基于环形振荡器的TSV故障非接触测试方法

为避免传统的探针检测对硅通孔(TSV)造成损伤的风险,提出了一种非损伤的TSV测试方法.用TSV作为负载,通过环形振荡器测量振荡周期.TSV缺陷造成电阻电容参数的变化,导致振荡周期的变化.通过测量这些变化可以检测TSV故障,同时对TSV故障的不同位置引起的周期变化进行了研究与分析,利用最小二乘法拟合出通过周期来判断故障位置的曲线,同时提出预测模型推断故障电阻范围.测试结构是基于45 nm PTM COMS工艺的HSPICE进行设计与模拟,模拟结果表明,与同类方法相比,此方法在测试分辨故障的基础上对TSV不同位置的故障进行分析和判断,并能推断故障电阻范围.     

3D-IC中基于时分复用的TSV蜂窝容错设计

三维芯片(3D-IC)通过硅通孔(TSV)技术来实现电路的垂直互连,延续了摩尔定律,但在制造、绑定等过程中,TSV容易引入各类缺陷。添加冗余TSV是解决该问题的有效方法之一,但TSV面积开销大、制造成本高。提出一种基于时分复用(TDMA)的TSV蜂窝结构容错设计方案,它基于时间对信号TSV进行复用。实验结果表明,与一维链式TDMA结构相比,蜂窝TDMA结构提高了30%的故障覆盖率,并且故障覆盖率随着蜂窝阵列的扩展持续提升。在64TSV阵列中,与一维TDMA结构相比,蜂窝拓扑结构的面积开销降低了10.4%。     

一种基于仲裁器的键合前硅通孔测试方法

硅通孔(TSV)故障严重降低了三维集成电路的良率和可靠性。为了在制造流程中尽早精确地排除TSV故障,提出了一种基于仲裁器的键合前TSV测试方法。由于高电平信号通过故障TSV的延迟时间小于无故障TSV,比较被测TSV与无故障TSV的延迟时间,即可判断被测TSV是否存在故障,比较结果由仲裁器给出。依次将被测TSV的延迟时间与不同的延迟时间相比,可对其延迟进行区间定位,实现TSV故障分级。实验结果表明,该方案能够检测出开路电阻大于281 Ω的电阻开路故障、泄漏电阻小于223 MΩ的泄漏故障,有效解决了两种TSV故障共存的检测问题。与现有同类方法相比,该方法提高了测试精度,增加了可检测故障范围,并且可以进行故障分级。     

基于非接触探头的TSV裂纹故障建模与分析

传统的探针测试会对晶圆产生较大的接触应力,从而给晶圆带来物理性损伤.提出一种基于串扰耦合理论的非接触探头结构,来实现对硅通孔(TSV)裂纹故障的非接触测试.首先在HFSS三维电磁仿真软件中建立非接触探头结构,通过仿真分析可知,探头与TSV之间形成较强的电场,可以实现对TSV裂纹故障非接触测试的目的.然后建立非接触探头与TSV GS结构的等效电路,并通过相关的解析方程提取其元件参数.通过分析TSV裂纹故障的生长规律,对TSV裂纹故障建立等效电路,并建立基于物理参数的故障解析方程及提取RC元件参数.在ADS软件中进行等效电路仿真,通过观察输出电压峰值的变化,可以得出TSV裂纹故障的大小.实验结果表明,该方法可以实现对TSV裂纹故障大小的测试.     

基于TSV绑定的三维芯片测试优化策略

本文提出一种三维片上系统(3D SoC)的测试策略,针对硅通孔(TSV,Through Silicon Vias)互连技术的3D SoC绑定中和绑定后的测试进行优化,由于测试时间和用于测试的TSV数目都会对最终的测试成本产生很大的影响,本文的优化策略在有效降低测试时间的同时,还可以控制测试用的TSV数目,从而降低了测试成本.实验结果表明,本文的测试优化策略与同类仅考虑降低测试时间的策略相比,可以进一步降低约20%的测试成本.     

