环氧化端羟基聚丁二烯增韧环氧树脂的研究

使用环氧化端羟基聚丁二烯（EHTPB）对双酚A型环氧树脂进行增韧改性。对EHTPB增韧的固化产物及端羟基聚丁二烯（HTPB）增韧的固化产物进行力学性能测试,运用差示扫捕量热法测试同化产物的玻璃化转变温度,采用扫面电镜观察树脂增韧前后的断面形貌,显示为韧性断裂。各种结果表明,EHTPB对环氧树脂的增韧效果优于HTPB,该增韧剂的加入能够在不明显降低树脂强度的条件下,大幅度提高体系韧性的同时保持树脂的玻璃化转变温度。     

E-51环氧树脂改性双酚A型氰酸酯树脂的研究

采用示差扫描量热法(DSC)、傅里叶变换红外光谱(FTIR)研究了E-51环氧树脂改性双酚A型氰酸酯树脂(BADCy)体系的反应活性、反应机理及固化工艺,通过TGA分析了不同含量E-51环氧树脂改性BADCy后固化物的热性能,并测定了体系的吸水率及力学性能。结果表明,随着E-51环氧树脂用量的增加,BADCy改性体系的反应活性逐渐提高,固化温度逐渐降低;用环氧树脂改性BADCy生成了恶唑烷酮等芳杂环结构,降低了氰酸酯树脂体系的三嗪环交联密度,增加了体系的韧性;改性后材料的起始热分解温度均在380℃以上,吸水率均低于2%。     

端羟基聚丁二烯改性氰酸酯体系固化反应动力学

采用示差扫描量热法(DSC)研究了端羟基聚丁二烯(HTPB)改性双酚A型氰酸酯树脂(BADCy)体系的固化反应动力学,根据Arrhenius方程对固化过程动力学参数进行了求解,建立了固化反应动力学模型。结果表明,随着HTPB含量的增大,动态DSC固化反应放热峰向低温方向移动,说明HTPB可以催化固化反应并降低体系的反应温度。纯BADCy和BADCy/15%HTPB体系等温固化符合自催化反应模型。纯BADCy体系以及BADCy/15%HTPB体系的表观反应活化能分别为59.67 kJ/mol、56.91 kJ/mol。     

环氧改性氰酸酯树脂固化动力学的研究

采用示差扫描量热法(DSC)对缩水甘油醚类环氧树脂(E-51)与脂环族环氧树脂(R-122)共同改性的双酚A型氰酸酯(BADCy)树脂的固化反应历程进行了研究。由Kisserger方程求得共聚体系固化反应的表观活化能为60.5 kJ/mol,根据Crane理论求得固化反应级数为0.89,接近于1级反应。该体系起始固化温度为132.1℃,峰顶固化温度为168.7℃,终止固化温度为246.0℃。研究表明,环氧树脂可促进BADCy的固化,改性体系可在177℃以下实现较完全固化。     

热塑性树脂改性氰酸酯树脂研究

采用热塑性树脂对双酚A型氰酸酯树脂（BADCy）进行增韧改性,根据改性BADCy的DSC曲线确定了改性BADCy的固化工艺。结果表明,热塑性树脂的加入对BADCy的固化行为影响较小,但能极大地提高BADCy的力学性能,当热塑性树脂质量分数为8％时,其弯曲强度和冲击强度分别从改性前的104．0MPa和6．0kJ／m^2提高到120．1MPa和14．2kJ／m^2,有效地增大了BADCy的韧性。     

环氧丁羟增韧环氧树脂应用研究

采用环氧化端羟基聚丁二烯(EHTPB,简称环氧丁羟)作为环氧树脂固化体系的增韧剂,研究了不同EHTPB质量分数对固化体系力学性能、热性能和电性能的影响。结果表明:随EHTPB质量分数的增加,EHTPB增韧环氧树脂灌封胶的冲击强度呈现先增加后减小的趋势;EHTPB质量分数为10%时增韧环氧树脂灌封胶的冲击强度较佳,增韧性能较好。     

环氧丁羟增韧双酚A环氧树脂固化反应动力学研究

采用动态差示扫描量热法(DSC)确定环氧丁羟(EHTPB)增韧双酚A环氧树脂固化体系的固化温度,利用Kissinger方程和Crane方程对固化反应动力学进行分析,确定了固化体系的动力学参数:表观活化能ΔE=102.40 k J/mol,指前因子A=1.90×1011,反应级数n=0.93。     

