生物质纤维和改性木质素对聚乳酸结晶性能的影响

采用改性木质素(MZS)作为成核剂,生物质纤维(BF)作为增强剂,通过双螺杆挤出机制备了生物降解的聚乳酸(PLA)/BF/MZS材料。采用差式扫量热仪(DSC)、电子万能试验机和扫描电子显微镜(SEM)分析了BF和MZS对PLA材料性能的影响。结果表明,BF和MZS有效提高了PLA的结晶能力和力学性能。当BF和MZS的含量分别为15%和1%时,PLA材料结晶度提高至67.1%,在50℃/min降温速率下仍具有较高的结晶能力。105℃等温结晶时,15%BF和1%MZS的PLA材料半结晶时间降低至9.0 s,比纯PLA缩短了72.2%。当PLA含有3%BF和1%MZS时,拉伸强度和冲击强度分别为70.1 MPa和7.4 kJ/m^2,比纯PLA分别提高了7.8%和10.4%,根据SEM显示,当BF含量为3%时,在PLA材料中分布较均匀。     

The effect of charge on the dihydrogen storage capacity of Sc2–C6H6

The effect of charge on the dihydrogen storage capacity of Sc₂–C₆H₆ has been investigated at B3LYP-D3/6-311G(d,p) level. The neutral system Sc₂–C₆H₆ can store 8H₂ with gravimetric density of 8.76 wt %, and one H₂ dissociates and bonds atomically on the scandium atom. The adsorption of 8H₂ on Sc₂–C₆H₆ is energetically favorable below 155 K. The atom-centered density matrix propagation (ADMP) molecular dynamics simulations show that Sc₂–C₆H₆ can adsorb 3H₂ within 1000 fs at 300K. Compared with Sc₂–C₆H₆, the charged systems can adsorb more hydrogen molecules with higher gravimetric density, and all the H₂ are adsorbed in the molecular form. The gravimetric densities of Sc₂–C₆H₆⁺ and Sc₂–C₆H₆²⁺ are 9.75 and 10.71 wt%. Moreover, the maximum adsorption of charged systems are favorable in wider temperature range. Most importantly, the ADMP-MD simulations indicate that Sc₂–C₆H₆²⁺ can adsorb 6 hydrogen molecules within 1000 fs at 300K. It can be found that the gravimetric density (6.72 wt%) of Sc₂–C₆H₆²⁺ still exceeds the target of US Department of Energy (DOE) under ambient conditions.     

An end-to-end denoising autoencoder-based deep neural network approach for fault diagnosis of analog circuit

Analog Integrated Circuits and Signal Processing - Fault diagnosis of analog circuit is critical to improve safety and reliability in electrical systems and reduce losses. Traditional fault...     

ACTNET: End-to-End Learning of Feature Activations and Multi-stream Aggregation for Effective Instance Image Retrieval

International Journal of Computer Vision - We propose a novel CNN architecture called ACTNET for robust instance image retrieval from large-scale datasets. Our key innovation is a learnable...     

Understanding trust in ms-commerce: The roles of reported experience,linguistic style,profile photo,emotional, and cognitive trust

This paper examines what influences trust in mobile social commerce environment. Drawing on trust-based acceptance model (i.e. cognitive and emotional trust) and online review features (i.e. profile photo, linguistic style, and reported experience), we examine how these factors affect trust in mobile social commerce. Hypotheses were tested using survey data. The results of our model showed that there are significant influences of profile photo, reported experience, cognitive, and emotional trust towards trust in ms-commerce. This work contributes to existing literature by examining the roles of previous trust in mobile payments and online reviews on trust in mobile social commerce.     

Effect of coupling agent content on properties of composites made from polylactic acid and chrysanthemum waste

Chrysanthemum flower is among one of the highly sought after and widely planted flower crops, in particular for cultural and religious ceremonies. However, the chrysanthemum stem and stalk have little value and usually discard as by‐product waste from floristry. The objective of this research is to investigate the potential value of utilizing chrysanthemum stem and stalk as reinforcing fillers for thermoplastic composites. In this study, 2‐mm thick composite sheet containing predefined formulations of polylactic acid (PLA), chrysanthemum waste filler (CWF) ranging from 15 to 60 phr, and maleated polyethylene (MAPE) coupling agent up to 5 phr were prepared with the aid of Haake internal mixer and compression molding. The effect of MAPE loading on tensile, thermal, and morphological properties of PLA/CWF composites was investigated. The findings revealed that PLA/CWF composite attained improved tensile modulus compared to the neat PLA, and the tensile modulus increases with higher concentration of CWF. However, both tensile strength and elongation at break reduces with increase loading of CWF. Overall, PLA/CWF composites with MAPE shows better performance compared to those without MAPE, where an optimum strength of 21.8 MPa can be achieved with 60 phr CW and 3 phr MAPE. The measured tensile strength is comparable to alternatives natural fiber thermoplastic composites demonstrating its potential to be used in non‐structurally demanding application. J. VINYL ADDIT. TECHNOL., 26:10–16, 2020. © 2019 Society of Plastics Engineers     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

基于MPEG-2文件的合并

介绍了具有相同音频、视频编码方式的MPEG - 2节目流如何合并成一个节目流。合并后的文件播放流畅并且时间显示正确 ,它包括PATPMT表的重写 ,系统头部分相关字段的更改 ,PCR值的修改 ,解码时间标签 (DTS)和显示时间标签 (PTS)的重新确定 ,传送速率的修改以及添加相应的空包