共查询到17条相似文献,搜索用时 171 毫秒
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研究了不同基区设计对多发射极指结构功率InGaP/GaAs异质结双极型晶体管热稳定性的影响。以发生电流增益崩塌的临界功率密度为热稳定性判定标准,推导了热电反馈系数Φ、集电极电流理想因子η和热阻Rth与基区掺杂浓度NB、基区厚度dB的理论公式。基于TCAD虚拟实验,观测了不同基区掺杂浓度和不同基区厚度分别对InGaP/GaAs HBT热稳定性的影响。结合理论公式,对仿真实验曲线进行了分析。结果表明,基区设计参数对热稳定性有明显的影响,其影响规律不是单调变化的。通过基区外延层参数的优化设计,可以改进多指HBT器件的热稳定性,从而为多指InGaP/GaAs HBT热稳定性设计提供了一个新的途径。 相似文献
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InGaP/GaAs异质结双极晶体管(HBT)是当前微波毫米波领域中具有广阔发展前景的高速固态器件,其直流特性是器件重要参数之一.本文采用Medici软件对两种InGaP/GaAs外延结构HBT的直流特性和高频特性进行了模拟计算,并实际制备出了两种材料结构的大尺寸(发射极面积100μm×100μm)双台面InGaP/GaAs HBT器件,对其直流特性进行了测试和分析,两种外延结构的器件共射直流增益分别为50和350,模拟得其最大截止频率分别为8和10GHz. 相似文献
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通过分析InGaP/GsAsHBT器件的热学和电学特点,结合HBT大功率放大器芯片在技术性能、稳定性、可靠性及尺寸等方面的要求,通过优化设计HBT功率器件单元和匹配电路,开发了一个大功率、高效率、小尺寸的ISM波段功率放大器单片集成电路。该三级放大器的各级器件单元的发射极面积分别为320μm2,1280μm2,5760μm2,芯片内部包括了输入、输出50Ω匹配电路,面积仅为1.9mm×2.1mm。放大器采用5V单电源供电,在2.4~2.5GHz频率范围内线性增益为27dB,2dB增益压缩点输出饱和功率达到37dBm,功率附加效率为46%。 相似文献
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针对高质量无线局域网的传输需求,设计了一款工作在5~6 GHz的宽带磷化镓铟/砷化镓异质结双极型晶体管(InGaP/GaAs HBT)功率放大器芯片。针对HBT晶体管自热效应产生的非线性和电流不稳定现象,采用自适应线性化偏置技术,有效地解决了上述问题。针对射频系统的功耗问题,设计了改进的射频功率检测电路,以实现射频系统的自动增益控制,降低功耗。通过InGaP/GaAs HBT单片微波集成电路(MMIC)技术实现该功率放大器芯片。仿真结果表明,功放芯片的小信号增益达到32 dB;1 dB压缩点功率为28.5 dBm@5.5 GHz,功率附加效率PAE超过32%@5.5 GHz;输出功率为20 dBm时,IMD3低于-32 dBc。 相似文献
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《固体电子学研究与进展》2015,(4)
介绍了一个工作在5.8~6.2GHz的高效率磷化镓铟/砷化镓异质结双极型晶体管(InGaP/GaAs HBT)功率放大器。设计了具有良好带宽性能的J类输出匹配网络,并通过InGaP/GaAs HBT单片微波集成电路(MMIC)技术和射频基板封装技术得以实现。在5.8~6.2GHz的频率范围内,用连续波(CW)信号测试放大器得到的1dB压缩点输出功率都大于31dBm,饱和输出功率都大于32dBm、最大的附加功率效率(PAE)都大于56%。 相似文献
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Ren F. Abernathy C.R. Pearton S.J. Lothian J.R. Wisk P.W. Fullowan T.R. Chen Y.-K. Yang L.W. Fu S.T. Brozovich R.S. Lin H.H. 《Electron Device Letters, IEEE》1993,14(7):332-334
As an alternative to AlGaAs/GaAs heterojunction bipolar transistors (HBTs) for microwave applications, InGaP/GaAs HBTs with carbon-doped base layers grown by metal organic molecular beam epitaxy (MOMBE) with excellent DC, RF, and microwave performance are demonstrated. As previously reported, with a 700-Å-thick base layer (135-Ω/sq sheet resistance), a DC current gain of 25, and cutoff frequency and maximum frequency of oscillation above 70 GHz were measured for a 2-μm×5-μm emitter area device. A device with 12 cells, each consisting of a 2-μm×15-μm emitter area device for a total emitter area of 360 μm2, was power tested at 4 GHz under continuous-wave (CW) bias condition. The device delivered 0.6-W output power with 13-dB linear gain and a power-added efficiency of 50% 相似文献
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This paper presents a 3.4-3.6 GHz power amplifier(PA) designed and implemented in InGaP/GaAs HBT technology.By optimizing the off-chip output matching network and designing an extra input-matching circuit on the PCB,several problems are resolved,such as resonant frequency point migration,worse matching and lower gain caused by parasitics inside and outside of the chip.Under Vcc = 4.3 V and Vbias = 3.3 V,a P1dB of 27.1 dBm has been measured at 3.4 GHz with a PAE of 25.8%,the 2nd and 3rd harmonics are -64 dBc and -51 dBc,respectively. In addition,this PA shows a linear gain more than 28 dB with S11<-12.4dB and S22<-7.4 dB in 3.4-3.6 GHz band. 相似文献