消除硅通孔侧壁刻蚀损伤的方法

硅通孔刻蚀是TSV技术的重要工序步骤,采用标准博世（Bosch）工艺刻蚀硅通孔（宽为150μm）,发现硅通孔侧壁出现多处刻蚀损伤。通过优化Bosch工艺参数增加沉积保护,消除了硅通孔侧壁刻蚀损伤问题,通孔开口差值,即通孔下开口宽度与通孔上开口宽度的差,从原来的22μm减小到13μm。利用优化后的工艺配方对硅通孔和硅腔(宽为1 500μm)同时进行刻蚀时,发现硅腔刻蚀后会产生硅针,不能应用到实际生产。经过多轮次Bosch工艺参数调整,把Bosch工艺沉积步骤的偏置功率设置为10 W,同时解决了硅通孔侧壁刻蚀损伤和硅腔刻蚀出现硅针问题,最终成功应用到MEMS环形器系列产品当中。     

3D TSV测试的挑战和潜在解决方案(英文)

3D硅通孔技术增加电路密度、降低功耗、提高带宽的优势在业内已得到广泛的认可。随着3D TSV技术的迅速发展,对于测试成本的优化就显得尤为突出,现有的测试方法已提出了很多挑战3D TSV技术的解决方案。提出了一种不同的应对3D TSV测试技术挑战的完整的3DTSV测试解决方案,其中某些方面涉及到3D TSV测试的前沿技术,而且也是唯一面向3D TSV测试特定的解决方案。最后,给出了一些采用完整3D TSV测试中其余的挑战。     

长脉冲致硅基 QPD损伤面积及形貌实验研究

为了研究硅基QPD在不同能量密度、不同脉宽激光辐照下的损伤面积、形貌,基于二维显微测量技术,测量了硅基QPD单一象限的损伤面积、形貌随激光能量密度和脉宽的变化。结果表明,在毫秒脉冲激光作用下,硅基QPD产生表面剥落、褶皱、裂纹、熔坑等损伤效果,且主要受入射激光功率密度影响,损伤面积随激光能量密度逐渐增加,随脉宽增加逐渐降低。通过实测分析,得出了不同激光脉宽下,硅基QPD表面形貌损伤阈值。激光脉宽为0.5 ms,能量密度为15.79 J/cm2时,硅基QPD出现熔融损伤;而脉宽为1.0、1.5、2.0、3.0 ms时,硅基QPD出现表面剥落的能量密度值为14.12、33.94、39.76、47.62 J/cm2。     

三维叠层DRAM封装中硅通孔开路缺陷的模拟

采用硅通孔(TSV)技术的三维堆叠封装,是一种很有前途的解决方案,可提供微处理器低延迟,高带宽的DRAM通道.然而,在3D DRAM电路中,大量的TSV互连结构,很容易产生开路缺陷和耦合噪声,从而导致了新的测试挑战.通过大量的模拟研究.本文模拟了在三维DRAM电路的字线与位线中出现的TSV开路缺陷的故障行为,它作为有效...     

对角线六边形的TSV冗余结构设计

硅通孔(TSV)在制造过程中容易产生各类故障缺陷,导致3D芯片合格率降低。为了解决这一问题,提出一种新的对角线六边形冗余结构,对均匀故障的修复率保持在99%以上,对聚簇故障的修复率与路由冗余结构相近,并高于环形冗余结构。实验结果表明,与环形和路由冗余结构相比,该结构的面积开销分别减小了1.64%和72.99%,修复路径长度分别降低了39.4%和30.81%;与路由结构相比,该结构的时间开销缩短了62.55%。     

Three-Stage Optimization of Pre-Bond Diagnosis of TSV Defects

Pre-bond TSV testing and defect identification is important for yield assurance of 3D stacked devices. Building on a recently proposed pre-bond TSV probing procedure, this paper develops a three-stage optimization method named “SOS3” to greatly reduce TSV test time without losing the capability of identifying given number of faulty TSVs. The optimization stages are as follows. First, an integer linear programming (ILP) model generates a near-optimal set of test sessions for pre-bond defective TSV diagnosis. Second, an iterative greedy procedure sequences the application of those test sessions for quicker diagnosis. Third, a TSV defect identification algorithm terminates testing as quickly as possible, often before all sessions are applied. Extensive simulation experiments are done for various TSV networks and the results show that the SOS3 framework greatly speeds up the pre-bond TSV test.     

