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1.
A Generalised Additive Modelling (GAM) approach is applied to prediction of both particulate and dissolved nutrient concentrations in a wet-tropical river (the Fitzroy River, Queensland, Australia). In addition to covariant terms considered in previous work (i.e. flow, discounted flow and a rising-falling limb term), we considered several new potential covariates: meteorological and hydrological variables that are routinely monitored, available in near-real time, and were considered to have potential predictive power. Of the additional terms considered, only flows from three tributaries of the Fitzroy River (namely, the Nogoa, Comet and Isaac Rivers) were found to significantly improve the model. Inclusion of one or more of these additional flow terms greatly improved results for dissolved nitrogen and dissolved phosphorus concentrations, which were not otherwise amenable to prediction. In particular, the Nogoa sub-catchment, dominated by pasture for cattle, was found to be important in determining dissolved inorganic nitrogen and phosphorus concentrations reaching the river mouth. This insight may direct further research, including future refinement of processed-based catchment models. The GAMs described here are used to provide near real-time river boundary conditions for a complex coupled hydrodynamic and biogeochemical model of the Great Barrier Reef Lagoon, and can be coupled with a forecasting hydrological model to allow integrated forecasting simulations of the catchment to coast system.  相似文献   
2.
核聚变堆用钨表面超精密抛光的研究现状与趋势   总被引:1,自引:0,他引:1  
钨作为未来核聚变堆中最有前景的面向等离子体材料,在反应堆工况下将承受高能粒子的辐照冲击。表面质量的好坏会直接影响材料的氢/氦滞留行为和辐照损伤程度,进而影响聚变堆的安全性和可靠性。现阶段,针对钨的抗辐照改性研究主要着眼于材料的成分、结构和组织设计,关于机械加工对材料表面抗辐照改性的研究甚少。文章聚焦前沿科学问题,从机械加工角度分析核材料领域科学问题,结合国内外相关研究成果及核聚变堆用钨(PFM-W)的机械加工现状,阐述了PFM-W表面超精密抛光的必要性。通过对比不同抛光方法,提出了磁流变抛光和力流变抛光是较为适合PFM-W表面超精密加工的观点,并对未来PFM-W表面超精密抛光研究趋势进行了分析,重点在抛光方法的探索以及抛光后材料表面质量对抗辐照性能影响的研究。  相似文献   
3.
介绍了硼酸锂铯(CLBO)晶体的应用前景及在化学机械抛光过程中存在的问题,简要分析了晶体在常温下开裂的机理,选用无水溶剂对晶体进行化学机械抛光以防止加工过程中晶体的潮解开裂。分析了抛光液、压力、温度、pH值参数对抛光过程的影响,通过合适配比使速率可达1.5~2μm/min,且表面质量较好。  相似文献   
4.
提出了在碱性抛光液中铝薄膜化学机械抛光的机理模型,对抛光液的pH值、磨料、氧化剂浓度对过程参数的影响做了一些试验分析。试验结果表面粗糙度的铝薄膜所需的最优化CMP过程参数:硅溶胶粒径为15~20nm,pH值为10.8~11.2,氧化剂浓度为2.5%~3%。  相似文献   
5.
The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.  相似文献   
6.
激光抛光技术的发展与展望   总被引:8,自引:0,他引:8  
江超  王又青  胡少六 《激光技术》2002,26(6):421-424
介绍激光抛光技术的发展历史,阐明激光抛光的应用现状及未来的发展前景,论述了激光抛光的工艺特点和作用机理,将激光抛光技术与其它抛光技术进行了全面的对比,指出激光抛光的优势及其存在的问题。  相似文献   
7.
Chemical mechanical polishing of polymer films   总被引:2,自引:0,他引:2  
Strategies to reduce capacitance effects associated with shrinking integrated circuit (IC) design rules include incorporating low resistivity metals and insulators with low dielectric values, or “low-κ” materials. Using such materials in current IC fabrication schemes necessitates the development of reliable chemical mechanical polishing (CMP) processes and process consumables tailored for them. Here we present results of CMP experiments performed on FLARE™ 2.0 using a specialized zirconium oxide (ZrO2) polishing slurry. FLARE™ 2.0 is a poly(arylene) ether from AlliedSignal, Inc. with a nominal dielectric constant of 2.8. In addition, we provide insight into possible removal mechanisms during the CMP of organic polymers by examining the performance of numerous abrasive slurries. Although specific to a limited number of polymers, the authors suggest that the information presented in this paper is relevant to the CMP performance of many polymer dielectric materials.  相似文献   
8.
黎建明  屠海令  郑安生  陈坚邦 《稀有金属》2003,27(2):299-302,313
用透射电子显微镜、扫描电镜对锑化镓材料切、磨、抛等加工工艺引入的表面损伤进行观察和检测。结果表明:切割加工是锑化镓单晶晶片表面损伤层引入的主要工序;锑化镓单晶切割片表面极不平整,有金刚砂所引起的较粗桔皮皱纹;其表面损伤层深度≤30μm;双面研磨的锑化镓晶片表面仍有较粗桔皮皱纹,但比切割片的要细,而且桔皮皱纹的深浅随磨砂(Al2O3)粒径的减小而变细变浅;晶片的表面损伤层深度(≤5μm)也随着磨砂粒径的减小而减小。一般情况下,其损伤层的深度约为磨砂粒径的1/2。机械化学抛光加工的锑化镓晶片表面的SEM像观察不到桔皮皱纹;其损伤层深度约55nm。  相似文献   
9.
皮革去污上光用乳化蜡的研制   总被引:8,自引:0,他引:8  
采用石蜡、微晶蜡为主要原料 ,经实验选出了以水为稀释剂的乳化型皮革去污上光蜡。实验优化的配方为石蜡 12 .5 g ,微晶蜡 8.0 g ,硬脂酸 8.5g ,三乙醇胺 5 .5 g ,水量 70 (涂用 )或 130 g(喷用 )。反应条件为乳化时间 4 0min ,搅拌速度 5 0 0~ 70 0r/min ,乳化温度 90℃。制得上光剂产品的去污性能可与用去污剂单独处理的效果相当 ,亮度可达 6 6 .7。  相似文献   
10.
A common debugging strategy involves reexecuting a program (on a given input) over and over, each time gaining more information about bugs. Such techniques can fail on message-passing parallel programs. Because of nondeterminacy, different runs on the given input may produce different results. This nonrepeatability is a serious debugging problem, since an execution cannot always be reproduced to track down bugs. This paper presents a technique for tracing and replaying message-passing programs. By tracing the order in which messages are delivered, a reexecution can be forced to deliver messages in their original order, reproducing the original execution. To reduce the overhead of such a scheme, we show that the delivery'order of only messages involved inraces need be traced (and not every message). Our technique makes run-time decisions to detect and trace racing messages and is usuallyoptimal in the sense that the minimal number of racing messages is traced. Experiments indicate that only 1% of the messages are often traced, gaining a reduction of two orders of magnitude over traditional techniques that trace every message. These traces allow an execution to be reproduced any number of times for debugging. Our work is novel in that we adaptively decide what to trace, and trace only those messages that introduce nondeterminacy. With our strategy, large reductions in trace size allow long-running programs to be replayed that were previously unmanageable. In addition, the reduced tracing requirements alleviate tracing bottle-necks, allowing executions to be debugged with substantially lower execution time overhead.This work was supported in part by National Science Foundation grants CCR-8815928 and CCR-9100968, Office of Naval Research grant N00014-89-J-1222, and a grant from Sequent Computer Systems, Inc.  相似文献   
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