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Limited by increased parasitics and thermal effects as device size increases, current commercial SiGe power HBTs are difficult to operate at X-band (8~ 12GHz) frequencies with adequate power added efficiencies at high power levels. We find that, by changing the heterostructure and doping profile of SiGe HBTs, their power gain can be significantly improved without resorting to substantial lateral scaling. Furthermore, employing a common-base configuration with a proper doping profile instead of a common-emitter configuration improves the power gain characteristics of SiGe HBTs, thus permitting these devices to be efficiently operated at X-band frequencies. In this paper,we report the results of SiGe power HBTs and MMIC power amplifiers operating at 8~10GHz. At 10GHz,a 22.5dBm (178mW) RF output power with a concurrent gain of 7.32dB is measured at the peak power-added efficiency of 20.0%, and a maximum RF output power of 24.0dBm (250mW) is achieved from a 20 emitter finger SiGe power HBT. The demonstration of a single-stage X-band medium-power linear MMIC power amplifier is also realized at 8GHz. Employing a 10-emitter finger SiGe HBT and on-chip input and output matching passive components, a linear gain of 9.7dB,a maximum output power of 23.4dBm,and peak power added efficiency of 16% are achieved from the power amplifier. The MMIC exhibits very low distortion with 3rd order intermodulation (IM) suppression C/I of -13dBc at an output power of 21.2dBm and over 20dBm 3rd order output intercept point (OIP3). 相似文献
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介绍了一种应用于W-LAN系统的5.8 GHz InGaP/GaAs HBT MMIC功率放大器。该功率放大器采用了自适应线性化偏置电路来改善线性度和效率,同时偏置电路中的温度补偿电路可以抑制直流工作点随温度的变化,采用RC稳定网络使放大器在较宽频带内具有绝对稳定性。在单独供电3.6 V电压情况下,功率放大器的增益为26 dB,1 dB压缩点处输出功率为26.4 dBm,功率附加效率(PAE)为25%。三阶交调系数(IMD3)在输出功率为26.4 dBm时为-19 dBc,输出功率为20 dBm时低于-38 dBc,在1 dB压缩点处偏移频率为20 MHz时邻道功率比(ACPR)值为-31 dBc。 相似文献
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Limited by increased parasitics and thermal effects as device size increases, current commercial SiGe power HBTs are difficult to operate at X-band (8~ 12GHz) frequencies with adequate power added efficiencies at high power levels. We find that, by changing the heterostructure and doping profile of SiGe HBTs, their power gain can be significantly improved without resorting to substantial lateral scaling. Furthermore, employing a common-base configuration with a proper doping profile instead of a common-emitter configuration improves the power gain characteristics of SiGe HBTs, thus permitting these devices to be efficiently operated at X-band frequencies. In this paper,we report the results of SiGe power HBTs and MMIC power amplifiers operating at 8~10GHz. At 10GHz,a 22.5dBm (178mW) RF output power with a concurrent gain of 7.32dB is measured at the peak power-added efficiency of 20.0%, and a maximum RF output power of 24.0dBm (250mW) is achieved from a 20 emitter finger SiGe power HBT. The demonstration of a single-stage X-band medium-power linear MMIC power amplifier is also realized at 8GHz. Employing a 10-emitter finger SiGe HBT and on-chip input and output matching passive components, a linear gain of 9.7dB,a maximum output power of 23.4dBm,and peak power added efficiency of 16% are achieved from the power amplifier. The MMIC exhibits very low distortion with 3rd order intermodulation (IM) suppression C/I of -13dBc at an output power of 21.2dBm and over 20dBm 3rd order output intercept point (OIP3). 相似文献