一种低功耗无运放的带隙基准电压源设计

设计了一种新型无运放带隙基准源。该电路使用负反馈的方法,避免了运放的使用,从而消除了运放带隙基准电路中运放的失调电压对基准源精度的影响,同时还提升了电源抑制比,且降低了功耗。该新型电路比传统无运放带隙基准电路具有更高的精度和电源抑制比。该设计基于SMIC 0.35μm标准CMOS工艺在Candence Specture环境下进行仿真,电源电压采用3.3 V,温度范围为-55~125℃,电源抑制比为82 d B,功耗仅有0.06 m W。     

低温度系数低功耗带隙基准的设计

对带隙基准电压源的温度系数和功耗进行了分析研究,采用与绝对温度成正比(PTAT)的电流和与绝对温度互补(CTAT)的电流加权和技术,同时采用放大器工作在亚阈值区技术及运放失调补偿技术,基于0.4μm的CMOS工艺设计了一个低温度系数、低功耗的基准电压电路。通过电源电压、工作温度及工艺角对基准电压影响的仿真,结果表明该带隙基准源典型的温度系数为2×10~(-6)/℃,功耗为5.472μW,基准电压为1.32 V,电源抑制比为83.5 dB,实现了低温度系数、低功耗特性,且电路工作稳定。     

一种新型无运放CMOS带隙基准电路

介绍了带隙基准原理和常规的带隙基准电路,设计了一种新型无运放带隙基准电路。该电路利用MOS电流镜和负反馈箝位技术,避免了运放的使用,从而消除了运放带隙基准电路中运放的失调电压和电源抑制比等对基准源精度的影响。该新型电路比传统无运放带隙基准电路具有更高的精度和电源抑制比。基于0.18μm标准CMOS工艺,在Cadence Spectre环境下仿真。采用2.5V电源电压,在-40℃～125℃温度范围的温度系数为6.73×10-6/℃,电源抑制比为54.8dB,功耗仅有0.25mW。     

一种低功耗带隙基准电压源的设计

设计了一种工作在亚阈值区无运放结构的CMOS带隙基准电压电路。通过使用线性区工作的MOS管取代传统电阻,使电路工作在亚阈值区,结合无运放设计,极大地降低了功耗。采用0.35μm CMOS工艺,在室温27℃、工作电压3 V的条件下进行仿真,输出基准电压1.2086 V,偏差在4 m V内,工作电流仅为1.595μA,功耗仅为4.785μW。在-50℃到120℃的温度范围内温度系数为17.3×10-6/℃。该带隙基准电压电路具有低功耗、宽温度范围、面积小等特点。     

一种用于AC/DC控制器中电压基准源的设计

提出了一种新颖的可用于AC/DC控制芯片中的基准电压源电路。此电路以PTAT（proportional to absolutetemperature）电流为偏置电流,利用二极管连接的MOS晶体管迁移率和阈值电压的温度系数可相互补偿的特性,产生与温度无关的栅源电压。该电路结构简单,既无启动电路也无运放,避免了运放失调对基准源的影响,设计采用CSMC0.5μm BCD工艺。仿真结果表明,该基准电压源具有较低的温度系数和高电源电压抑制比,可作为AC/DC控制芯片中迟滞比较器的参考源。     

一种新型CMOS带隙基准电压源

传统带隙基准源电路采用PNP型三极管来产生ΔVbe,此结构使运放输入失调电压直接影响输出电压的精度。文章在对传统CMOS带隙电压基准源电路原理的分析基础上,提出了一种综合了一阶温度补偿和双极型带隙基准电路结构优点的高性能带隙基准电压源。采用NPN型三极管产生ΔVbe,消除了运放失调电压影响。该电路结构简洁,电源抑制比高。整个电路采用SMIC 0.18μmCMOS工艺实现。通过Cadence模拟软件进行仿真,带隙基准的输出电压为1.24V,在-40℃~120℃温度范围内其温度系数为30×10-6/℃,电源抑制比(PSRR)为-88 dB,电压拉偏特性为31.2×10-6/V。     

低功耗CMOS带隙基准电压源设计

从带隙基准原理出发,通过对传统的带隙基准电路中的反馈环路进行了改进,设计了一种带启动电路的带隙基准电压源。带隙基准电压源电路具有结构简单、功耗低、电压抑制比高以及温度系数低等特点。采用TSMC 0.13μm工艺对电路进行流片,管芯面积为100μm×94μm。测试结果显示,电源电压1V时,在-30~120℃范围内温度系数为6.6×10-6/℃,功耗仅1.8μW;电源电压从0.76V变化到2V,输出电压偏差仅1.52mV,电源抑制比达58dB。     

