控温铸型连铸Cu-Ni-Si合金的加工工艺与组织性能的关系及其机理

采用控温铸型连铸(temperature controlled mold continuous casting,TCMCC)技术制备C70250铜合金带坯,对带坯进行冷轧及不同温度和时间的时效处理,研究加工工艺与微观组织、力学性能及导电性能的关系,并揭示其机理。结果表明:TCMCC制备的C70250铜合金带坯具有粗大的柱状晶组织,横向晶界较少,经变形量97.5%的冷轧后形成了沿轧向的纤维条带状组织。当时效温度为450℃、时效时间为60min时,合金的抗拉强度为758MPa、导电率为54.5%IACS;与传统制备工艺相比,抗拉强度提高了5.3%,导电率提高了36.3%,实现了强度和导电率的同步提升。该条件下合金保留了纤维条带状组织并均匀析出了大量尺寸为6~10nm的Ni2Si相,通过加工硬化和Orowan强化共同作用提高了合金的强度;且溶质原子得到充分析出,横向晶界较少,显著提高了C70250铜合金的导电性能。     

新一代国产化高速铁路接触线的研究与开发

在分析国内外高速电气化铁路接触网用接触导线的使用现状及发展趋势的基础上,建议我国应尽快研制国产铜合金接触线,以加速高速铁路接触线国产化的进程.进一步指出时效强化型铜合金Cu-Ag、Cu-Cr合金,可通过添加微量合金元素Cr、Zr,使其导电率大于80%IACS,强度达到600MPa,作为接触导线的理想材料.     

高强高导铜合金的研究状况

高强高导电铜合金是一类具有优良综合性能的功能材料和结构材料,被广泛应用于电子、机械等领域,本文阐述了高强高导铜合金的研究现状,系统介绍了此类合金的强化机理、制备方法及组织和性能特点,并且分析了稀土的作用机制及对该类铜合金性能的影响,最后展望了该类合金的发展前景。     

内氧化-高速压制法制备Al_2O_3弥散强化铜合金的性能研究

以Cu-0.18%(质量分数)Al合金粉末为原料、Cu2O为氧化剂,采用内氧化法制备Al2O3弥散铜合金粉末,采用高速压制(HVC)对粉末进行成形,经氢气中960~1 080℃烧结制备弥散强化铜合金,研究合金粉末的HVC成形效果和烧结温度对合金致密度、硬度、导电率和压缩强度等性能的影响。结果表明,HVC成形Al2O3弥散铜合金粉能获得良好的成形效果,压坯密度达到8.71 g/cm3(98.4%致密度)。与压坯相比,烧结后合金的致密度并无明显变化,但其导电率显著提升,硬度有所降低,压缩强度升高。随烧结温度的升高,合金的导电率有所升高,硬度略有降低,压缩强度基本保持恒定。经1 040~1 080℃烧结制备合金的导电率、硬度分别达到80%IACS和77 HRB以上,压缩强度达到450 MPa,能基本满足点焊电极的实际应用需求。     

高强高导铜合金的研究现状及发展趋势

综述了高强高导铜合金的研究现状,系统阐述了合金化法和复合材料法制备高强高导铜合金的方法和机理;介绍了高强高导铜合金领域的研究热点和重点问题,即快速凝固法制备高强高导铜合金及稀土等微合金化元素在高强高导铜合金中的应用,分析了高强高导铜合金的发展趋势,指出沉淀强化和复合强化是提高材料强度并保持其良好导电性能的有效途径,并结合我国的资源特点,提出了推动该材料产业化应用的方向.     