环氧树脂改性酚醛型氰酸酯树脂的研究

用E-51环氧树脂对酚醛型氰酸酯树脂(n-CE)进行增韧改性,研究了改性n-CE树脂体系的凝胶时间,采用示差扫描量热法(DSC)研究了改性n-CE树脂体系的反应活性及固化工艺,通过热重分析法(TGA)分析了不同含量E-51环氧树脂改性n-CE后固化物的热性能,并测定了体系的吸水率及力学性能。结果表明,随着E-51环氧树脂用量的增加,n-CE改性体系的反应活性逐渐提高,固化温度逐渐降低;体系的韧性增加;改性后材料的起始热分解温度均在300℃以上,吸水率均低于2%。     

聚甲基丙烯酸甲酯(PMMA)对氰酸酯树脂(BADCy)力学性能和热性能的影响

通过异步合成法,将预聚的聚甲基丙烯酸甲酯(PMMA)用于改性双酚A型氰酸酯树脂(BADCy),制备了改性BADCy。文章通过对材料进行弯曲强度、冲击强度、动态热机械分析(DMA)、SEM、FTIR分析,探讨不同PMMA添加量对改性BADCy力学性能的影响。结果显示,与纯BADCy相比,当PMMA的质量分数为20%时,改性BADCy弯曲强度和冲击强度分别提高58.5%和88%,环氧树脂(EP)与BADCy相分离消失,玻璃化温度(Tg)基本保持不变,同时改性BADCy的粘性较低,有助于固化浇铸成型。通过使用TGA、DSC等测试手段探讨不同PMMA添加量对材料热性能的影响。结果表明,当PMMA质量分数为20%时,改性BADCy的热失重温度、质量保持率基本不变,固化热降低,反应可控性增强。     

多壁碳纳米管改性氰酸酯树脂体系的研究

针对环氧树脂(DGEBA)／双酚A型氰酸酯树脂(BADCy)体系,采用多壁碳纳米管(MWNTs)对其增韧改性,制备了MWNTs/ DGEBA／BADCy复合材料。利用透射电子显微镜(TEM)观察MWNTs在树脂中的分散情况,研究了MWNTs的用量对复合材料性能的影响,借助凝胶时间和扫描电子显微镜(SEM)对碳纳米管增强氰酸酯树脂的机理进行初步的探讨。研究表明:当碳纳米管的质量分数为1％时,复合材料的力学性能达到最佳,弯曲强度和冲击强度分别提高约15％和8％。     

Cyanate ester resin modified by hydroxyl‐terminated polybutadiene: Morphology,thermal, and mechanical properties

Hydroxyl‐terminated polybutadiene (HTPB) rubber was used as a modifier for bisphenol A dicyanate ester (BADCy) to improve its toughness. The effect of catalyst on the curing behavior of the resin and the curing techniques were developed by differential scanning calorimetry. The dynamic mechanical analysis, thermogravimetry analysis, and tensile test were used to study the thermal behavior, mechanical properties, and dynamic mechanical performance of the modified BADCy resins. Results show that addition of HTPB resulted in improved toughness while maintaining relatively good thermal stability. Additional, phase separation phenomenon was confirmed by the analysis of scanning electron microscope. For the toughening of the resin, the main toughening mechanism is shear yielding and crack branching. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

Modification of bisphenol A dicyanate ester by carboxyl‐terminated liquid butadiene‐acrylonitrile and its composites

Cyanate esters with excellent high‐temperature properties and easy processing are well known as good resin materials used in aerospace and electrical industries, but the drawback of brittleness limits their usage. In this study, carboxyl‐terminated liquid butadiene‐acrylonitrile (CTBN) was introduced to improve the toughness of bisphenol A dicyanate resin (BADCy), a typical kind of the cyanate esters. Fourier transform infrared spectroscopy and differential scanning calorimetry were employed to investigate the effects of CTBN on the curing behavior of BADCy; the results indicate that the addition of CTBN has a great influence on the curing behavior of BADCy at lower temperatures, but little at higher temperatures. Data from the thermogravimetric analysis and heat deflection temperature analysis showed that the thermal properties of the modified systems were poorer than that of pristine BADCy resin. On the basis of the scanning electron micrographs of the modified systems, toughening mechanism of the systems was discussed. Mechanical and dielectric properties of the cured resins and glass fiber‐reinforced composites were also studied. Modified systems exhibit attractive properties for the future applications in aerospace industries. POLYM. ENG. SCI. 46:581–587, 2006. © 2006 Society of Plastics Engineers.     

