共查询到18条相似文献,搜索用时 78 毫秒
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本文简要介绍了目前国际上最新型微电机系统(MEMS:Micro-Electro-Mechanical Systems)的原理以及在此基础上研制出的几种微小型继电器,同时介绍了该公司研发的一种微小型继电器。 相似文献
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微机电系统(MEMS)的动态表征是为可动MEMS器件的设计和加工过程提供可靠的实验数据反馈.文中构建了一个MEMS动态测试系统,它采用了光学检测方法,具有非接触、快速、高精度等优点.系统分别采用光流技术和显微干涉技术,结合频闪照明的方法,对MEMS器件的面内和离面运动特性进行了测量.通过对一个微加工水平谐振器的运动特性测量实验说明了系统具有的功能. 相似文献
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微机电系统(micro-electro-mechanical systems,MEMS)陀螺易受外界温度环境影响,需要进行温度漂移补偿.使用外置温度传感器测量时,存在测量温度与MEMS陀螺感知单元温度不一致的问题,降低了MEMS陀螺温度漂移补偿效果.针对该问题,研究了时间延迟互信息(time-delayed mutual information,TDMI)方法,并采用该方法辨识MEMS陀螺温度漂移与温度传感器输出变化之间的时间延迟,将辨识结果应用于温度漂移预测补偿中.试验结果表明,该方法可有效提高MEMS陀螺温漂补偿精度,具有较好的工程应用参考价值. 相似文献
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基于近代显示技术的发展背景,对比传统的LED显示技术分析了Micro LED技术的发展潜力,总结出Micro LED所具有的显示技术优势;从Micro LED发展进程与技术原理出发,系统阐述了目前存在的三大封装工艺特点即Micro LED全彩化技术、巨量转移技术、微缩制程技术;介绍了当前Micro LED的三种驱动模式即PM无源选址驱动、AM有源选址驱动、半有源驱动;综述了当前Micro LED驱动的研究进展以及商业化应用,并且对研究方法进行评述;展望了Micro LED进一步研究方向,对实际研究和应用具有一定作用。 相似文献
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微机电系统(MEMS)是正在国际上发展的新兴学科,微马达是微机电系统中的关键器件,本文介绍了研制成的直径为2mm、高0.7mm的电磁型微马达的结构特点,并对气隙磁场分布进行了分析讨论。 相似文献
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Ken Saito Kazuto Okazaki Tatsuya Ogiwara Minami Takato Katsutoshi Saeki Yoshifumi Sekine Fumio Uchikoba 《Electrical Engineering in Japan》2014,186(3):43-50
This paper presents the locomotion control of a microelectromechanical system (MEMS) microrobot. The MEMS microrobot demonstrates locomotion control by pulse‐type hardware neural networks (P‐HNN). P‐HNN generate oscillatory patterns of electrical activity like those of living organisms. The basic component of P‐HNN is a pulse‐type hardware neuron model (P‐HNM). The P‐HNM has the same basic features as biological neurons, such as the threshold, the refractory period, and spatiotemporal summation characteristics, and allows the generation of continuous action potentials. P‐HNN has been constructed with MOSFETs and can be integrated by CMOS technology. Like living organisms, P‐HNN has realized robot control without using software programs or A/D converters. The size of the microrobot fabricated by MEMS technology was 4 × 4 × 3.5 mm. The frame of the robot was made of a silicon wafer, equipped with rotary actuators, link mechanisms, and six legs. The MEMS microrobot emulated the locomotion method and the neural networks of an insect by rotary actuators, link mechanisms, and the P‐HNN. We show that the P‐HNN can control the forward and backward locomotion of the fabricated MEMS microrobot, and that it is possible to switch its direction by inputting an external trigger pulse. The locomotion speed was 19.5 mm/min and the step size was 1.3 mm. © 2013 Wiley Periodicals, Inc. Electr Eng Jpn, 186(3): 43–50, 2014; Published online in Wiley Online Library ( wileyonlinelibrary.com ). DOI 10.1002/eej.22473 相似文献
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为便于通过运动轨迹分析研究物体运动特征,设计了一个运动轨迹测量显示装置,利用微机电系统(micro‐electronic mechanical system ,MEMS)技术与可视化设计,以Freescale Semiconductor公司生产的三轴低重力加速度传感器MMA8450Q和计算机为核心搭建硬件平台,以NI(National Instruments)公司开发的 LabWindows/CVI 8.5为平台编写具有可视化虚拟操作界面的控制程序,并通过性能验证实验,完成了基于 M EM S技术的运动轨迹测量显示装置的设计、实现、调试与实验过程。 相似文献
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KENN OLDHAM JEFFREY PULSKAMP RONALD POLCAWICH PRASHANT RANADE MADAN DUBEY 《Integrated ferroelectrics》2013,141(1):54-65
ABSTRACT Biologically-inspired autonomous micro-robots have a variety of anticipated applications resulting from their unique scale and cooperative potential. To achieve locomotion comparable to biological systems, these micro-robots will require actuators substantially stronger than most existing MEMS actuation technologies. Piezoelectric thin-films can meet these specifications while drawing limited power and contributing little mass to micro-robotic systems. Theoretical actuation requirements for micro-robotic applications show that lead-zirconium-titanate (PZT) thin-film actuators can meet these requirements, including a new thin-film PZT lateral actuator developed by the United States Army Research Laboratory. Experimental results and a comparison to other common lateral actuation technologies are presented. 相似文献
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The laser soldering process was introduced in Micro‐USB electronic packaging in this paper. Numerical modeling and analysis was used for laser process parameter design, because experimental measurements of peak temperature and soldering stress are expensive and often intractable. Accurate knowledge of the residual stress and distortion is a prerequisite for the reliability of the electric connector. The present work proposes a three‐dimensional transient heat transfer model of Micro‐USB package laser soldering process. The calculated thermal cycles and distribution are subsequently used to calculate the distortion and thermal stresses. Meanwhile, the effect of process parameters on residual stress and pin distortion was discussed, and the tensile strength, microstructure, and residual stresses of laser soldering were tested. It can be concluded that the proper laser soldering parameters and power can improve the mechanical property of solder joints on Micro‐USB connector. Copyright © 2014 John Wiley & Sons, Ltd. 相似文献