Ag,Cu对Sn-40Bi钎料合金钎焊性能和显微组织的影响

利用DSC,显微硬度仪以及SEM研究了合金元素Ag,Cu对Sn-40Bi钎料合金熔化特性、润湿铺展性、显微硬度以及焊点显微组织的影响。试验结果表明,在试验参数内随着Ag,Cu含量的增加,钎料的熔程减少,润湿铺展面积和维氏硬度增加,焊点中的Bi相得以细化。     

Sn-Zn-Cu无铅钎料的组织、润湿性和力学性能

研究了(Sn-9Zn)-xCu无铅钎料的微观组织、润湿性能和力学性能.Cu的加入使得Sn-9Zn钎料中针状富Zn相逐渐转变为Cu-Zn化合物,当Cu含量为8%时,Cu6Sn5相生成.Sn-Zn-Cu合金熔点随着Cu含量增加而升高,同时润湿性随Cu的加入得到显著改善.使用中性活性松香钎剂,钎料与Cu箔钎焊时的润湿角显著减小.Sn-9Zn的润湿角为120°,而(Sn-9Zn)-10Cu的润湿角为54°.这是由于Cu的加入降低了Zn的活性,减少了Zn在钎料表面氧化,降低了液态钎料表面张力,使得钎料能获得较好的润湿性.合金在2%Cu时获得较高的强度,随着Cu含量的增加,Cu-Zn化合物相对增多,抗拉强度有所下降;而合金的塑性随着Cu的加入迅速下降.     

Fe颗粒含量对Sn35Bi/Cu钎焊接头组织性能影响

采用扫描电镜(SEM)、能谱仪(EDS)以及万能力学试验机等研究了Fe颗粒含量对Sn35Bi-xFe/Cu钎焊接头组织和性能的影响,并研究了Fe颗粒含量对Sn35Bi-Fe合金钎料的铺展面积和润湿性的影响.结果表明:向Sn35Bi合金钎料中加入少量Fe颗粒,会在Fe颗粒周围生成很薄的FeSn2化合物,降低固相/液相的界面能,提高相的形核率,细化接头的组织;当Fe颗粒含量为1 mass％时,接头组织的细化程度最佳;向Sn35Bi合金钎料中加入Fe颗粒,可以有效提高合金钎料的润湿性和力学性能,当Fe含量为1 mass％时,Sn35Bi-1Fe合金钎料的铺展面积最大,润湿角最小,润湿性能最佳,Sn35Bi-1Fe/Cu接头的剪切强度达到最大,为50.23 MPa,与Sn35Bi/Cu接头相比,提高了37.7％.     

Cu含量对Bi5Sb钎料润湿性能和力学性能的影响

通过在Bi5Sb中添加不同含量的Cu形成新型BiSbCu三元合金.结果表明:在Bi5Sb钎料合金中添加0.5%～5.0%(质量分数)Cu,BiSbCu钎料合金的熔点变化不大,但其润湿性能和力学性能明显改善;当Cu含量为1.5%时,(Bi5Sb)1.5Cu钎料合金的润湿性能和力学性能最好,与基体Bi5Sb相比,(Bi5Sb)1.5Cu的铺展面积增大57.8%,抗拉强度提高212.4%;随着Cu含量的增大,针状组织Cu2Sb的含量逐渐增多,钎料合金性能下降.     

Bi对Sn-Cu-Zn无铅钎料性能的影响

以Sn-0.7Cu-Zn三元合金钎料为基础,研究添加不同含量的Bi元素对合金的熔点、电导率、润湿性以及力学性能的影响。通过差式扫描量热仪(DSC)、万能拉力试验机分别对不同配比的钎料合金进行熔点和力学性能测试,采用铺展性试验法表征其在铜铝板上的润湿性能。研究表明:随着Bi元素含量的增加,其熔点开始下降,但熔程会增加;电导率随着Bi元素含量的增加而减少。随着Bi元素含量的增加,四元合金钎料润湿性能先增加后减少,Bi的含量为1%时可以大幅提高铜铝板上的润湿性能。Bi元素能影响合金的抗拉强度,但合金的伸长率会下降。     

