New food safety challenges of viral contamination from a global perspective: Conventional,emerging, and novel methods of viral control

Food- and waterborne viruses, such as human norovirus, hepatitis A virus, hepatitis E virus, rotaviruses, astroviruses, adenoviruses, and enteroviruses, are major contributors to all foodborne illnesses. Their small size, structure, and ability to clump and attach to inanimate surfaces make viruses challenging to reduce or eliminate, especially in the presence of inorganic or organic soils. Besides traditional wet and dry methods of disinfection using chemicals and heat, emerging physical nonthermal decontamination techniques (irradiation, ultraviolet, pulsed light, high hydrostatic pressure, cold atmospheric plasma, and pulsed electric field), novel virucidal surfaces, and bioactive compounds are examined for their potential to inactivate viruses on the surfaces of foods or food contact surfaces (tools, equipment, hands, etc.). Every disinfection technique is discussed based on its efficiency against viruses, specific advantages and disadvantages, and limitations. Structure, genomic organization, and molecular biology of different virus strains are reviewed, as they are key in determining these techniques effectiveness in controlling all or specific foodborne viruses. Selecting suitable viral decontamination techniques requires that their antiviral mechanism of action and ability to reduce virus infectivity must be taken into consideration. Furthermore, details about critical treatments parameters essential to control foodborne viruses in a food production environment are discussed, as they are also determinative in defining best disinfection and hygiene practices preventing viral infection after consuming a food product.     

Sustainable phenolic thermosets coatings derived from urushiol

The over-exploitation of finite fossil resources and/or the increased environmental and sustainable awareness inspire scientists and technologists to search for inexpensive alternatives from renewable chemicals. Phenol formaldehyde (PF) resins, the oldest type of synthetic polymers with good mechanical properties and heat resistance, are widely used in the production of coatings, laminates, molding compositions, and glues. Here, biobased urushiol-derived PF resins were synthesized from the alkali-catalyzed reaction between urushiol and formaldehyde. The chemical compositions and molecular structures of resole resins were characterized by carbon-13 nuclear magnetic resonance and Fourier transform infrared spectroscopy, and their curing behaviors were studied by differential scanning calorimetry. The as-prepared urushiol-derived resole resins had methylol (Ph−CH₂OH), ortho- and para-hemiformal groups (Ph−CH₂OCH₂OH), and the para−para/ortho−para/ortho−ortho links of methylene groups (Ph−CH₂−Ph), whereas the resole resins had low curing temperatures at about 100–113°C. Additionally, given the long side alkyl group moiety on the aromatic rings of urushiol, the films of cured urushiol-derived resole resins had low glass transition temperatures of 132 ± 2°C. Furthermore, the as-prepared urushiol-derived coatings exhibited excellent physical and mechanical properties.     

一种新型的室温快速固化胶黏剂的研制

本文开发了一种新型的方舱夹芯板用室温固化高强度环氧结构胶黏剂,验证了其物化特性、相关力学性能和环境适应性。结果表明此胶黏剂具有优良性能,可以满足方舱用大板胶黏剂的使用需求。     

浅渍法发酵豇豆的工艺优化

以具有降解亚硝酸盐功能的植物乳杆菌（Lactobacillus plantarum）SD-7和具有优良抗氧化能力的植物乳杆菌（Lactobacillus plantarum）FM-LP-9为复合发酵剂（1∶1），采用浅渍法发酵豇豆。以硬度和感官评分为考察指标，通过单因素试验及响应面试验研究复合发酵剂接种量、发酵温度和发酵时间对浅渍法发酵豇豆品质的影响。结果表明，最佳发酵工艺条件为发酵温度25 ℃，接种量5%，发酵时间125 h，在此优化条件下，得到的浅渍法发酵豇豆硬度为47.31 N，感官评分为90.98分，香气浓郁、口感脆嫩。     

稀土La2O3改性脲醛树脂的黏度特性研究

脲醛树脂(UF树脂)胶黏剂具有胶合强度高、制作简单、成本低廉、原料来源丰富等一系列特点,成为我国人造板生产的主要胶种,是市场上需求量最大的胶黏剂之一。但由于在固化时会放出刺激性的甲醛,游离甲醛高,在使用时严重危害人的健康。近年来,随着人们环保意识的提高,生产和使用低毒UF树脂胶势在必行。本文介绍了稀土氧化镧对脲醛树脂的改性过程并对改性后脲醛树脂胶的各项性能进行了测试。本实验通过在不同反应阶段加入稀土氧化镧,分别探讨它们对脲醛树脂胶黏剂性能影响。实验表明:在脲醛树脂胶中加入稀土氧化镧可以增加黏度、固化时间、固含量,并可以减少游离甲醛释放量。     