Time redundancy and gate sizing soft error-tolerant based adder design

In this paper, we propose an efficient and promising soft error tolerance approach for arithmetic circuits with high performance and low area overhead. The technique is applied for designing soft error tolerant adders and is based on the use of a fault tolerant C-element connecting a given adder output to one input of the C-element while connecting a delayed version of that output to the second input. It exploits the variability of the delay of the adder output bits, in which the most significant bits (MSBs) have longer delay than the least significant bits (LSBs), by adding larger delay to the LSBs and smaller delay to the MSBs to guarantee full fault tolerance against the largest pulse width of transient error (soft error) for the available technology with minimum impact on performance. To guarantee fault protections for transistors feeding outputs with smaller added delay, the technique utilizes transistor scaling to ensure that the injected fault pulse width is less than the added delay of the second output of the C-element. Simulation results reveal that the proposed technique takes precedence over other techniques in terms of failure rate, area overhead, and delay overhead. The evaluation experiments have been done based on simulations at the transistor level using HSPICE to take care of temporal masking combined with electrical masking. In comparison to TMR, the technique achieves 100% reliability with 31% reduction in area overhead without impacting performance in the case of a 32-bit adder, and 42% reduction in area overhead and 5% reduction in performance overhead in the case of a 64-bit adder. While our proposed technique achieves area reduction of 4.95% and 9.23% in comparison to CE-based DMR and Feedback-based DMR techniques in the case of a 32-bit adder, it achieves area reduction of 19.58% and 23.24% in the case of a 64-bit adder.     

阵列乘法器通路时延故障的内建自测试

阵列乘法器因高度集成和高速运行,容易受到时延故障的困扰.该文对阵列乘法器的通路时延故障提出了一种用累加器实现的以单跳变序列作为测试序列的内建自测试方案.已有的理论和实践表明采用单跳变测试序列比多跳变序列具有更高的测试鲁棒性.同时,该文的测试方案在测试通路覆盖率和测试向量数之间做到了兼顾.仿真结果表明这种单跳变测试序列具有高测试通路覆盖率.此外,测试生成通过系统已有累加器的复用可节省硬件成本开销.     

An effective logic BIST scheme based on LFSR-reseeding and TVAC

An effective logic built-in self-test scheme aiming at reducing the area overhead of IC testing and improving the fault average is proposed, which combines strategies of linear feedback shift register (LFSR)-reseeding with test vectors applied by circuit-under-test itself (TVAC). LFSR-reseeding technology is first applied to decrease the size of test set and the number of interior feedback wires, while TVAC technology is applied to decrease the number of stored seeds. An efficient LFSR-reseeding algorithm and a modified quick judgment method for path search are proposed. Experimental results for ISCAS 85 benchmarks demonstrate that the proposed method reduces the number of interior feedback wires more than 50% on average and can achieve full fault coverage with much less groups as well as area overhead compared with previous TVACs.     

Automatic generation of test infrastructures for analog integrated circuits by controllability and observability co-optimization

This paper presents a method to address the automatic testing of analog ICs for catastrophic defects. Based on Design-for-Testability building blocks offering extra controllability and extra observability, a test infrastructure is generated for a targeted circuit. The selection of the extra blocks and their insertion into the circuit is done automatically by a workflow based on DC simulations and optimization algorithms. Adopting a defect-oriented methodology, this approach maximizes the fault coverage while minimizing the silicon area overhead and test time. The proposed method is applied to two industrial circuits in order to generate optimal test infrastructures combining controllability and observability. These case studies show that, with a silicon area overhead of less than 10%, a fault coverage of 94.1% can be reached.     

Statistical estimation of delay fault detectabilities and fault grading

In this paper we present a technique to statistically estimate transition delay and path delay fault coverage. The basic method is an extension of STAFAN to include delay faults. By partitioning a combinational circuit into non-overlapping fanout free logic cones, we accurately calculate the transition sensitization controllabilities of 0 1 and 1 0 transitions of the lines within a fanout free logic cone to the output of the fanout free logic cone for each fanout free logic cone. A strategy to calculate the transition observabilities of fanout stems is proposed. The detectability of a path delay fault is evaluated as the product of the observabilities of the input line to its head gate within each fanout free logic cone on the path multiplied by the transition controllability of the path. When compared with the fault simulations, the estimations of transition delay fault coverage are within 2.3%. Also, the technique gives reasonably good path delay fault coverage estimation for large fault set of the ISCAS85 benchmark circuits.     

On the design of random pattern testable PLA based on weighted random pattern testing

Programmable Logic Arrays (PLAs) provide a cost effective method to realize combinational logic circuits. PLAs are often not suitable for random pattern testing due to high fao-in of gates. In order to reduce the effective fan-in of gates, previous random pattern testable (RPT) PLA designs focused on partitioning inputs and product lines. In this paper we propose a new random pattern testable design of PLAs which is suitable for built-in selftest. The key idea of the proposed design is to apply weighted random patterns to the PLA under test. The proposed design method was applied to 30 example PLAs. The performance of the RPT PLAs was measured in the size of test set, area overhead, and time overhead, and compared with two other designs in test length and fault coverage. The experimental results show that the proposed design achieve short test length and high fault coverage.