Microstructural and mechanical properties assessment of transient liquid phase bonding of CoCuFeMnNi high entropy alloy

The transient liquid phase (TLP) bonding of CoCuFeMnNi high entropy alloy (HEA) was studied. The TLP bonding was performed using AWS BNi-2 interlayer at 1050 °C with the TLP bonding time of 20, 60, 180 and 240 min. The effect of bonding time on the joint microstructure was characterized by SEM and EDS. Microstructural results confirmed that complete isothermal solidification occurred approximately at 240 min of bonding time. For samples bonded at 20, 60 and 180 min, athermal solidification zone was formed in the bonding area which included Cr-rich boride and Mn₃Si intermetallic compound. For all samples, the γ solid solution was formed in the isothermal solidification zone of the bonding zone. To evaluate the effect of TLP bonding time on mechanical properties of joints, the shear strength and micro-hardness of joints were measured. The results indicated a decrement of micro-hardness in the bonding zone and an increment of micro-hardness in the adjacent zone of joints. The minimum and maximum values of shear strength were 100 and 180 MPa for joints with the bonding time of 20 and 240 min, respectively.     

New insights into microstructural changes during transient liquid phase bonding of GTD-111 superalloy

The effects of joining temperature (T_J) and time (t_J) on microstructure of the transient liquid phase (TLP) bonding of GTD-111 superalloy were investigated. The bonding process was applied using BNi-3 filler at temperatures of 1080, 1120, and 1160 °C for isothermal solidification time of 195, 135, and 90 min, respectively. Homogenization heat treatment was also applied to all of the joints. The results show that intermetallic and eutectic compounds such as Ni-rich borides, Ni−B−Si ternary compound and eutectic-γ continuously are formed in the joint region during cooling. By increasing t_J, intermetallic phases are firstly reduced and eventually eliminated and isothermal solidification is completed as well. With the increase of the holding time at all of the three bonding temperatures, the thickness of the athermally solidified zone (ASZ) and the volume fraction of precipitates in the bonding area decrease and the width of the diffusion affected zone (DAZ) increases. Similar results are also obtained by increasing T_J from 1080 to 1160 °C at t_J=90 min. Furthermore, increasing the T_J from 1080 to 1160 °C leads to the faster elimination of intermetallic phases from the ASZ. However, these phases are again observed in the joint region at 1180 °C. It is observed that by increasing the bonding temperature, the bonding width and the rate of dissolution of the base metal increase. Based on these results, increasing the homogenization time from 180 to 300 min leads to the elimination of boride precipitates in the DAZ and a high uniformity of the concentration of alloying elements in the joint region and the base metal.     

A Novel Strategy for Preparing Stretchable and Reliable Biphasic Liquid Metal

Low‐melting liquid metal is a hugely promising material for flexible conductive patterns due to its excellent conductivity and supercompliance, especially low‐cost and environmental liquid processing technology. However, the ever‐present fluidity characteristic greatly limits the stable shape and reliability of prepared liquid metal conductive electronics. Herein, a novel solidification strategy of liquid GaIn alloys by Ni doping and heat treatment is first reported, which can efficiently create a solid phase in the liquid metal and provide an effective solution for practical applications. Particularly, the liquid characteristic is preserved for conveniently fabricating different flexible electronic circuits, and then the solidification is carried out on prepared conductive patterns by heat treatment. The solidification mechanism is revealed by the interface chemical reaction between Ni and GaIn, creating the solid phase of intermetallic compound (Ga₄Ni₃ and InNi₃) during heat treatment. Moreover, a biphasic GaInNi can be obtained by regulating the atomic ratio of gallium, indium, and nickel. As a result, the obtained GaInNi possesses extremely low sheet resistance (15 ± 4.5 to 135 ± 2.5 mΩ sq^?1) and the variation of ΔR/R₀ exhibits low level (0–2) when strained up to 100%, which offers a promising strategy to prepare stretchable and reliable liquid metal electronics.     

耐蚀合金中TiN析出机制

摘要：TiN颗粒尺寸及其分布对耐蚀合金性能有明显的影响，因此有必要对TiN在铸坯中的分布及其析出行为进行研究。采用扫描电镜(SEM)、金相显微镜（OM）观察了TiN夹杂物在铸坯中的分布、尺寸及其形貌；基于热力学和动力学理论分析了耐蚀合金铸坯中TiN夹杂物的析出时机及其尺寸，结合试验结果和理论计算明确了TiN夹杂物在凝固后铸坯中的位置和尺寸与析出时机的关系，为控制TiN夹杂物提供理论指导。结果表明，冶炼过程中析出的TiN夹杂物尺寸较大，在凝固过程中被枝晶吞没，位于铸坯枝晶内和等轴晶内；微观偏析计算结果表明，在凝固分数为0.55时，TiN开始析出，最开始析出TiN夹杂物的逐渐长大，长大后的TiN易于被二次枝晶吞没，最终位于铸坯中的枝晶间和等轴晶内，后期析出的TiN则在枝晶间和等轴晶间。固相中析出的TiN夹杂物长大较慢，尺寸细小，最终位于奥氏体晶界。     