一种带曲率补偿、工作电压1.2 V、可调带隙基准电压电路

在分析常规带隙基准电路的基础上,设计了一种带曲率补偿可调节的带隙基准电压电路,并且具有良好的温度系数。电路设计和仿真工具使用Cadence的Spectre。采用SMIC标准0.25μmCMOS工艺。电路中包含的运放为两级放大电路,开环增益为85dB。带隙基准电压电路采用并联电阻的简单电路实现了有效的曲率补偿,在2.5V工作电压下,-25~125℃,TC=3.10ppm/℃,功耗为0.859mW。电路也可以在1.2V电压下工作,-25~125℃,TC=5.34ppm/℃,功耗为0.36mW。     

两种新型CMOS带隙基准电路

文章介绍了两种CMOS带隙基准电路.它们在传统带隙基准电路的基础上,采用了低压共源共栅电流镜提供偏置电流,降低了功耗,减小了沟道长度调制效应带来的误差并使电路可以工作在较低的电源电压下;采用运放的输出作为共源共栅电流镜的偏置电压,使基准电压不受电源电压变化的影响.其中一种电路,还通过两个串联二极管的原理提高△VBE,从而减小了运放失调的影响.仿真结果表明,在工艺偏差、电源电压变化±10%以及温度在-20至125℃范围内变化的情况下,两种CMOS带隙基准的输出电压分别是1.228+0.003V和1.215±0.003V,温度系数仅为33.7ppm/℃和34.1ppm/℃;在电源电压分别大于2V和2.8V时,电源电压的变化对这两种基准的输出电压几乎没有影响;在33v电源电压下两个电路的功耗分别小于0.1mW和0.34mW.     

用于单片集成AC/DC变换器的带隙基准源设计

在对传统带隙基准源基本原理分析的基础上,提出了一种适用于单片集成AC/DC变换器的带隙基准电路。该电路采用无运放的带隙结构, 避免了运放失调电压对基准源的影响。基于LITEON 1μm HV BiCMOS工艺,Hspice仿真结果表明,该基准源产生1.238V的基准电压,电源抑制比高达60dB,在-40℃-140℃温度范围内,基准电压仅变化3.9mV,温度系数为16.6×10^-6/℃, 完全满足AC/DC变换器对其性能的要求。     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.     

Curved crystal spectrometer for the measurement of X-ray lines from laser-produced plasmas

In order to diagnose the laser-produced plasmas, a focusing curved crystal spectrometer has been developed for measuring the X-ray lines radiated from a laser-produced plasmas. The design is based on the fact that the ray emitted from a source located at one focus of an ellipse will converge on the other focus by the reflection of the elliptical surface. The focal length and the eccentricity of the ellipse are 1350 mm and 0.9586, respectively. The spectrometer can be used to measure the X- ray lines in the wavelength range of 0.2-0.37 nm, and a LiF crystal （200） （2d = 0.4027 nm） is used as dispersive element covering Bragg angle from 30° to 67.5°. The spectrometer was tested on Shengnang- Ⅱ which can deliver laser energy of 60-80 J/pulse and the laser wavelength is 0.35 μm. Photographs of spectra including the 1 s2p ^1P1-1s^2 ^1S0 resonance line（w）, the 1s2p ^3P2-1s^2 1S0 magnetic quadrupole line（x）, the 1s2p ^3P1-1 s^2 ^1S0 intercombination lines（y）, the 1 s2p ^3S~1-1 s^2 ^1S0 forbidden line（z） in helium-like Ti Ⅹ Ⅺ and the 1 s2s2p ^2P3/2-1 s622s ^2S1/2 line（q） in lithium-like Ti Ⅹ Ⅹhave been recorded with a X-ray CCD camera. The experimental result shows that the wavelength resolution（λ/△ 2） is above 1000 and the elliptical crystal spectrometer is suitable for X-ray spectroscopy.     

Electronic Structure of Semiconductor Nanocrystals

This paper reviews our recent development of the use of the large-scale pseudopotential method to calculate the electronic structure of semiconductor nanocrystals, such as quantum dots and wires, which often contain tens of thousands of atoms. The calculated size-dependent exciton energies and absorption spectra of quantum dots and wires are in good agreement with experiments. We show that the electronic structure of a nanocrystal can be tuned not only by its size,but also by its shape. Finally,we show that defect properties in quantum dots can be significantly different from those in bulk semiconductors.     

Critical Stage Rule-Based Real Time Dispatch（RTD）System in Highly-Mixed-Products （HMP） FAB

An improving utilization and efficiency of critical equipments in semiconductor wafer fabrication facilities are concerned. Semiconductor manufacturing FAB is one of the most complicated and cost sensitive environments. A good dispatching tool will make big difference in equipment utilization and FAB output as a whole. The equipment in this paper is In-Line DUV Scanner. There are many factors impacting utilization and output on this equipment group. In HMP environment one of the issues is changing of reticule in this area and idle counts due to load unbalance between equipments. Here we'll introduce a rule-based RTD system which aiming at decreasing the number of recipe change and idle counts among a group of scanner equipment in a high-mixed-products FAB.     

