新型碱性精抛液对300mm铜膜全局平坦化的影响

The copper removal rate and uniformity of two types copper slurries were investigated, which was performed on the 300 mm chemical mechanical planarization （CMP） platform. The experiment results illustrate that the removal rate of the two slurries is nearly the same. Slurry A is mainly composed ofa FA/OI1 type chelating agent and the uniformity reaches to 88.32%. While the uniformity of slurry B is 96.68%, which is mainly composed of a FA/OV type chelating agent. This phenomenon demonstrates that under the same process conditions, the uniformity of different slurries is vastly different. The CMP performance was evaluated in terms of the dishing and erosion values. In this paper, the relationship between the uniformity and the planarization was deeply analyzed, which is mainly based on the endpoint detection mechanism. The experiment results reveal that the slurry with good uniformity has low dishing and erosion. The slurry with bad uniformity, by contract, increases Cu dishing significantly and causes copper loss in the recessed region. Therefore, the following conclusions are drawn： slurry B can improve the wafer leveling efficiently and minimize the resistance and current density along the line, which is helpful to improve the device yield and product reliability. This investigation provides a guide to improve the uniformity and achieve the global and local planarization. It is very significant to meet the requirements for 22 nm technology nodes and control the dishing and erosion efficiently.     

政府信息资源开发及利用中存在的问题及建议

在政府信息资源开发利用工作中，存在很多不利于其健康、快速发展的问题。现根据我们多年从事这项工作的经历就以下几个突出问题谈点看法。     

浅谈多雨地区水工沥青混凝土心墙快速施工技术及质量控制

本文主要依托黔江区老窖溪水库工程沥青混凝土心墙施工,从施工策划、机械选型、科学施工及质量控制等方面阐述了多雨地区碾压式水工沥青混凝土心墙施工技术及质量控制措施在工程实践中的应用,在保证工程质量的前提下,突破现有规范瓶颈,提出和总结出了一套适用于多雨地区沥青混凝土心墙的快速施工技术及质量控制措施,增加了全年有效施工时间,减低了工程成本,经济和社会效益明显,在同气候、同类型工程中具有一定的推广价值。     

螯合剂与氧化剂协同比对化学机械平坦化的影响

主要研究了不含BTA(苯并三唑)等抑制剂，以化学作用为主的碱性抛光液中，氧化剂与螯合剂协同比对平坦化的影响。抛光液主要包括螯合剂、非离子型表面活性剂、磨料和氧化剂。研究了氧化剂与螯合剂不同协同比，对抛光速率和静态腐蚀速率的影响规律，进一步研究了协同比对平坦化的影响。平坦化结果显示，固定螯合剂含量，随着氧化剂含量的增加，蝶形坑先减小后增大。当氧化剂含量为螯合剂含量三倍的时（即协同比为3），蝶形坑增加最小。基于化学机械协同作用的动力学控制过程，提出了一个理论模型。根据理论模型，分析了氧化剂与螯合剂协同比对高低速率差的影响，并对平坦化结果进行了分析解释。实验结果显示，当氧化剂与螯合剂协同比在区间2.5-3.5之间时，高低速率差较大，在此区间可以实现好的平坦化效果。本文为以后分析和研究碱性精抛液，解决低凹处铜线条腐蚀问题提供了新思路。     

不同磨料质量分数对化学机械平坦化的影响

采用自主研发的碱性铜抛光液,在E460E机台上研究了不同磨料质量分数对铜和钽抛光速率与膜厚一致性的影响;分析了磨料质量分数为2%,2.8%和3.6%时,膜厚一致性对平坦化的影响。抛光结果显示:当磨料质量分数高于2.8%时,抛光液开始对钽进行有效的抛光;随着磨料浓度的增加,抛光液的膜厚一致性提高趋于平缓。磨料质量分数为2.8%和3.6%时,抛光后膜厚一致性变好,碟形坑满足工业生产要求;磨料质量分数为2%时,抛光后膜厚一致性比抛光前恶化,碟形坑相对较大。由此可见,当磨料质量分数为2.8%时,抛光液能有效去除残余铜,并且抛光后膜厚一致性好,有利于实现平坦化,尤其是对提高成品率和优品率有重要的作用。     

