共查询到18条相似文献,搜索用时 203 毫秒
1.
2.
3.
针对大功率型LED路灯散热器稳态工作下温度中心集聚的热特性,利用有限元方法构建其3D模型,并在三维模型基础上得到散热器的稳态温度场分布云图;采用正交试验设计法探讨散热器中心翅片的厚度、底板的厚度、不同疏密程度结构对散热器的水平和垂直方向热传导的影响;最后根据实验结果得到能有效对LED路灯散热器温度进行热控制的优化参数和结构,该方案有效降低了散热器的最高温度并提高了散热器的垂直热传导能力;通过对实物进行实验测量得到温度数据再与有限元分析的温度场分布图比较,证明了设计仿真的准确性和可靠性。 相似文献
4.
《电子元件与材料》2016,(9):24-28
为了提高LED的散热性能,基于烟囱效应原理,对比了LED梳状散热器和太阳花散热器的散热效果。通过Solidworks建立实体模型,通过其插件Flow Simulation对建立的模型进行热仿真。在保持散热器质量不变的前提下,研究了不同烟囱高度对配备梳状散热器和太阳花散热器的LED芯片最高温度的影响。并对烟囱高度为40 mm的太阳花散热器进行了实验验证,经实验测量,此时LED芯片的最高温度为81℃,与模拟结果只相差1.28℃,证实了模拟的正确性。仿真表明:在烟囱效应下,LED太阳花散热器的散热效果要强于梳状散热器,并且当烟囱高度大于45 mm时,二者的温度差随着烟囱高度的增加不断扩大。 相似文献
5.
6.
7.
8.
9.
10.
11.
12.
PD SOI NMOSFET翘曲效应的温度模型 总被引:2,自引:2,他引:0
报道了一个部分耗尽 (PD) SOI NMOSFET翘曲效应的温度解析模型 .该模型从 PD SOI NMOSFET器件的物理结构 ,即由顶部的 NMOSFET和底部的寄生 BJT构成这一特点出发 ,以一定温度下 PD SOI NMOSFET体-射结电流与漏 -体结电流的动态平衡为核心 ,采用解析迭代方法求解 ,得出漏 -体结碰撞电离产生的空穴在体区中近源端积累达到饱和时的体 -射结电压 ,及漏 -体结和体 -射结电流的各主要分量 ,进而得到了 PD SOI NMOSFET翘曲效应漏电流的温度解析模型 ,并将一定条件下的模拟结果与实验结果进行了比较 ,二者吻合得很好 相似文献
13.
14.
为了研究机械应力对石英滤波输出的影响,基于石英晶体的弹光效应,推导了石英晶体双折射率与不同方向机械应力之间的关系,并进行了数值模拟。采用了Ultra-6600系列紫外-可见分光光度计搭建了实验系统,得到了立奥型石英双折射滤光片的透射光谱图,并对光谱图进行了研究与分析。结果表明,在不同方向机械应力作用下,立奥型石英双折射滤光片的中心波长发生漂移;大小为0.0025N/m2机械应力沿Ox1轴、Ox2轴、Ox3轴方向作用,石英滤波片中心波长向长波长方向的漂移量分别约为0.4nm,0.6nm,1nm。这一结果对石英双折射滤光片的封装制作、正确设计和使用是有帮助的。 相似文献
15.
Effect of glass frit chemistry on the physical and electrical properties of thick-film Ag contacts for silicon solar cells 总被引:1,自引:0,他引:1
Mohamed M. Hilali Srinivasan Sridharan Chandra Khadilkar Aziz Shaikh Ajeet Rohatgi Steve Kim 《Journal of Electronic Materials》2006,35(11):2041-2047
The aim of this study is to understand the effect of the glass frit chemistry used in thick-film Ag pastes on the electrical
performance of the silicon solar cell. The study focuses on the physical behavior of the glass frit during heat treatment
as well as the resulting Ag−Si contact interface structure. We observe that the glass frit transition temperature (Tg) and softening characteristics play a critical role in the contact interface structure. The glass transition temperature
also significantly influences the contact ohmicity of the thick-film metal grid. A high glass frit transition temperature
generally results in thinner glass regions between the Ag bulk of the grid and the Si emitter. It was found that a glass frit
(with high Tg) that crystallizes fast during the firing cycle after etching the silicon nitride and Si emitter results in smaller Ag crystallite
precipitation at the contact interface. This results in smaller junction leakage current density (Jo2) and higher open-circuit voltage (Voc). Using high Tg pastes (with the appropriate Ag powder size), greater than 0.78 fill factors and >17.4% efficiency were achieved on 4 cm2 untextured single crystal Si solar cells with 100 Ω/sq emitters. 相似文献
16.
17.
To improve the performance of Si solar cells after firing, it is necessary to control the thickness of the glass layers between the Ag and Si, and the formation of Ag when it recrystallizes into the Si emitter, both of which decisively influence the performance of the cell. In this study, the effect of the physical properties of the frits on the contacts between Ag and Si is verified. Interfaces of Ag electrodes/glass layers/Ag recrystallized into n + emitter are formed when using high-fluidity frits. On the other hand, as the viscous flow of the frits slows as the temperature increases, an interface structure formed of Ag/thin glass/SiN x layers results, with the formation of Ag nanoprecipitates in the glass layers. Our results suggest that the viscous behavior of frits under increasing temperatures leads to the formation of distinct interfaces between Ag electrodes and Si. 相似文献
18.
Dongyue Jin Wanrong Zhang Hongyun Xie Liang Chen Pei Shen Ning Hu 《Microelectronics Reliability》2009,49(4):382-386
The two-dimensional temperature profile of a power SiGe HBT with traditional uniform emitter finger spacing is calculated, which shows that there is a higher temperature in the central region of the device. With the aid of the theoretical analysis, an optimized structure of the HBT with non-uniform emitter finger spacing is presented. The peak temperature is lowered by 23.82 K, and the thermal resistance is also improved by 15.09% compared with that of the uniform one. The improvements above are ascribed to the increasing the spacing between fingers, and hence suppressing the heat flow from adjacent fingers to the center finger. Based on the analytical results, two types of HBTs with uniform emitter finger spacing and non-uniform emitter finger spacing are fabricated and their temperature profiles and thermal resistance are measured. The measured results agree well with the calculated results, verifying the accuracy of the calculations. For the HBT with non-uniform emitter finger spacing, the peak temperature and the thermal resistance are improved markedly over a wide biasing range compared with that of the uniform one. Therefore, both the calculated results and the experimental results verify that the optimized structure of power HBT with non-uniform emitter finger spacing is superior to the uniform emitter spacing structure for enhancing the thermal stability of power devices over a wide biasing range. 相似文献