引线框架材料的研究发展现状

引线框架材料是半导体元器件和集成电路封装的主要材料之一,其主要功能为电路连接、散热、机械支撑等作用.随着IC向高密度、小型化、低成本方向的发展,对引线框架材料提出了高强度、高导电、高导热等多方面性能上的要求.由于拥有良好的导热性能,铜合金已成为主要的引线框架材料.对电子封装引线框架材料的性能要求、设计理论以及国内外研究发展现状等进行了综述.     

引线框架铜合金氧化特性的研究现状

铜合金由于具有优良的导电导热性能，已在现代集成电路塑料封装中占据了引线框架材料80%的份额。但铜合金容易氧化，其氧化膜被认为是塑料封装再流焊工艺中的分层和裂纹的主要原因之一，因此引线框架铜合金的氧化特性引起了人们的广泛注意。为获得铜合金引线框架良好的可靠性，不少材料工作者对铜合金在塑料封装中的氧化特性及其对铜合金与环氧树脂模压料（EMC）的粘接强度的影响进行了研究，为此，本文对引线框架合金的氧化物结构及动力学、铜合金与环氧树脂模塑料（EMC）粘接强度的影响因素等领域的研究进行了综述。     

集成电路用铜基引线框架材料的发展与展望

综述了集成电路对铜基引线框架材料的性能要求,指出好的导电导热和强度性能是引线框架材料最主要的性能要求;讨论了铜基引线框架材料的国内外研究现状,指出我国的引线框架材料无论是质量还是数量都与其他工业发达国家有很大的差距,并指出微合金化铜基材料具有成为高强高导引线框架材料的潜力.     

集成电路用金属铜基引线框架和电子封装材料研究进展

针对集成电路向高密度、小型化、多功能化发展，介绍了国内外传统的和以铜为基复合新型的引线框架和电子封装材料的性能、研究、生产现状以及存在的问题，同时展望了铜合金及其复合的引线框架和电子封装材料的发展趋势。     

铜基集成电路引线框架材料的发展概况

阐述了集成电路的发展及其对引线框架材料的要求。综述了国内外目前使用铜基集成电路引线框架材料的现状及所开发的高强度高导电铜基引线框架材料的特性，并指出了今后的发展方向。     

脉冲磁体用高强高导Cu-Nb复合线材的研究进展

高强高导铜合金材料是集优良物理性能和力学性能于一体的有色金属材料，能够同时具备高强度、高电导率以及高热导率等性能。近年来，铜合金材料备受关注，在脉冲强磁场、转换开关、电接触器、引线框架及电车和电力火车导线等诸多领域展现出广阔的应用前景。Cu-Nb复合线材作为一种典型的高强度、高电导、高导热铜基复合材料，是制备超高场脉冲磁体的首选导体材料。本文系统总结了脉冲强磁场发展史，脉冲磁体导体材料用Cu-Nb复合线材的主要制备技术，芯丝结构演变特征，材料的热稳定性、强化机理及导电机理等方面的研究进展，最后指出了目前我国脉冲强磁场突破110 T所需Cu-Nb复合线材存在的问题及面临的挑战，并提出了关于未来研究重点的建议。     

IC引线框架材料的发展动向

本文着重介绍集成电路引线框架材料目前的应用状况及发展趋势,叙述了IC的发展对框架材料的要求;并展望Fe-Ni42合金、铜合金及复合材料的应用前景。     

铜基引线框架材料研究进展

引线框架是集成电路中极为关键的部件之一,其主要功能是支撑芯片、散失工作热量和连接外部电路等。铜合金以其优良的性能成为重要的引线框架材料。本文综述了铜基引线框架的国内外研究现状,并重点介绍了在Cu-Ni-Si合金中加入微量合金元素P、Cr、Ag的微合金化研究成果。     

高强度高导电铜及铜合金研究

<正>铜(Cu)因导电等性能优异而被广泛的应用于电气电子工业中[1],但纯铜硬度、抗拉强度、抗蠕变性能均较低[2],难于满足电气电子工业某些工况条件下对其强度的要求。而高强度高导电铜合金因其高导电、高强度,良好的抗磨损、抗电弧侵蚀等性能得以广泛应用[3],如可用作集成电路引线框架[4]、电气工程开关触桥、电气化铁路接触导线、大功率异步牵引电动机转子等[5]。一、高强度高导电铜合金的制备概述研究表明,铜合金中如果合金元素加入量很少,则强化效果不明显。这是因为太少的固溶原子不足以形成足够的Cottrell气团以钉扎位错,从而导     

FeNi42引线框架材料的研究进展

FeNi42合金常被用于制作高可靠性陶瓷封装集成电路的引线框架.随着集成电路向高集成度、多功能化和小型化方向发展,其引线数增多、引线间距减小,因此对引线框架材料的强度和冲裁加工性能提出了更高的要求.主要概述了在提高引线框架用FeNi42合金薄带强度和冲裁加工性能方面的研究进展,指出合金中非金属夹杂物的数量、尺寸和分布对带材性能有重要的影响,同时分析了国产该材料存在的主要问题.     