低磨料浓度的碱性铜抛光液平坦化性能的研究

A novel alkaline copper slurry that possesses a relatively high planarization performance is investigated under a low abrasive concentration.Based on the action mechanism of CMP,the feasibility of using one type of slurry in copper bulk elimination process and residual copper elimination process,with different process parameters,was analyzed.In addition,we investigated the regular change of abrasive concentration effect on copper and tantalum removal rate and within wafer non-uniformity(WIWNU) in CMP process.When the abrasive concentration is 3 wt%,in bulk elimination process,the copper removal rate achieves 6125 °/min,while WIWNU is 3.5%,simultaneously.In residual copper elimination process,the copper removal rate is approximately 2700°/min,while WIWNU is 2.8%.Nevertheless,the tantalum removal rate is 0 °/min,which indicates that barrier layer isn’t eliminated in residual copper elimination process.The planarization experimental results show that an excellent planarization performance is obtained with a relatively high copper removal rate in bulk elimination process.Meanwhile,after residual copper elimination process,the dishing value increased inconspicuously,in a controllable range,and the wafer surface roughness is only 0.326 nm(sq < 1 nm) after polishing.By comparison,the planarization performance and surface quality of alkaline slurry show almost no major differences with two kinds of commercial acid slurries after polishing.All experimental results are conducive to research and improvement of alkaline slurry in the future.     

气相色谱-质谱法测定茶叶中12种农药残留的方法

用气相色谱-质谱仪研究同时测定茶叶中12种农药残留的测定方法。分析样品经粉碎、浸泡，用丙酮-正己烷(1：4，V／V)AA，经活性炭柱和弗罗里硅土柱净化，乙醚-丙酮-正己烷(4：4：2，V／V／V)洗脱后，以环氧七氯为内标，GC／MS测定。经过对茶叶加标的回收实验，证实具有快速灵敏简便的优点，适用于多种农药残留分析。其平均回收率在75%-110％，变异系数下于21％，最低检测限为0．01-0．5mg／kg。     

稀释倍数对弱碱性铜粗抛液性能的影响

研究了三种不同稀释倍数的弱碱性铜粗抛液,原液采用商用FA/O型铜抛光液,稀释倍数分别为1倍、3倍和5倍。基于化学机械抛光(CMP)作用机理,在相同工艺条件下分析了三种粗抛液对铜膜的平均去除速率、片内非均匀性(WIWNU)和平坦化性能等指标的影响。铜膜的抛光实验结果表明:稀释3倍的弱碱性铜粗抛液对铜膜平均去除速率高达869.76 nm/min,片内非均匀性仅为2.32%。四层图形片的平坦化测试结果显示,图形片初始高低差为312.5 nm,采用稀释3倍的粗抛液抛光20 s后,有效消除高低差261.5 nm,基本实现了全局平坦化,满足45 nm技术节点的要求。     

液态奶中无机砷的测定

液态奶中以往均以总砷计算,这样难以鉴别奶中无机砷和有机砷的卫生评价。本方法采用盐酸浸提法,把样品中无机砷和有机砷分离出来。利用氢化物原子荧光法测定液态奶中无机砷,该方法简便、稳定、快速,准确,回收率为90%~102%,检出限为1μg/L。     

乳粉中卵磷脂含量的测定

全脂奶粉中脂肪含量高，奶粉颗粒或附聚团粒的外表面都有许多脂肪球，颗粒表面游离脂肪增多，由于表面张力的影响在水中不易润湿和下沉，因而不易溶解。卵磷脂既是一种亲水又亲油的表面活性物质，它作为一种乳化剂，被喷涂在奶粉表面可显著增强奶粉的分散性，达到速溶的目的。同时卵磷脂是一种营养保健食品。