通过形变时效工艺同时提高Al-Mg-Si-Cu合金强度和电导率

铝是一种优良的导电材料,但由于强度低,其应用受到很大限制。随着铝在电力工业中应用逐渐增加,近年来,越来越多的工作致力于提高铝的导电率与强度的综合性能。通过改变传统T6时效工艺顺序发明一种同时显著提高Al-Mg-Si-Cu合金导电率和强度的形变时效工艺。本文采用显微硬度测量,导电率测试以及透射电镜(TEM)微观结构表征研究了形变时效工艺与传统T6时效工艺制备的材料在综合性能和微观组织上的差异。轧制变形引入的位错在后续时效过程调控析出,析出相形貌的改变是导电率相对T6工艺提高的原因,而残留位错可提高材料强度。     

高强度高导电性形变铜基原位复合材料的研究进展

形变铜基原位复合材料是高强度高导电性铜合金的研究热点和发展方向之一,其突出的特点是具有超高的强度和良好的电导率。综述了铜基原位复合材料的研究现状,介绍了该类材料的制备工艺、组织演变、强化导电机理和性能特点,重点对其强化机理作了论述,并对该类材料的发展方向作了展望。     

氧化铝弥散强化铜复合材料研究与生产最新进展

氧化铝弥散强化铜复合材料具有高温强度、高导电的特性，具有不可替代的作用。本文论述了氧化铝弥散强化铜合金材料特征、应用领域及其制备方法，并就它的研究及生产的最新进展作了较详细的介绍。对发展的前景作了展望。     

超高强弹性铜合金材料的研究进展与展望

超高强弹性铜合金是导电弹性元器件的关键材料之一,它广泛应用在电子电工、通信导航、汽车工业和海洋工程等领域。综述了超高强铜合金材料的研究开发现状,以强度超过1000 MPa的Cu-Be、Cu-Ti、Cu-Ni-Sn、CuNi-Mn、Cu-Ni-Si和Cu-Ni-Al合金为例,概述了它们的合金化设计原则,时效过程中的相变机理,包括相变贯序、析出相的分布、取向关系等,同时对它们的制备特点、主要应用领域、强化机制和相关物理性能进行了阐述,在此基础上对它们开发应用中所存在的问题、前景和市场需求进行了分析和展望。     

Cu-Fe-P合金引线框架产品的分析

应用光学显微镜、电子拉力机、导电仪和硬度计等仪器，研究了Cu-0．1％Fe0．03％P铜合金框架材料的生产过程和它的形变时效机理及在性能方面与国外同类产品进行了比较。结果表明，试制品的σb为421MPa，显微硬度为123HV0．5，导电率为90．87％IACS及软化温度为425℃。综合性能和国外产品相当，完全可以替代进口产品，但其伸长率略低。     

Optimization of Strength‐Electrical Conductivity Properties in Al–2Fe Alloy by Severe Plastic Deformation and Heat Treatment

High‐pressure torsion at room temperature followed by two processing routes, either 1) annealing at 200 °C for 8 h or 2) elevated temperature (200 °C) high‐pressure torsion, are employed to obtain simultaneous increase in mechanical strength and electrical conductivity of Al–2 wt%Fe. The comparative study of microstructure, particle distribution, mechanical properties, and electrical conductivity for both processing routes gives the optimal combination of high mechanical strength and high electrical conductivity in Al–2Fe alloy. It is shown that while the mechanical strength is approximately the same for both processing routes (>320 MPa), high‐pressure torsion at elevated temperature results in higher conductivity (≥52% IACS) due to reduction of Fe solute atom concentration in Al matrix compared to annealing treatment. High‐pressure torsion at 200 °C has been demonstrated as a new and effective way for obtaining combination of high mechanical strength and electrical conductivity in Al–Fe alloys.

     

Quaternary Cu-0.7%Cr-0.3%Fe-X alloys

This research is part of a project whose scope was to investigate the engineering properties of new non-commercial alloy formulations based on the Cu rich corner of the Cu-Fe-Cr ternary system with the primary aim of exploring the development of a new cost-effective high-strength, high-conductivity copper alloy. The aim of the present work was to increase the electrical conductivity and strength of the Cu-0.7wt%Cr-0.3wt%Fe alloy through selective minor additions (0.15 wt%) of elements expected to promote precipitation of dissolved Fe: Ti, B, P, Ni & Y. Such quaternary alloys with reduced Fe in solid solution would be expected to have properties equivalent to or better than those of the Cu-1%Cr reference alloy (Alloy Z). The investigation showed that none of the trace element additions significantly improved the size of the age hardening response or the peak aged electrical conductivity of Alloy A, although further work is required on the influence of Ti. Additions of P and B were detrimental. Other trace additions had little or no effect apart from causing some slight changes to the precipitation kinetics. The mechanical properties of the Cu-0.7%Cr-0.3%Fe alloy made with less expensive high carbon ferrochrome were found to be inferior to those of the equivalent alloy made with low carbon ferrochrome.     