Bi对Sn-0.3Ag-0.7Cu无铅钎料熔点及润湿性能的影响

研究了添加适量的Bi元素对低银型Sn-0．3Ag-0．7Cu无铅钎料合金性能的影响,应用差示扫描量热仪和SAT-5100型润湿平衡仪对Sn-0．3Ag-0．7Cu·xBi（x=0.1,3,4．5）钎料的熔点、润湿性能作了对比试验分析。结果表明,一定量Bi元素的加入可以降低Sn-0．3Ag-0．7Cu钎料合金的熔点,并改善其润湿性能。但过多的Bi元素会导致钎料的液固相线温度差增大,塑性下降,造成焊点剥离缺陷。综合考虑得到Sn-0．3Ag-0．7Cu-3．0Bi无铅钎料具有最佳的综合性能。     

Sn-Bi-In低温无铅钎料的组织和性能研究

研究了Sn-Bi-In钎料的微观组织、热学特性、润湿性能以及力学性能随合金成分的变化特点。结果表明：Sn-Bi-In钎料的显微组织含有β-Sn相、Bi相以及InBi中间相,Bi含量的减少会导致Bi相和InBi相所占比例降低;钎料DSC曲线中存在三个不同大小的吸热峰,所有合金熔化开始温度在101.3-103.4℃之间,随着Sn含量的增加,钎料的熔程先减小后增大,铺展面积先增大后减小;钎料的显微硬度随着Bi含量的增加而增大,且In的添加使钎料的硬度明显高于Sn-Bi共晶合金;钎料的抗拉强度和断后伸长率随着Bi含量的增大而降低。     

锡镀层对BAg50CuZn钎料性能的影响

以BAg50CuZn钎料为研究对象,在其表面电镀锡,借助扫描电镜(SEM)观察锡镀层的表面形貌,采用差热分析仪(differential scanning calorimetry,DSC)和润湿试验炉分析锡镀层对合金钎料熔化温度和润湿性能的影响,并对镀覆锡后合金钎料的成分进行了讨论.结果表明,随着钎料表面镀覆Sn元素含量增加,合金钎料的DSC吸热峰向左偏移、熔化温度降低,钎料的润湿铺展性能呈上升趋势.在镀覆Sn元素含量为4.8%(质量分数)时,合金钎料表面锡镀层平整、致密,钎料的铺展面积最大,为236 mm2.镀覆元素Sn后的钎料中,Ag,Cu,Zn元素含量均减少,元素含量降低幅度大小顺序依次为Cu,Ag,Zn.     

Sn-Bi-In低温无铅钎料的组织和性能

研究了Sn-Bi-In钎料的微观组织、热学特性、润湿性能以及力学性能随合金成分的变化特点。结果表明:Sn-Bi-In钎料的显微组织含有β-Sn相、Bi相以及InBi中间相,Bi含量的减少会导致Bi相和InBi相所占比例降低;钎料DSC曲线中存在3个不同大小的吸热峰,所有合金熔化开始温度在101.3~103.4℃之间,随着Sn含量的增加,钎料的熔程先减小后增大,铺展面积先增大后减小;钎料的显微硬度随着Bi含量的增加而增大,且In的添加使钎料的硬度明显高于Sn-Bi共晶合金;钎料的抗拉强度和断后伸长率随着Bi含量的增大而降低。     

Ag元素含量对Sn-Ag-Cu钎料焊接性的影响

以Sn-xAg-0.5Cu为基体制备了低银无铅钎料,其中Ag元素的质量分数分别为0.3%,0.5%,0.7%,0.9%.借助钎料合金的DSC熔化曲线,分析了Ag元素含量对合金熔点的影响规律.通过比较各组钎料合金在Cu基板上的铺展面积和铺展率,分析了Ag元素含量的变化对各组钎料润湿性的影响规律.结果表明,随着Ag元素含量...     