GaAsSb/InAlAs PA DHBTs Grown by Production MBE

The epi material growth of GaAsSb based DHBTs with InAlAs emitters are investigated using a 4 × 100mm multi-wafer production Riber 49 MBE reactor fully equipped with real-time in-situ sensors including an absorption band edge spectroscope and an optical-based flux monitor. The state-of-the-art hole mobilities are obtained from 100nm thick carbon-doped GaAsSb. A Sb composition variation of less than ± 0.1 atomic percent across a 4 × 100mm platen configuration has been achieved. The large area InAlAs/GaAsSb/InP DHBT device demonstrates excellent DC characteristics,such as BVCEO＞6V and a DC current gain of 45 at 1kA/cm2 for an emitter size of 50μm × 50μm. The devices have a 40nm thick GaAsSb base with p-doping of 4. 5 × 1019cm-3 . Devices with an emitter size of 4μm × 30μm have a current gain variation less than 2% across the fully processed 100mm wafer. ft and fmax are over 50GHz,with a power efficiency of 50% ,which are comparable to standard power GaAs HBT results. These results demonstrate the potential application of GaAsSb/InP DHBT for power amplifiers and the feasibility of multi-wafer MBE for mass production of GaAsSb-based HBTs.     

Technology innovation and process integrations for sub-100nm gate patterning

This paper presents a brief overview of the Applied Centura(R)DPS(R)system,configured with silicon etch DPS Ⅱ chamber, with emphasis on discussing tuning capability for CD uniformity control. It also presents the studies of etch process chemistry and film integration impact for an overall successful gate patterning development. Discussions will focus on resolutions to key issues, such as CD uniformity, line-edge roughness, and multilayer film etching integration.     

White organic light-emitting devices based on fac tris（2- phenylpyridine） iridium sensitized 5,6,11,12-tetraphenylnap -hthacene

We have fabricated the white organic light-emitting devices （WOLEDs） based on 4,4＇ -bis（2,2 -diphenyl vinyl）-1,1＇ - biphenyl （DPVBi） and phosphorescence sensitized 5,6,11,12,-tetraphenylnaphthacene （rubrene）. The device structure is ITO/2T-NATA （20 nm）/NPBX （20 nm）/CBP： x%Ir（ppy）3：0.5% rubrene （8 nm）/NPBX （5 nm）/DPVBi （30 nm）/Alq（30 nm）/LiF（0.5 nm）/A1. In the devices, DPVBi acts as a blue light-emitting layer, the rubrene is sensitized by a phosphorescent material, fac tris （2-phenylpyridine） iridium [Ir（ppy）3], acts as a yellow light-emitting layer, and N,N＇ -bis- （1-naphthyl）- N,N＇ -diphenyl -1, 1＇ -biphenyl-4,4＇ -diamine （NPBX） acts as a hole transporting and exciton blocker layer, respectively. When the concentration of Ir （PPY）3 is 6wt%, the maximum luminance is 24960 cd/m^2 at an applied voltage of 15 V, and the maximum luminous efficiency is 5.17 cd/A at an applied voltage of 8 V.     

Complete approach to automatic identification and subpixel center location for ellipse feature

To meet the need of automatic image features extraction with high precision in visual inspection, a complete approach to automatic identification and sub-pixel center location for similar-ellipse feature is proposed. In the method, the feature area is identified automatically based on the edge attribute, and the sub-pixel center location is accomplished with the leastsquare algorithm. It shows that the method is valid, practical, and has high precision by experiment. Meanwhile this method can meet the need of instrumentation of visual inspection because of easy realization and without man-machine interaction.     

小角度扩展相关性近似算法分析

本论文提出一种在多天线MIMO信道相关性建模中小角度扩展近似理论算法,并应用于分析MIMO系统性能。分析中分别对三种不同角能量分布情况下的空间相关性研发快速近似计算法,并同时提出双模(Bi-Modal)角能量分布情况下的近似运算。通过分析这些新方法的近似效率,可以得到计算简单、复杂度低、而且符合实际的MIMO相关信道矩阵,对系统级的快速高效计算法的研究和系统级的评估以及误差分析具有重要的意义。     

Noise character analysis and the restraint of self-pulsation laser diodes

We calculate the Langevin noise sources of self-pulsation laser diodes, analyze the effects of active region noise and saturable-absorption region noise on the power fluctuation as well as period fluctuation, and propose a novel method to restrain the noise effects. A visible SIMULINK model is established to simulate the system, The results indicate that the effects of noise in absorption region can be ignored; that with the increase of DC injecting current, the noise effects enhance power jitter, and nevertheless, the period jitter is decreased; and that with external sinusoidal current modulating the self-pulsation laser diode, the noise-induced power jitter and period jitter can be suppressed greatly. This work is valuable for clock recovery in all-optical network.