Probing the degenerate pattern growth of {100}<011> orientation in a directionally solidified Al-4.5 wt% Cu alloy

Degenerate pattern is a seemingly disordered morphology but it exhibits the inherently ordered crystal connected with tip-splitting and limited stability which makes it difficult to observe in the metallic system. Here we employ (100)[011] orientated planar-front seeds using directional solidification and reveal the fundamental origins of the degenerate pattern growth in an Al-4.5 wt% Cu alloy. We find that the spacing of the tip-splitting (λ) in the degenerate of the alloys followed a power law, λ∝V^−0.5, and the frequency (f) of the splitting was related to the growth velocity (V) by ƒ∝V^1.5. The dimensionless growth direction (θ/θ₀) increased monotonously and approached 0.6 with faster velocity, attributed to its anisotropy in the interface kinetics. Once growth velocity exceeded a threshold, two types of pattern transitions from degenerate to regular dendrites were proposed. One of them exhibited a random and chaotic mode and the other underwent a rotation in growth direction.     

Solidification of Be-free Ni-based dental alloy

A novel, Nb- and Si-rich and Be-free Ni-based alloy was cast by two methods of investment casting and continuous casting to study the microstructure evolution during solidification and its mechanical properties. The solidification of the alloy started with the primary crystallization of FCC-γ, followed by a binary eutectic reaction, with the formation of a heterogeneous constituent: FCC-γ+G-phase, which replaced the low-melting eutectic (FCC-γ+NiBe) in the Be-bearing alloys. AlNi₆Si₃ and γ′ formed during the terminal stages of solidification by investment casting, while the formation of AlNi₆Si₃ was suppressed by continuous casting. The Scheil solidification model agreed very well with the experimental results.     

Impact of the solidification path of FeOx–SiO2 slags on the resultant inorganic polymers

Aiming to reduce the carbon dioxide emissions associated with cement production, alternative binders such as inorganic polymers currently receive substantial attention and slags from the non-ferrous metallurgy are promising precursors. However, studies  that correlate their chemistry and crystallinity with the newly formed binder remain limited. In this work, the effect of three different solidification methods on glass formation and reactivity of FeO_x–SiO₂ slags, as well as on the molecular structure of the resultant Fe-rich inorganic polymers, was investigated. The inorganic polymers were synthesized by mixing the slags (approximate molar ratio FeO/SiO₂ = 1.6) with an alkali silicate solution (molar ratios SiO₂/Na₂O = 1.6 and H₂O/Na₂O = 25). Results demonstrated that higher cooling rates promoted higher glass formation and faster reaction kinetics when the slags were activated. ⁵⁷Fe Mössbauer spectroscopy indicated that all the slags consisted predominantly of Fe²⁺ ions with a minor amount of Fe³⁺ ions, regardless of the variability in glass content. The binder phase of all inorganic polymers consisted of iron in both Fe²⁺ and Fe³⁺ states, after 28 days of curing. After pulverizing the inorganic polymer pastes and exposing the powder to air for 28 additional days, the Fe²⁺ state in the binder transformed to Fe³⁺. The compressive strength evolution of the three slags showed that the 2-day strength was higher for the samples with a higher amorphous fraction, while after 28 days, this influence was less pronounced.     

快速凝固高硅铝合金加热过程中的组织转变

利用气雾化法制备高硅铝合金粉末,采用光学显微镜(OM)、扫描电镜(SEM)等现代测试手段,分析快速凝固高硅铝合金不同粒度粉末微观组织和结构特征,研究在不同加热温度和保温时间条件下针状富铁相的转变特性及β-Si相的粗化行为。结果表明:快速凝固高硅铝合金组织主要以基体上分布有大量细小的颗粒状和针状相为特征,合金粉末在加热过程中,随着温度的升高和保温时间的延长,颗粒β-Si相有粗化趋势,针状非平衡富铁相转变为棒状或颗粒状平衡相。通过台阶式连续加热模拟试验可获得针状相基本消失且颗粒β-Si相未发生明显粗化的组织。     

喷射成形Al-Zn-Mg-Cu合金挤压态的组织和力学性能

研究了利用喷射成形辅以挤压制备Al-5.72Zn-2.36Mg-1.66Cu合金后优化的组织结构特征和力学性能。结果表明,合金基体组织均匀细化,晶粒形貌趋于圆整,平均晶粒大小达到10 μm左右。当合金的冷却条件通过快速凝固技术改变时,会产生不同程度的固溶强化效果和第二相弥散强化效果,从而改善了合金的整体性能。合金的屈服强度和抗拉强度分别平均提高了20%左右,且伸长率也略有提高。     

Microstructure and magnetostrictive performance of NbC-doped<100>oriented Fe-Ga alloys

The<100>oriented Fe83Ga17 alloy rods with various NbC contents less than 1at%were prepared by the directional solidification method at a growth rate of 720 mm?h?1. Low NbC-content was found to affect t...