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The properties of ZnO thin film on sapphire (0001) substrate fabricated by single source chemical vapour deposition (SSCVD) method are studied. X-ray diffraction (XRD) analysis demonstrates that the film exhibits hexagonal structures but with preferential nonpolar (100) plane orientation, which is different from the crystalline structure of substrate, and its formation mechanism is also analyzed. The film has the characteristic of p-type conductivity originating from excess of oxygen, and its p-type conductivity is comparatively stable due to its nonpolar plane orientation. A strong ultraviolet (UV) emission and a high light transmission in visible wavelength region are observed from photo-luminescence (PL) spectrum and transmittance spectra at the room temperature, and the strong ultraviolet emission originates from the recombination of free and bound excitons. Compared with the ZnO film on silicon substrates, the exciton emission peaks of the film on sapphire substrate show a slight blue shift about 50 meV, which might be related to the different crystallite sizes or surface stress of the films. 相似文献
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在Ar气气氛下对热氧化n型4H-SiC生长的SiO2薄膜进行了1100 ℃以下不同温度的退火, 采用反射式椭圆偏振光谱、红外透射光谱研究了退火温度对SiO2薄膜致密性的影响. 椭偏测试的结果表明, 600 ℃退火后样品具有最大的折射率1.47和最小的厚度84.63 nm. 红外研究的结果显示, 600 ℃退火后LO峰强度最强, 认为是对应Si-O结构单元浓度最高. Al/SiO2/SiCMOS结构SiO2的漏电特性研究表明, 600 ℃退火后的SiO2薄膜漏电流相比于其他温度退火的氧化层漏电流小了两个数量级. 在外加反向偏压5V时, 漏电流密度仅仅只有5×10-8 A/cm2.600 ℃退火能显著地改善热氧化层SiO2的致密性. 相似文献
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The stable properties of N-doped p-type ZnO thin films with preferential nonpolar (100) plane orientation relative to polar (002) plane orientation are investigated. The two kinds of oriented thin films are fabricated by the methods of post heat treatment and double sources in situ, respectively. The Hall investigations demonstrate that N-doped p-type ZnO thin films with preferential nonpolar (100) plane orientation are more stable, and the results are also proved by build-in electric field model and electronic structure calculations of the films based on the first orinciple. 相似文献
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以SiH4为先驱气体,采用低频等离子体增强化学气相沉积(LF-PECVD)方法在Si衬底上制备了氢化非晶硅(a-Si∶H)薄膜。在薄膜沉积过程中,工艺参数将会影响非晶硅薄膜的沉积速率和光学性能。通过反射式椭圆偏振光谱仪(SE)研究了SiH4气体流量、工作压强和衬底温度等条件对氢化非晶硅沉积速率和光学性质的影响。实验结果表明,氢化非晶硅沉积速率随着SiH4流量、工作压强和衬底温度的改变而规律地变化。相比于SiH4流量和工作压强,衬底温度对折射率、吸收系数和折射率的影响更大。各工艺条件下所制备的非晶硅薄膜光学禁带宽度在1.61~1.77eV。 相似文献