Age hardening studies of a Cu–4Ti–Cr–Fe alloy

The microstructure, mechanical properties, and electrical conductivity (EC) of Cu–4Ti–Cr–Fe alloy aged at 773?K in vacuum are studied in this work. The results show that the multiple trace alloying elements have little effect on the microstructure evolution during the aging treatment at 773?K. However, with prolonged aging, the hardness, yield strength, and tensile strength first increase, then decrease. The Cu–4Ti–Cr–Fe alloys show superior hardness and strength performance than other alloys. In both the solid-solution treated and aged cases, the EC decreases if multiple trace alloying elements are added to the Cu–4wt-%Ti alloys, which indicates the CuTi intermetallic compound may have a large negative influence on the EC of copper alloy.     

Toward High Strength and High Electrical Conductivity in Super‐Aligned Carbon Nanotubes Reinforced Copper

The miniaturization of electronic products is drawing higher demand in the strength and conductivity of conductors. This work demonstrates the possibility of substantially increasing the dislocation density in copper to enhance the strength of super‐aligned carbon nanotubes (SACNTs) reinforced copper matrix composites (SACNT/Cu) without compromising the electrical conductivity. High strain is introduced into pure copper and SACNT/Cu by accumulative roll‐bonding (ARB) process up to 16 cycles at ambient temperature. SACNTs with initial laminated distribution turn out to be dispersed uniformly with maintained directional arrangement inside the copper matrix after ARB, which can then effectively block the motion of dislocations. Therefore, large number of dislocations propagated by large strains can be accumulated without subdivision. The accumulated dislocations will result into strain hardening, which is the major strengthening mechanism in SACNT/Cu after ARB. Furthermore, the contribution of dislocations to resistivity increase is little, thus maintaining high electrical conductivity. As a result, a high tensile strength (505 MPa) combined with a high electrical conductivity (90% IACS) is achieved in large‐sized composite sheet.

     

铜基引线框架材料的研究与发展

引线框架材料是半导体元器件和集成电路封装的主要材料之一，其主要功能为电路连接、散热、机械支撑等。随着IC向高密度、小型化、大功率、低成本方向发展，集成电路I/O数目增多、引脚间距减小，对引线框架材料提出了高强度、高导电、高导热等多方面性能上的要求。由于拥有良好的导电导热性能，铜合金已成为主要的引线框架材料。本文对电子封装铜合金引线框架材料的性能要求、国内外研究与发展等进行了综述。     

Upset-resistance welding of aluminium to copper rods: effect of interface on performance

Upset resistance dissimilar welding of aluminium and copper narrow rods was performed. Effect of the interface characteristics was studied on the joint mechanical and electrical properties. Upset resistance welding (URW) was successful for production of joints with high strength and electrical conductivity between aluminium and copper rods. Reaction layer at the joint interface was composed of the Al₂Cu cellular phase and lamellar eutectic structure of α-Al and Al₂Cu. Enhancement of the welding current and decrease in the upset force increased the reaction layer thickness and strength of the joint. URW had no significant detrimental effect on the electrical conductivity of the weld zone. Neither the joint strength nor the joint electrical conductivity was improved by in situ post weld heat treatment.     

Effect of CeLa addition on the mechanical properties of Al–Cu–Mn–Mg–Fe alloy

The rapid development of new energy automobiles leads to an increasing demand for high-strength lithium battery shell alloy. The microstructures, electrical conductivity and mechanical properties of CeLa-containing Al–Cu–Mn–Mg–Fe alloys were investigated with scanning electron microscopy (SEM), X-ray diffraction, Eddy Current conductivity tester, tensile testing and Erichsen cup testing. Experiment results indicate that Al₆(Mn, Fe) particles could be refined by CeLa alloying and AlCuCeLa phase nucleates and grew up at the surface of Al₆(Mn, Fe) particle. Major texture of the CeLa-containing alloys was different from that of the CeLa-free alloy. The electrical conductivity decreased with increase of the CeLa content. CeLa addition could greatly enhance the tensile strength of the alloy at temperatures ranging from –40°C to 300°C.     