High-toughness,environment-friendly solid epoxy resins: Preparation,mechanical performance,curing behavior,and thermal properties

The development of a facile and efficient approach to prepare high-toughness epoxy resin is vital but has remained an enormous challenge. Herein, we have developed a high-performance environment-friendly solid epoxy resin modified with epoxidized hydroxyl-terminated polybutadiene (EHTPB) via one-step melt blending. The characterization, mechanical performance, curing behavior, and thermal properties of EHTPB-modified epoxy resin were investigated. EHTPB-modified epoxy resin exhibited excellent toughness with a 100% increase in elongation at break of tensile than that of neat epoxy resin. The transfer stress and dissipated energy in the rubber phase were predominant mechanisms of toughening. The toughening effect of EHTPB on solid epoxy resin was better than that of some of the previously reported liquid epoxy resins. Meanwhile, at 10 wt % of EHTPB loading, the EHTPB-modified epoxy resin displayed high strength and 22 and 101% improvement of flexural strength and impact strength, respectively. Moreover, at 10 wt % of EHTPB loading, the activation energy of EHTPB-modified epoxy resin for curing reaction decreased from 73.89 to 65.12 kJ·mol⁻¹, which is beneficial for the curing reaction. Furthermore, EHTPB-modified epoxy resin had a good thermal stability and the initial degradation temperature increased from 249 to 313 °C at 10 wt % of EHTPB loading. This work provides a simple-preparation and highly efficient and large-scale approach for the production of high-toughness environment-friendly solid epoxy resins. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2020 , 137, 48596.     

端羟基聚丁二烯液体橡胶的环氧化研究

采用过氧甲酸原地法对端羟基聚丁二烯液体橡胶(HTPB)进行环氧化,通过过氧化氢消耗率、环氧值及开环几率详细讨论了反应温度、反应时间、原料配比等因素对环氧化反应影响的规律。并对环氧化产物(E HTPB)的固化性能进行了研究,实验表明EHTPB用于环氧树脂改性时有较好的共混相容性,能显著提高环氧树脂固化物的柔韧性和耐热性。     

Effect of the epoxy molecular weight on the properties of a cyanate ester/epoxy resin system

Bisphenol A dicyanate (BADCy) was modified by diglycidyl ether of bisphenol A epoxy resins with different molecular weights [E20 (weight‐average molecular weight = 1000) and E51 (weight‐average molecular weight = 400)] to investigate the effects of the epoxy molecular weight on the properties of the modified systems. The reactions were monitored with differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy, and the results showed that more pentacyclic oxazolidinone rings were formed in BADCy/E51 than in BADCy/E20 with the same epoxy resin weight content. DSC showed that BADCy/E20 had a lower curing temperature than BADCy/E51 because of the higher concentration of hydroxyl groups (? OH) in E20. Thermal, moisture absorption, and mechanical testing showed that E51‐modified BADCy performed better because of its lower molecular weight. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1744–1750, 2006     

改性氰酸酯类耐高温胶粘剂的研究

以双马来酰亚胺(BMI)、双酚A型氰酸酯(BADCy)和苯并噁嗪(BOZ)树脂为基体树脂,纳米二氧化硅(nano-SiO2)为填料,制备耐高温胶粘剂。采用非等温差示扫描量热(DSC)法、Kissinger法和Ozawa法研究了nano-SiO2/BOZ/BMI/BADCy共聚物的固化动力学过程。结果表明:当m(BOZ)∶m(BMI)∶m(BADCy)=1∶1∶2、w(nano-SiO2)=3%时,相应BOZ/BMI/BADCy胶粘剂的表观活化能(47.82 kJ/mol)低于无nano-SiO2体系(59.17 kJ/mol),并具有良好的耐高温性能;在250℃时用该胶粘剂胶接硅钢片,胶接件经250℃老化1 000 h后,其剪切强度仍保持稳定。     

原位吸附聚合法在制备聚苯胺导电复合材料中的应用

综述了原位吸附聚合法在制备复合改性聚苯胺导电复合材料中的应用,并展望了聚苯胺导电复合材料的应用前景。     

环氧化端羟基聚丁二烯合成及在推进剂中应用展望

从环氧化端羟基聚丁二烯(EHTPB)的合成机理、合成现状、固化方式及力学性能等方面详细总结了EHTPB的研究进展,并针对其研究现状和存在的问题,对EHTPB在推进剂中的应用和发展趋势进行了展望。     

改性氰酸酯的预聚工艺研究

本文研究酚醛环氧改性双酚A氰酸酯,用于制备热熔预浸料.双酚A氰酸酯和酚醛环氧树脂经过适当预聚后在室温下具有一定的粘附性,可制作出具有室温铺敷性的复合材料预浸料.将金属催化剂二月桂酸二丁基锡(DBTDL)加入改性体系,复合材料成型试验结果表明,DBTDL对树脂体系的预聚工艺有明显的改善作用,树脂体系可用于热熔工艺.