暗纹东方鲀鱼精蛋白的纯化及抑菌活性研究

采用葡聚糖凝胶(Sephadex G-50)层析和羧甲基琼脂糖凝胶FF(CM Sepharose Fast Flow)离子交换层析对暗纹东方鲀鱼精蛋白进行纯化,利用精氨酸显色反应鉴定鱼精蛋白,并测定了鱼精蛋白对金黄色葡萄球菌、大肠杆菌和沙门氏菌的最小抑菌浓度、抑菌圈直径和生长曲线的影响。结果表明,暗纹东方鲀鱼精蛋白在217,273nm处各有1个吸收峰且217nm处的吸收峰较高,经SDS-PAGE电泳发现纯化后的鱼精蛋白白条带较纯化前的细且无拖尾现象;暗纹东方鲀鱼精蛋白对革兰氏阴性菌(沙门氏菌和大肠杆菌)和革兰氏阳性菌(金黄色葡萄球菌)均具有抑制作用,可以延缓菌种的生长,对金黄色葡萄球菌、大肠杆菌和沙门氏菌的最小抑菌浓度分别为500,1 000,1 000mg/L。     

气体开关串级环形间隙放电相互影响机制研究

针对中空和非中空触发电极结构的两间隙开关，进行了触发击穿特性实验，对比两个间隙的击穿抖动和通道数，分析了串级两间隙的相互影响机制。实验结果表明：两只开关触发间隙击穿抖动和通道数变化规律基本一致；非中空开关自击穿间隙击穿抖动随工作系数的增大而减小，最小约3 ns，中空开关自击穿间隙击穿抖动始终约1 ns；非中空开关自击穿间隙难形成多通道放电，中空开关自击穿间隙通道数明显多于其他间隙。触发间隙首先放电产生紫外光，通过触发电极中空通孔预先照射自击穿间隙产生初始电子，是自击穿间隙击穿抖动减小、通道数增加的主要作用机制。     

Curing kinetics and mechanical properties of fast curing epoxy resins with isophorone diamine and N-(3-aminopropyl)-imidazole

Fast curing epoxy resins were prepared by the reactions of diglycidyl ether of bisphenol A with isophorone diamine (IPD) and N-(3-aminopropyl)-imidazole (API), and their curing kinetics and mechanical properties influenced by IPD content were also investigated. The analysis of curing kinetics was based on the nonisothermal differential scanning calorimetry (DSC) data with the typical Kissinger, Ozawa, and Flynn–Wall–Ozawa models, respectively. The glass-transition temperature was also measured by the same technique. Additionally, the mechanical properties including flexural, impact, and tensile performances were tested, and the curing time was estimated by isothermal DSC. The degree of cure (α) dependency of activation energy (E_a ) revealed the complexity of curing reaction. Detailed analysis of the curing kinetics at the molecular level indicated that the dependence of E_a on the α was a combined effect of addition reaction, autocatalytic reaction, viscosity, and steric hindrance. From the nonisothermal curves, the curing reaction mechanism could be proposed according to the increasingly obvious low temperature peaks generated by the addition reaction of epoxy group with the primary amines in API and IPD molecules. Using the preferred resin formulation, the resin system could be cured within 10 min at 120 °C with a relatively good mechanical performance. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 47950.     

Ultralow-threshold wideband-tunable single-mode ultraviolet lasing from lanthanide-doped upconversion nanomaterials

Ultraviolet (UV) lasers with dynamic wavelength-tunability and high monochromaticity are crucial in a multitude of practical applications yet still remarkable challenges. Here, we show wide wavelength-tuning of single-mode UV lasing based on lanthanide-doped upconversion nanoparticles (UCNPs). The rationally designed Yb³⁺/Er³⁺/Tm³⁺/Gd³⁺/Ce³⁺ co-doped multilayer UCNPs, which exhibits a broad gain spectrum with the full width of half maximum of around 57 nm in the UV regime, are developed. More importantly, by taking advantages of a diffraction grating as the tuning component, stable single-mode emission can be achieved in the UCNPs-based external-cavity-extended Fabry–Pérot laser at room temperature. Specifically, the lasing threshold is around 137 µJ cm^–2, which is two orders of magnitude lower than that in the previously reported articles. Precise wavelength-tuning from 310 to 363 nm can be realized by adjusting the Littrow angle. This achievement highlights a portable alternative to continuously wideband-tunable UV lasers and opens up new opportunities for constructing compact solid-state UV photon sources.     

Development of silicon wafer packaging technology for deep UV LED

This paper reports a deep‐ultraviolet LED (deep‐UV‐LED) package based on silicon MEMS process technology (Si‐PKG). The package consists of a cavity formed by silicon crystalline anisotropic etching, through‐silicon vias (TSVs) filled with electroplated Cu, bonding metals made of electroplated Ni/AuSn and a quartz lid for hermetic sealing. A deep‐UV LED die is directly mounted in the Si‐PKG by AuSn eutectic bonding without a submount. It has advantages in terms of size, heat dissipation, light utilization efficiency, productivity and cost over conventional AlN ceramic packages. We confirmed a light output of 30 mW and effective reflection on Si (111) cavity slopes in the Si‐PKG. Based on simulation, further improvement of the optical output is expected by optimizing DUV‐LED die mount condition.