Effect of Nd and La on surface tension and wettability of Sn-8Zn-3Bi solders

Maximum bubble pressure measurement was employed to evaluate surface tension of Sn-8Zn-3Bi- （0-0.15）Nd and Sn-8Zn-3Bi-（0 -0. 15）La solder melts. Wetting balance method was used to measure wetting force and wetting time on Cu substrate of the two group solders. The experimental results show that minute amount of Nd or La addition to Sn-8Zn-3Bi solder causes significant decrease of the surface tension of the solder melts at 200 - 240 ℃ and Nd addition is more effective on reduction of surface tension than that of La. Nd or La addition has the effect on enhancing the wetting force of the solder melts on Cu substrate, which results from the de- crease of interracial tension between the solder melt and Cu substrate. The wetting force reaches the maximum when 0.1% Nd is added to the base alloy. The contact angle between Sn-8Zn-3Bi base solders and Cu substrate decreases with the addition of Nd or La and the minimum of the contact angle is obtained from the solder with 0.1% Nd addition.     

Wetting kinetics of SiC nanoparticle reinforced Sn-Pb eutectic solders

SiC nanoparticles reinforced eutectic Sn-Pb solder were prepared by mechanical mixing method. Reactive wetting of the resultant composite solders on Cu substrates was investigated using real time, in-situ visualization of the triple-line movement. It was found that spreading rates of all solder pastes in this work do not obey Tanner's law of non-reactive spreading. SiC nano-particles slow down both the pre-melting and post-melting spreading rates of composite solder pastes. As the content of SiC nano-particles increase, the melting point of composite solders decrease, and the spreading time of molten composite solder pastes increases.     

Sn-6Bi-2Ag(Cu, Sb)无铅钎料合金微观组织分析

利用差示扫描量热计 (DSC)测定了Sn 6Bi 2Ag ,Sn 6Bi 2Ag 0 .5Cu ,Sn 6Bi 2Ag 2 .5Sb三种新无铅钎料合金的熔化温度。结果表明 ,少量Cu的加入能降低Sn Bi Ag系无铅钎料合金的熔化温度 ,而Sb的加入使合金的熔化温度升高。利用光学显微镜 (OM )、扫描电子显微镜 (SEM )、能谱分析 (EDX)对合金的微观组织进行了分析与比较 ,钎料合金的微观组织与冷却条件和合金元素的含量有关 ,Sb的加入使析出相的尺寸细化。硬度测定表明Sn Bi Ag(Cu ,Sb)无铅钎料合金的硬度远大于纯Sn的硬度 ,加入少量的Cu(0 .5 % ) ,Sb(2 .5 % )对Sn Bi Ag系钎料合金的硬度影响较小     

Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag,Bi, In and Sb addition

The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu (SAC) solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6Cu-0.05Ni-Ge (SCNG) lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG–x (x=Ag, Bi, In, Sb) solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG–x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.     

Ag和Ni元素对Sn-Sb-Cu无铅钎料熔化温度和铺展性能的影响

在Sn-Sb-Cu三元钎料合金中添加微量元素Ag和Ni,通过合金化形成Sn-Sb-Cu-Ag和Sn-Sb-Cu-Ni两种新型四元无铅钎料合金,以改善基体钎料性能.结果表明,在Sn-Sb-Cu钎料合金中添加微量元素Ag,合金熔化温度较基体钎料下降,铺展面积增大,这与钎料过热度增大,形成弥散低熔点相SnAg和液态钎料表面张力减小有关;添加微量元素Ni,合金熔化温度较基体钎料下降,铺展性能稍稍变差,这是因为添加微量元素Ni后,Sn-Sb-Cu-Ni液态钎料粘度提高,表面张力增大.且在钎料与铜基板处形成了多面体形状(Cu,Ni)6Sn5,且该相覆盖在Cu6Sn5表面,不利于液态钎料的润湿铺展.     

