and fatigue, in particular. In this case, the thermal expansion mismatch between copper and silicon yields to risky stress situations.To overcome cracking and delamination risks in the vicinity of thermal copper-TSVs the authors performed extensive simulative work by means of fracture mechanics approaches – an interaction integral approach within a simulative DoE and the X-FEM methodology to help clarifying crack propagation paths in silicon. The results provided a good insight into the role of model parameters for further optimizations of the intended thermal TSV-approaches in LED packaging applications. 相似文献