硅基扩镓溅射Ga2O3反应自组装GaN薄膜

采用射频磁控溅射工艺在扩镓硅基上溅射Ga2O3薄膜氮化反应组装GaN薄膜,研究硅基扩镓时间对GaN薄膜晶体质量的影响.利用红外透射谱(FHR)、X射线衍射(XRD)、扫描电镜(SEM)、光电能谱(XPS)和荧光光谱(PL)对生成的GaN薄膜进行组分、结构、表面形貌和发光特性分析.测试结果表明:采用此方法得到六方纤锌矿结构的GaN晶体膜.同时显示:在相同的氮化温度和时间下,随着硅基扩镓时间的增加,薄膜的晶体质量和发光特性得到明显提高.但当硅基扩镓时间进一步增加时,薄膜的晶体质量和发光特性却有所降低.较适宜的硅基扩镓时间为40min.     

衬底氮化时间对玻璃衬底上低温沉积GaN薄膜结晶性的影响

采用电子回旋共振-等离子体增强金属有机物化学气相沉积(ECR-PEMOCVD)方法,在康宁7101型普通玻璃衬底上低温沉积氮化镓(GaN)薄膜.利用反射高能电子衍射(RHEED)、X射线衍射(XRD)、原子力显微镜(AFM)和霍尔测量系统检测样品,研究了衬底氮化时间对GaN薄膜质量的影响.结果表明,氮化时间为5min时,得到的GaN薄膜呈高度c轴择优取向,结晶性较好,薄膜表面是由许多亚微米量级的表面岛按一致的取向规则堆砌而成的,薄膜表面较为平整且呈n型导电;氮化时间增加,薄膜结晶性反而变差.     

ZnO薄膜的晶体性能的分析

在硅基上制备出了c轴取向高度一致的ZnO薄膜 ,这将有可能成为新型GaN单晶薄膜的过渡层。对ZnO薄膜的晶体性能进行了分析 ,研究不同衬底和不同衬底温度对ZnO薄膜的结晶状况的影响 ,并着重用TEM研究了硅基ZnO薄膜的晶体性能。     

硅衬底GaN基LED研究进展

由于硅具有价格低、热导率高、大直径单晶生长技术成熟等优势以及在光电集成方面的应用潜力,GaN/Si基器件成为一个研究热点.然而,GaN与Si之间的热失配容易引起薄膜开裂,这是限制LED及其它电子器件结构生长的一个关键问题.近年来,随着工艺的发展,GaN晶体质量得到大幅度的提高.同时不少研究小组成功地在Si衬底上制造出LED.介绍了GaN薄膜开裂问题及近期硅衬底GaN基LED的研究进展.     

金属缓冲层上生长GaN薄膜的结构、发光性能及其生长机理

为了解决硅衬底与GaN之间的晶格失配和热失配问题,实验尝试采用常压化学气相沉积法(APCVD),分别以金属镓(Ga)和氨气(NH3)为镓源和氮源,在加入A1、Au/Al两种金属缓冲层和不加缓冲层的硅衬底上生长氮化镓(GaN)薄膜.采用高分辨X射线衍射仪(HRXRD)、X-ray能谱仪(EDS)、场发射扫描电子显微镜(F...     

蓝宝石衬底的斜切角对GaN薄膜特性的影响

利用金属有机物化学气相沉积技术在具有斜切角度的蓝宝石衬底(0～0.3°)上生长了非故意掺杂GaN薄膜,并采用显微镜、X射线双晶衍射、光荧光及霍尔技术对外延薄膜的表面形貌、晶体质量、光学及电学特性进行了分析.结果表明,采用具有斜切角度的衬底,可以有效改善GaN外延薄膜的表面形貌、降低位错密度、提高GaN的晶体质量及其光电特性,并且存在一个衬底最优斜切角度0.2°,此时外延生长出的GaN薄膜的表面形貌和晶体质量最好.     

基于薄膜SOI材料的GaN外延生长应力释放机制

本文研究了SOI衬底上采用MOCVD方法生长GaN材料的应力释放机制.采用SIMOX工艺制备的具有薄膜顶层硅的SOI材料作为外延生长的衬底材料,采用MOSS在位检测系统以及拉曼测试作为GaN内部应力的表征手段.结果表明,SOI材料对硅基GaN异质外延中的晶格失配应力和热应力的释放都有显著作用.薄膜SOI材料通过顶层硅与外延层的界面滑移,将一部分晶格失配应力通过界面的滑移释放,并且通过柔性薄膜顶层硅自身的应力吸收作用,将一部分热失配应力转移到衬底,从而有效地降低了GaN外延层的张应力.     