Effect of powder processing and alloying additions (Al/ZrB2) on the microstructure,mechanical and electrical properties of Cu

The present work elucidates the effect of powder processing conditions (milling/mixing) and conductive alloying element (Al: aluminium) and ceramic (ZrB₂: zirconium diboride) reinforcement addition on the densification, microstructure and electrical conductivity of copper (Cu) processed via hot pressing route. Disregard of alloying element/reinforcement/content or powders preparation method, the density of Cu materials varied between 92.16 and 99.76% ρ_th (theoretical density) after hot pressing at a low temperature of 500 °C. In case of Cu-Al alloys, the powder processing method significantly influenced its microstructure and conductivity. Particularly the Cu-Al alloys processed using mixed powders consisted of various phases Cu, α-Cu, γ₁ (Cu₉Al₄), δ (Cu₃Al₂), ζ₁ (Cu₄Al₃), η₂ (CuAl) and θ (CuAl₂) and the Cu alloys prepared using milled powders composed of either only α-Cu or α-Cu and γ₁ (Cu₉Al₄) phases (depending on the Al content). Whereas, only Cu and ZrB₂ phases were observed with the Cu-ZrB₂ composites processed using either milled or mixed powers. In case of Cu-Al alloys, the hardness (0.88–3.41 GPa) and strength (540.30–1120.18 MPa) of Cu increased with the addition of Al. Interestingly, the hardness (0.88–2.55 GPa) and strength (508.50–970.60 MPa) of Cu increased upto 5 wt% ZrB₂ and then they lowered with further addition of ZrB₂. In particular, the hardness and strength of Cu-ZrB₂ composites are lower than Cu-Al alloys reflecting the effectiveness of solid solution strengthening in the Cu alloys as compared to dispersion strengthening mechanism in Cu composite. The pure Cu prepared using milled powders exhibited low conductivity (75.70% IACS) than Cu processed using as-received/un-milled powders (97.00% IACS). Also, the Cu-ZrB₂ composites measured with better electrical conductivity than Cu-Al alloys. Depending on the milling conditions and alloying/reinforcement amount, the conductivity of Cu-ZrB₂ composites varied between 44.10 and 88.70% IACS.     

Nanocrystallization in Amorphous Fe–P–V Alloys under Pulsed Irradiation

The crystallization behavior of amorphous Fe–P–V alloys under pulsed irradiation is studied. The results demonstrate that the crystallized alloys contain not only the equilibrium phases -Fe and (Fe,V)₃P but also two metastable phases, -FeV and (Fe,V)₂P, whose stability decreases with increasing annealing temperature and irradiation energy. As a result, these phases transform into equilibrium phases, increasing the mobility of atoms and particle size and reducing the degree of hardening.     

Correlation on the Electrical and Thermal Conductivity for Binary Mg–Al and Mg–Zn Alloys

In this work, the electrical resistivity and thermal conductivity of both as-solution binary Mg–Al and Mg–Zn alloys were investigated from 298 K to 448 K, and the correlation between the corresponding electrical conductivity and thermal conductivity of the alloys was analyzed. The electrical resistivity of the Mg–Al and Mg–Zn alloys increased linearly with composition at 298 K, 348 K, 398 K, and 448 K, while the thermal conductivity of the alloys exponentially decreased with composition. Moreover, the electrical resistivity and thermal conductivity for both Mg–Al and Mg–Zn alloys varied linearly with temperature. On the basis of the Smith–Palmer equation, the thermal conductivity of both binary Mg alloys was found to be correlated quite well with the electrical conductivity in the temperature range from 298 K to 448 K. The corresponding Lorenz number is equal to $2.162\times 10^{-8} \,\hbox {V}^{2}\cdot \hbox {K}^{-2}$ 2.162 × 10 - 8 V 2 · K - 2 , and the lattice thermal conductivity is equal to $5.111 \,\hbox {W}\cdot \hbox {m}^{-1}\cdot \hbox {K}^{-1}$ 5.111 W · m - 1 · K - 1 . The possible mechanisms are also discussed.