等离子喷涂W-Cu电子封装材料的组织与性能

采用等离子喷涂工艺制备了W-Cu电子封装材料，并对该电子封装材料的微观组织和热物理性能进行了研究．结果表明，在内部送粉条件下，复合材料中钨的收得率要高于外部送粉条件下复合材料中钨的收得率；在内部送粉条件下，功率对铜氧化的影响并不明显；而在外部送粉条件下，随着功率的提高，铜的氧化明显增多；由于氧化物和孔隙等的存在，利用大气等离子喷涂工艺制备的复合材料的导热率远远低于根据混合法则计算的理论值．这为后续实验研究提供了重要的参考依据．     

中国玻璃包装工业的回顾与展望

对我国玻璃包装工业的现状进行详细分析,对比国外发达国家的发展趋势,提出了我国玻璃包装工业“十一五”发展规划的战略目标。     

环保型缓冲材料在吸顶灯包装设计中的应用

对纸浆模塑和瓦楞纸板的吸顶灯缓冲包装进行了分析比较,通过物流过程模拟,分别对两种包装方案做了跌落试验。并从环保、降低成本以及保护产品的角度出发,采用纸浆模塑对吸顶灯的包装进行了改进设计,其包装方案经过试验测评证明是可行的,成功的。     

包装成人教育"双师型"的师资构建

随着包装产业的飞速发展,给包装成人教育提出了新的挑战。打造一支既能从事理论教学,又能从事实践教学的“双师型”师资队伍,才能培养出大批推动包装经济飞速发展的高素质职业技能人才,才能实现我国由“包装大国”走向“包装强国”。     

包装教育改革之我见

从包装教育改革的必要性和紧迫性出发,结合我国当前的实际情况,从教育体制、培养机制等方面提出了改革我国包装教育的举措。     

微机电系统的封装技术

MEMS封装是在微电子封装技术基础上发展起来的一项关键的MEMS技术。介绍了MEMS封装技术的功能、特点与分类。在此基础上,重点介绍了键合技术、上下球栅阵列技术、倒装芯片技术、多芯片技术以及3-D技术等几种重要的MEMS封装技术。最后,进一步探讨了MEMS封装的发展趋势及研究方向。     

Preservation of strawberries by modified atmosphere packages with other treatments

The impact of modified atmosphere packaging (MAP), in combination with ozone treatment and an edible film coating, on the preservation of strawberries was studied. A combination of 2.5% O₂ with 15% CO₂ was the optimum gas composition for the MAP of strawberries and prolonged shelf‐life by 4–6 days. When the strawberries were pre‐treated with a 4.3 mg/m³ ozone water dip and an edible coating prior to packaging, the shelf‐life was extended to 8–10 days. The results showed that two treatments [No.1: polyvinyl alcohol 134 (2%); monostearatacylglycerol (0.5%); phytic acid (0.05%); sorbitol (0.05%); sodium alginate (0.1%); absolute alcohol (8%): No.2: polyvinyl alcohol 134(1%); soluble starch (1%); glucose (1%); sucrose (1%); sodium alginate (0.1%); sorbitol (0.05%)] gave the best effects on strawberry quality and shelf‐life. All treatments (Nos 1–4) were obviously superior to check experiments for soluble sugar, ascorbic acid, acidity and anthocyanin. Furthermore, the treatments gave superior results for browning index, commodity ratio and permeability of the cell membrane. Copyright © 2006 John Wiley & Sons, Ltd.     

Modified atmosphere packaging of fresh produce using microporous earthenware material

Microporous earthenware sheets of 5.5–5.6mm thickness were fabricated with or without a glazing treatment by passing through a sequential firing procedure in a furnace. Their microstructure and gas permeability against oxygen and carbon dioxide were measured and examined for their usability in modified atmosphere packaging of fresh produce. Compared with plastic packaging materials, earthenware sheets with a high proportion of micropores had very high gas permeability and gave CO₂:O₂ permeability ratios close to 1. Glazing treatment smoothed the surface by clogging the pores on the surface and significantly decreased gas permeability, without affecting the internal microstructure of the earthenware. When the earthenware sheet was combined with a plastic box and used in packaging for strawberries and enoki mushrooms at 5°C, its unique permeability properties developed a modified atmosphere that was beneficial for preserving the quality of the produce. Changes in the earthenware's permeability characteristics due to moisture adsorption and condensation need to be resolved so that the dynamic changes occurring in package atmosphere over time can be better understood. Copyright © 2006 John Wiley & Sons, Ltd.     

铝材在包装、容器工业上的开发与应用

介绍了包装、容器铝材的发展概况，着重论述了铝合金易拉罐罐料的应用与开发及包装铝箔的开发与应用。指出铝合金材料仍是各种硬包装和软包装的主要用材之一。     

Simulation and analysis of effects of Young’s modulus of isolation material on natural frequencies of the sensor package and displacement of the chip

During the last ten years, Micro-electromechanicalSystems (MEMS) technology developed very rapidlyand with that came great achievements. Currently, theMEMS devices are different types of sensors, which areusually applied to measure physical quantities such aspressure, the acoustic signal, mass, motion, accelera-tion, rotation, velocity of flow, chemical reaction, vi-bration, and so on. Additionally, some sensors havebeen manufactured[1]. MEMS packaging technologydevelops slowly due to the…