Si基外延GaN的结构和力学性能

采用MOCVD技术在Si衬底(111)面上生长了GaN外延膜,分析了薄膜表面形貌和Si基GaN的临界载荷,研究了表面发光性能和GaN晶体质量随深度的变化.结果表明,外延层的表面比较平整,多组超晶格插入层可以进一步降低位错密度,提高晶体质量.膜的表面有许多颗粒状的发光中心,除了强的带边峰外,还有弱的黄光带和红光带,这可能是ON与VGa所产生的深能级跃迁产生的.GaN的晶体质量具有梯度变化,GaN外延层的上层晶体质量比较好,界面附近比较差,但是外延层与衬底的结合强度较高,临界载荷达到2.05 N.     

SiC缓冲层用于改善硅基氮化镓薄膜的质量研究

用脉冲激光沉积法在硅衬底上沉积GaN薄膜,为了减小Si衬底与GaN薄膜之间的热失配和晶格失配引入SiC缓冲层.脉冲激光沉积后的GaN薄膜是非晶结构,将样品在氨气氛围中在950℃下退火15min.得到结晶的GaN薄膜.并用X 射线衍射、原子力显微镜、傅立叶红外吸收谱、光致发光谱研究了SiC缓冲层对GaN薄膜的结晶、形貌和光学性质的影响.     

基于硅过渡层纳米金刚石膜/GaN复合膜系的制备（英文）

本文研发了一种简便有效的在GaN半导体衬底上直接生长纳米金刚石膜的方法。研究发现,直接将GaN衬底暴露于氢等离子体中5 min即发生分解,且随着温度从560℃升高至680℃,这种分解反应愈加剧烈,很难在GaN衬底上直接形成结合力良好的纳米金刚石膜。通过在GaN衬底上镀制几纳米厚的硅过渡层,在富氢金刚石生长环境下,抑制了GaN衬底的分解,同时在GaN衬底上沉积了约2μm厚的纳米金刚石膜。硅过渡层厚度是决定纳米金刚石与GaN衬底结合力的主要因素。当硅过渡层厚度为10 nm时,纳米金刚石膜与GaN衬底呈现出大于10 N的结合力,可能与硅过渡层在金刚石生长过程中向SiC过渡层转变有关。     

Improved growth of GaN layers on ultra thin silicon nitride/Si (1 1 1) by RF-MBE

High-quality GaN epilayers were grown on Si (1 1 1) substrates by molecular beam epitaxy using a new growth process sequence which involved a substrate nitridation at low temperatures, annealing at high temperatures, followed by nitridation at high temperatures, deposition of a low-temperature buffer layer, and a high-temperature overgrowth. The material quality of the GaN films was also investigated as a function of nitridation time and temperature. Crystallinity and surface roughness of GaN was found to improve when the Si substrate was treated under the new growth process sequence. Micro-Raman and photoluminescence (PL) measurement results indicate that the GaN film grown by the new process sequence has less tensile stress and optically good. The surface and interface structures of an ultra thin silicon nitride film grown on the Si surface are investigated by core-level photoelectron spectroscopy and it clearly indicates that the quality of silicon nitride notably affects the properties of GaN growth.     

Thermal Properties of GaN Films Grown on Si Substrates

GaN films grown on Si substrates by molecular beam epitaxy with different nitridation times have been investigated. The GaN/Si structural and optical properties were evaluated by transmission electron microscopy, X-ray diffraction, atomic force microscopy, and photoluminescence. The effective thermal conductivity of the GaN/Si system was obtained using the photoacoustic technique, and from these results the nitridation time dependence of the interface thermal conductivity (η) can be evaluated using a two-layer model. An optimal nitridation time for which the GaN crystal quality can be improved was obtained. The variation of the parameter η for different nitridation times can be related to the interface phonon scattering process by the presence of disorder at the GaN/Si interface.     