In对Sn-8Zn-3Bi无铅钎料润湿性的影响

首先采用铺展法测试了Sn-8Zn-3Bi-(0～5)In钎料合金的铺展性.结果表明,少量In的加入提高了钎料的润湿性.当In含量达到0.5%时(质量分数,下同),钎料在铜基底上的铺展面积最大.采用气泡最大压力法对Sn-8Zn-3Bi-(0～1.5)In钎料熔体进行了表面张力测试.加入0.5%的In大大降低了Sn-8Zn-3Bi钎料熔体的表面张力,但进一步增加In的含量导致熔体表面张力增大.最后采用润湿平衡法对上述钎料进行了润湿力测试.结果表明0.5%In的加入使合金的润湿力达到最大,其原因是钎料/铜界面的界面张力减小.     

铋和磷元素对Sn-Zn-RE电子微连接钎料组织与性能的影响

制备了含不同Bi,P元素的（Sn-9Zn0.05Ce）xBi和（Sn-9Zn0.05Ce）xP钎料合金,观察并分析了钎料的显微组织形貌,测试了钎料的抗拉强度、断后伸长率以及维氏硬度.结果表明,添加Bi元素能显著提高Sn-9Zn0.05Ce钎料合金的抗拉强度和硬度,但同时会明显降低其断后伸长率,而添加微量P元素对钎料的抗...     

Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder

The interfacial reactions of Sn–Zn based solders and a Sn–Ag–Cu solder have been compared with a eutectic Sn–Pb solder. During reflow soldering different types of intermetallic compounds (IMCs) are found at the interface. The morphologies of these IMCs are quite different for different solder compositions. As-reflowed, the growth rates of IMCs in the Sn–Zn based solder are higher than in the Sn–Ag–Cu and Sn–Pb solders. Different types of IMCs such as γ-Cu₅Zn₈, β-CuZn and a thin unknown Cu–Zn layer are formed in the Sn–Zn based solder but in the cases of Cu/Sn–Pb and Cu/Sn–Ag–Cu solder systems Cu₆Sn₅ IMC layers are formed at the interface. Cu₆Sn₅ and Cu₃Sn interfacial IMCs are formed in the early stages of 10 min reflow due to the limited supply of Sn from the Sn–Pb solder. The spalling of Cu–Sn IMCs is observed only in the Sn–Ag–Cu solder. The size of Zn platelets is increased with an increase of reflow time for the Cu/Sn–Zn solder system. In the case of the Sn–Zn–Bi solder, there is no significant increase in the Zn-rich phases with extended reflow time. Also, Bi offers significant effects on the wetting, the growth rate of IMCs as well as on the size and distribution of Zn-rich phases in the β-Sn matrix. No Cu–Sn IMCs are found in the Sn–Zn based solder during 20 min reflow. The consumption of Cu by the solders are ranked as Sn–Zn–Bi > Sn–Ag–Cu > Sn–Zn > Sn–Pb. Despite the higher Cu-consumption rate, Bi-containing solder may be a promising candidate for a lead-free solder in modern electronic packaging taking into account its lower soldering temperature and material costs.     

添加铜对Sn-9Zn无铅钎料性能的影响

采用向钎料合金熔体中添加铜粉的方法得到了原位生长金属间化合物颗粒增强的Sn-Zn基复合无铅钎料,并对其熔化行为、组织、力学性能和在铜基体上的润湿性进行了研究.差示扫描量热计(DSC)测量结果表明,少量铜粉对Sn-9Zn的熔点影响较小,但铜粉添加量达3%时将使其熔点急剧升高.铜粉的添加使Sn-9Zn钎料中形成了较均匀分布的Cu5Zn8化合物颗粒相,同时棒状富Zn相相应减少.力学性能测试结果显示,复合钎料的抗拉强度和塑性都得到了改善,抗蠕变性能显著提高;润湿性测量表明,复合钎料对铜的润湿性也有所改善.