Scaling‐up PECVD system for large‐sized substrate processing

Abstract— With the prevailing trend of large‐panel TFT monitors and, most recently, LCD TVs, large‐sized‐substrate processing is becoming the mainstream of TFT‐LCD production. To enable this trend of ever‐increasing large‐area processing, a multiple generations of PECVD systems for volume production has been successfully developed. This paper discusses the scaling‐up challenges from the equipment manufacturer's perspective, with the focus on process scalability, system design optimization, productivity enhancement, and cost‐of‐ownership reduction.     

用于室温红外探测器热敏材料的PECVD掺硼a-Si薄膜的研究

采用PECVD法制备用于室温红外探测器中热敏感材料的掺硼a-Si薄膜。通过系统地研究气体流量、射频功率与衬底温度等制备工艺条件与薄膜的电导率、含氢量和电阻温度特性的相关性,得到了最佳的工艺条件,并利用其制备出了探测灵敏度高达2.17×108cmHz1/2W-1的a-Si室温红外探测器。     

射频等离子体聚合SiOx薄膜的研究

在射频等离子体放电条件下，以六甲基二硅氧烷（Hexamethyldisilone，HMDSO）为单体，氧气为反应气体，在PET薄膜及载玻片上聚合SiOx薄膜。通过红外光谱（FTIR）分析了工作压强、功率、单体氧气比、聚合时间等对聚合薄膜的结构和沉积速度的影响；通过扫描电子显微镜（SEM）观察了薄膜的表面形貌；通过表面轮廓仪测试了薄膜厚度，计算了沉积速率并对薄膜的均匀性做了研究。在38％恒温水浴箱中进行的水蒸汽阻隔实验表明，PET薄膜的阻隔性能得到有效的提高。     

磁激活等离子体增强化学气相沉积设备的研制

针对PECVD中等离子体的密度沿径向分布均匀性较差、空间气氛化学活性较差的问题,在PECVD的基础上加入电子发射源和正交电磁场以控制电子的运动,从而增强等离子场的强度和范围,使反应场的活力增加,以提高反应空间的活化能力,继而提高膜层质量.结果表明,该方法可以使等离子场的分布发生改变,使等离子体密度及范围做到可控制且可调整.     

Characterisation of SiOxCyHz thin films deposited by low-temperature PECVD

SiO_xC_yH_z thin films were deposited from hexamethyldisiloxane (HMDSO)/O₂ mixtures in a parallel plate, capacitively coupled, RF plasma reactor. Polyethylene terephthalate (PET), Si(1 0 0) wafers and KBr tablets were chosen as substrates. Effect of HMDSO/O₂ ratio, total treatment pressure and power input on the properties of the deposited films were investigated. The structure and bondings were studied by means of Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy. Wettability characteristics of the deposited thin films were investigated by means of water droplet contact angle measurements. Surface morphology was investigated with atomic force microscopy. Barrier properties of the SiO_xC_yH_z thin films were investigated by measuring the water vapour transmission rate of the coated PET substrates. Correlations between the characteristics of the deposited film and their barrier properties were discussed.     

氨气预氮化制备超薄氮化硅薄膜及电学性能

为寻求制备性能良好的纳米厚度氮化硅(SiN_x)薄膜的方法,采用NH_3等离子体氮化、SiH_4/NH_3等离子增强化学淀积法及先氮化后淀积的方法制备了三种SiN_x薄膜,研究比较了三种薄膜的性质。用X射线光电子谱检测了NH_3等离子体氮化Si片得到的SiN_x薄膜的组分,利用椭圆偏振光谱仪测量薄膜厚度,估算了氮化速率。用NH_3和SiH_4作为反应气,分别在原始硅片和经过NH_3预氮化后的硅片上淀积厚度为5 nm、10 nm和50 nm的SiN_x薄膜。用电容-电压法研究了薄膜样品的电学性质,发现单纯用NH_3等离子体氮化的薄膜不适合做介质膜,而先用NH_3氮化再淀积SiN_x的样品比直接淀积SiN_x的样品界面性能明显改善,界面态密度降低到1～2×10~(11)eV~(-1) cm~(-2)。     

p-Si TFT栅绝缘层用SiN薄膜的研究

以NH3和SiH4为反应源气体,采用射频等离子体增强化学气相沉积(RF-PECVD)法在多晶硅(p-Si)衬底上沉积了一系列SiN薄膜,并利用椭圆偏振测厚仪、超高电阻-微电流计、C-V测试仪对所沉积的薄膜作了相关性能测试.系统分析了沉积温度和射频功率对SiN薄膜的相对介电常数、电学性能及界面特性的影响.分析表明,沉积温度和射频功率主要是通过影响SiN薄膜中的Si/N比影响薄膜的性能,在制备高质量的p-Si TFT栅绝缘层用SiN薄膜方面具有重要的参考价值.     

PECVD沉积SiO2和SiNX对p-GaN的影响

在等离子增强化学气相沉积法(PECVD)沉积SiO2和SiNX掩蔽层过程中，分解等离子体中浓度较高的H原子使Mg-受主钝化，同时在p-GaN材料表面发生反应形成浅施主特性的N■■空位。高能量离子轰击造成的材料深能级缺陷增多以及沉积形成致密的SiO2和SiNX材料，阻碍了H原子向外扩散，使H原子在Ni/Au电极与p-GaN的界面处聚集，造成p-GaN近表面附近区域Mg-H络合物密度的提高，空穴浓度急剧下降，导致Ni/Au透明电极I-V特性严重恶化。选择较低的射频功率(15 W,13.56 MHz)沉积模式，经过适当的退火，可以减小沉积SiO2过程对p-GaN的影响。     

Plasma enhanced chemical vapor deposition of SiO2 films at low temperatures using SiCl4 and O2

Silicon dioxide films have been deposited by Plasma-Enhanced Chemical Vapor Deposition (PECVD) technique using SiCl₄ and O₂ as reactive materials. Infra-red transmittance, Auger electron spectroscopy analysis, ellipsometry, electrical, and chemical etch measurements have been used to characterize these films. It is possible to obtain good quality oxides at a substrate temperature of 200° C using a low flow of reactant gases. High flow of reactant gases results in highly non-homogeneous porous films. The best oxide films obtained show destructive breakdown at electrical fields above 4 MV/cm and a fixed charge density of the order of 2.6 × 10¹¹ charges/cm².     

Glass: A critical material in the development of electronic displays

Electronic displays may be grouped into two categories, vacuum based and solid state. In both cases, glass has served as the package for the active components making up the display. Thus, glass has often been the limiting factor in the development of these technologies. This paper discusses the interrelationships between the two.