探索高强高导铜合金最佳成分的尝试

通过对一系列强度≥500MPa、导电率≥70％IACS的铜合金框架材料的化学成分、组织和性能分析,指出适当的强化相组合是获得高强高导材料的有效途径,提出用综合影响因数（Ke）来表示强化相形成元素缃入对材料强度和导电率影响的新观点,通过研究表明在铜合金材料中出现的强化相按其对强度及导电率的综合影响效果排队次序依次为：Cu3Zr、Cr、ComPn、Fe2P、Fe、2Ti和MgmPn。     

纯铜/铜合金高反射材料粉末床激光熔融技术进展EI北大核心CSCD

纯铜/铜合金具有优异的导热、导电性能,是重要的工业材料。以粉末床激光熔融为代表的激光增材制造技术具有优良的设计自由度及成形精度,是增材制造的主流发展方向。纯铜/铜合金的粉末床激光熔融与传统加工制造技术相比,前者能够更好地发挥铜优异的性能,在电子电气、汽车、航空航天等导热/导电高需求领域具有广阔的应用前景。本文综述了以纯铜/铜合金为代表的激光高反射材料的粉末床激光熔融的研究现状、面临的重要问题以及相应的解决对策分析。在此基础上,结合本课题组在纯铜/铜合金粉末床激光熔融过程的经验,指出运用蓝光、绿光等短波长激光器进行纯铜/铜合金等高反射材料的粉末床激光熔融是未来的研究热点与发展方向。     

Enhancing the mechanical–electrical property simultaneously in pure copper composites by using carbonized polymer dots

In the development of copper-based composite materials, the dilemma of improving the mechanical properties without affecting the electrical properties is an important issue that must be solved. Here, carbonized polymer dot (CPD), as a novel reinforcement, was employed to fabricate CPD/Cu (pure copper) composite via powder metallurgy technique for the first time. The microstructure analysis revealed that the CPD was uniformly dispersed in the copper matrix in the form of nanoclusters, and the nanoclusters of CPD are composed of a three-dimensional amorphous carbon (AC) network structure and inserted carbon dots (some of them have a typical graphene structure, while others not). More importantly, excellent interface combination between the CPD and copper matrix is observed due to the existing of plenty of chemical functional groups. Based on this special microstructure, our prepared CPD/Cu composite achieves excellent mechanical and electrical conductivity simultaneously. Compared to pure Cu, the ultra-tensile strength of 0.2CPD/Cu composite is increased by about 17.0%, while the elongation is only?~?2% lower. The electrical conductivity of the composite is?~?98% IACS, which is much higher than that of pure copper prepared under the same condition (only?~?92% IACS). New insights into how to prepare advanced copper matrix composites with simultaneously improved overall performance will be found from our research.

     

快速凝固高强高导铜合金的研究现状及展望

本文综述了快速凝固高强度高导电率铜合金的研究现状 ,并对将来的发展趋势作了展望。指出 ,快速凝固铜合金的凝固过程对合金的最终显微组织结构起重要作用 ,因而 ,对其进行深入细致的研究具有重要意义。     

Silica coating onto graphene for improving thermal conductivity and electrical insulation of graphene/polydimethylsiloxane nanocomposites

Graphene possess extremely high thermal conductivity, and they have been regarded as prominent candidates to be used in thermal management of electronic devices. However, addition of graphene inevitably causes dramatic decrease in electrical insulation, which is generally unacceptable for thermal interface materials(TIMs) in real electronic industry. Developing graphene-based nanocomposites with high thermal conductivity and satisfactory electrical insulation is still a challenging issue. In this study,we developed a novel hybrid nanocomposite by incorporating silica-coated graphene nanoplatelets(Silica@GNPs) with polydimethylsiloxane(PDMS) matrix. The obtained Silica@GNP/PDMS composites showed satisfactory electrical insulation(electrical resistivity of over 10~(13)Ωcm) and high thermal conductivity of 0.497 W m-1K-1, increasing by 155% compared with that of neat PDMS, even higher than that of GNP/PDMS composites. Such high thermal conductivity and satisfactory electrical insulation is mainly attributed to the insulating silica-coating, good compatibility between components, strong interfacial bonding, uniform dispersion, and high-efficiency heat transport pathways. There is great potential for the Silica@GNP/PDMS composites to be used as high-performance TIMs in electronic industry.     

1D Copper Nanostructures: Progress,Challenges and Opportunities

One‐dimensional noble metal nanostructures are important components in modern nanoscience and nanotechnology due to their unique optical, electrical, mechanical, and thermal properties. However, their cost and scalability may become a major bottleneck for real‐world applications. Copper, being an earth‐abundant metallic element, is an ideal candidate for commercial applications. It is critical to develop technologies to produce 1D copper nanostructures with high monodispersity, stability and oxygen‐resistance for future low‐cost nano‐enabled materials and devices. This article covers comprehensively the current progress in 1D copper nanostructures, most predominantly nanorods and nanowires. First, various synthetic methodologies developed so far to generate 1D copper nanostructures are thoroughly described; the methodologies are in conjunction with the discussion of microscopic, spectrophotometric, crystallographic and morphological characterizations. Next, striking electrical, optical, mechanical and thermal properties of 1D copper nanostructures are highlighted. Additionally, the emerging applications of 1D copper nanostructures in flexible electronics, transparent electrodes, low cost solar cells, field emission devices are covered, amongst others. Finally, there is a brief discussion of the remaining challenges and opportunities.     

快速凝固高强高导铜合金的研究现状及展望

本文综述了快速凝固高强度高导电率铜合金的研究现状 ,并对将来的发展趋势作了展望。指出 ,快速凝固铜合金的凝固过程对合金的最终显微组织结构起重要作用 ,因而 ,对其进行深入细致的研究具有重要意义。