采用金属镓层氮化技术在石英衬底上生长多晶GaN

随着多晶GaN材料发光研究的不断深入 ,大面积、价格低廉的多晶GaN基光电器件的研制已成为工业生产中一个重要的研究领域。石英玻璃以其自身特有的优势 ,成为生长多晶GaN材料的较为理想的衬底。本文采用一种新的金属镓层氮化技术 ,使用无定形石英作衬底 ,在常压下制备出多晶GaN。经分析测试表明 ,生长出的多晶GaN为六方结构且质量较好 ,并观察到针状的表面结构     

GaN薄膜的制备及其振动光谱的密度泛函理论研究

以氧化镓为镓源, 用溶胶-凝胶和高温氨化二步法, 在Si(111)衬底上制备出GaN薄膜. X射线衍射(XRD)分析表明制备的GaN薄膜是六角纤锌矿结构; 扫描电子显微镜(SEM)图片显示GaN晶粒的尺寸<100nm; 薄膜的红外光谱(FTIR)中有GaN的E1 (TO)声子模式. 用密度泛函理论(DFT)计算了氮化镓小团簇的振动频率. 结果表明: 富镓氮化镓团簇的振动频率在六方晶系纤锌矿结构GaN的光学声子峰值附近; 富氮氮化镓团簇中的N--N键的振动频率为2200cm^-1. 用氮化镓团簇的频谱对所制薄膜的红外光谱作了进一步分析.     

Preparation of AlN thin films by nitridation of Al-coated Si substrate

AlN thin films have been grown on Al-coated Si(100) and Si(111) substrates by using nitridation in high-purity nitrogen ambient, where the Al layer was previously deposited on Si by ultra-high vacuum (UHV) electron beam evaporation. The temperature of nitridation was found to play an important role in the formation of AlN films. XRD results showed AlN films formed by nitridation at 1000°C for 30 min exhibited good crystallinity with the preferred orientation of (002) for both Si(111) and Si(100) cases. Other analysis techniques, like Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy have been used to evidence the formation and purity of the AlN films. Scanning electron microscope observations of the films revealed a closely-packed granular texture.     

氮化镓薄膜及其研究进展

介绍了GaN薄膜材料的主要制备方法、GaN薄膜结晶学、GaN薄膜材料的性质和应用领域,总结了GaN材料研究中存在的主要问题.     

Si(100)衬底上PLD法制备高取向度AlN薄膜

采用脉冲激光沉积法(PLD),以KrF准分子为脉冲激光源,Si(100)为衬底,同时引 入缓冲层TiN和Ti_0.8Al_0.2N,制备了结晶质量优异的A1N薄膜,X射线衍射(XRD)及反射 式高能电子衍射(RHEED)分析表明A1N薄膜呈(001)取向、二维层状生长.研究发现,薄膜 的生长模式依赖于缓冲层种类,直接在Si衬底上或MgO／Si衬底上的A1N薄膜呈三维岛状生 长;而同时引入缓冲层TiN和Ti_0.8Al_0.2N时,A1N薄膜呈二维层状生长.此外,激光能量密 度大小对A1N薄膜的结晶性有显著的影响,激光能量密度过大,薄膜表面粗糙,有颗粒状沉积 物生成.在氮气气氛中沉积,能使薄膜的取向由(001)改变为(100).     

Synthesis of GaN nanowires by CVD method: effect of reaction temperature

GaN nanowires are fabricated on Si substrates by ammoniating Ga₂O₃/NiCl₂ thin films using chemical vapour deposition method. The influence of reaction temperature on microstructure, morphology and optical properties of GaN nanowires is characterised by X-ray diffraction, X-ray photoelectron spectroscopy, Fourier transform infrared spectrophotometer, scanning electron microscopy, transmission electron microscopy, high-resolution transmission electron microscopy and photoluminescence. The results demonstrate that the GaN nanowires are single crystalline and exhibit hexagonal wurtzite symmetry. The best crystalline quality was achieved for an reaction temperature of 1150°C for 15?min. The growth process follows vapour–liquid–solid mechanism and Ni plays an important role as the nucleation point and as a catalyst.     

双靶反应磁控共溅射制备Al掺杂ZnO薄膜及其光电性能

采用双靶反应磁控共溅射法在Si（100）和载玻片衬底上制备了Al掺杂ZnO（ZAO）薄膜,利用X射线衍射仪（XRD）、原子力显微镜（AFM）、荧光分光光度计、紫外可见光分光光度计,四探针测试仪等手段对薄膜进行表征,研究了Al掺杂对ZnO薄膜结构和光电性能的影响。结果显示,Al掺杂未改变ZnO的晶体结构,ZAO薄膜沿（002）晶面生长,具有单一的紫光发射峰,在可见光区透过率大于80%,当Zn靶和Al靶溅射功率分别为100 W和20W时,ZAO薄膜的电阻率为8.85×10-4W.cm,表明利用双靶反应磁控共溅射法制备的ZAO薄膜具有较好的光电性能。