Q235钢搅拌摩擦焊接头微观组织与力学性能分析

在焊接速度为100 mm/min和搅拌头转速为450 r/min的工艺参数下,采用钨铼合金搅拌头对3 mm厚Q235钢进行了搅拌摩擦焊试验,并对接头的微观组织及力学性能进行了研究. 结果表明,在该工艺参数下可以获得表面无缺陷、成形良好的焊缝. 焊后搅拌头表现出一定程度的磨损及氧化. 接头截面各区域承受不同的热力联合作用,经历了不同的组织转变过程,但均保持铁素体和珠光体组织. 接头显微硬度最大值位于焊核区. 接头拉伸断裂位置处于热影响区,拉伸断口呈韧性断裂特征.     

Graphene-coated copper foam interlayer for brazing carbon/carbon composite and niobium

Problems such as poor structural integrity, inhomogeneous dispersion, and agglomeration of graphene in the brazing seam are typically encountered for graphene additives in a brazed joint interface. To resolve these problems, a plasma-enhanced chemical vapor deposition process was employed for in-situ preparation of a high-quality graphene-coated copper (Cu) foam composite interlayer prior to be applied for brazing carbon/carbon composite and niobium. The prepared graphene and the brazed joints were characterized via Raman spectroscopy, scanning electron microscopy, and high-resolution transmission electron microscopy. The results revealed that graphene was evenly distributed in the brazing seam with the help of the Cu foam, which was characterized by interconnected porosity. Simultaneously, the excellent chemical inertia of graphene inhibited the collapse of the Cu foam, based on which the thermal residual stress in the joint was effectively mitigated due to the synergistic reinforcement effect of the Cu foam (with good plastic deformation capacity) and graphene (with extremely low coefficient of linear expansion). This effect led to significant improvement in the average shear strength of the joint.     

Ti-50Ni钎焊TZM与ZrCp-W接头界面组织及性能

采用Ti-50Ni(at%)钎料实现了TZM合金与ZrC_p-W复合材料的真空钎焊连接,通过SEM、EDS、XRD等方法分析了接头界面的微观组织结构,研究了钎焊温度对TZM/Ti-50Ni/ZrC_p-W接头界面组织及性能的影响。结果表明:钎焊接头的典型界面结构为TZM/Ti-Mo+TiNi_3+Mo-Ti-W/Ti Ni+TiNi_3+W(s,s)+(Ti,Zr)C/ZrC_p-W。随着钎焊温度的升高,Ti-Mo固溶体层宽度逐渐增大,线状条纹增多、增宽,组织逐渐粗大,晶界变圆滑;接头的抗剪强度随钎焊温度升高先升高后降低,当钎焊温度为1340℃,保温10 min时,接头获得最大抗剪强度为146 MPa。     

高铌TiAl合金钎焊接头组织和性能研究

采用Ti-28Ni(wt.%)共晶钎料在1100℃实现了高铌TiAl合金(Ti-45Al-8.5Nb-(W, B, Y) (at.%), 简称TAN)的真空钎焊连接。钎焊接头的典型界面结构为TAN/τ3-Al3Ti2Ni + B2/α2-Ti3Al layer/α2-Ti3Al + δ-Ti2Ni/α2-Ti3Al layer/τ3-Al3Ti2Ni + B2/TAN。深入研究了保温时间对钎焊接头界面组织和连接性能的影响。结果表明：Ni元素从熔融钎料向TAN母材的扩散决定了界面组织的演化,随着保温时间的延长促进了扩散层的增厚,同时导致钎缝宽度逐渐减小。接头剪切强度测试结果显示当保温时间为15分钟时,获得的最大接头室温剪切强度和高温(600℃)剪切强度分别是248.6MPa和166.4MPa。接头断口分析表明在剪切实验中裂纹主要沿着连续的金属间化合物层产生和扩展。     

钎焊温度对TC4/Ti60接头组织及性能的影响

为研究钎焊温度对TC4/Ti60接头组织及力学性能的影响,采用纯铜箔作为中间层对TC4与Ti60合金进行接触反应钎焊,钎焊温度范围为970~1 010℃.采用SEM,EDS,XRD,拉剪试验对接头组织及力学性能进行研究.结果表明,接头的典型界面组织为TC4/α-Ti+Ti_2Cu/Ti_2Cu/Ti Cu/Ti_2Cu/α-Ti+Ti_2Cu/Ti60.随着钎焊温度的升高,基体侧的反应扩散层厚度增加,钎缝厚度及Ti-Cu金属间化合物含量逐渐减少,钎缝成分趋于均匀化.接头抗剪度随钎焊温度的升高先增加后减少,当钎焊工艺为1 000℃保温10 min时,接头抗剪强度最高为130 MPa.断口分析表明,接头断裂于钎缝与扩散反应层之间,断裂方式为准解理断裂.     

TC4/Ta-W合金异种金属电子束焊接

对TC4/Ta-W合金电子束焊接进行了研究,采用偏向钽钨合金一侧进行焊接的方式进行分析.电子束焊接接头成形良好,在一定偏束量时焊缝中Ta和W元素含量较高,焊缝组织为以β钛为基的固溶体组织,无脆性化合物生成,存在富钽区和贫钽区.焊缝中元素分布不均匀,在偏束量为0.6 mm时焊缝中含钛相对较多,约为60%,而钽钨母材熔化相...     

电子束表面合金化研究进展

阐述了电子束表面合金化的基本原理及国内外电子束合金化设备的应用和发展.介绍了强流脉冲电子束表面合金化做为一种新型表面合金化方法在研究领域的应用,并综述了近年来电子束表面合金化研究的发展动态,简述了国内外相关领域的主要研究成果及取得的进展.对电子束表面合金化技术做出了展望,指出合金层的定量控制,电子束与表层金属间的热力耦...     

304不锈钢与QCr0.8铬青铜填加铜焊丝的电子束焊接

采用填铜焊丝对304不锈钢与QCr0.8铬青铜进行电子束焊接。采用正交试验法研究不同工艺参数对焊接接头抗拉强度的影响,并对焊接工艺参数进行优化。优化工艺参数如下：束流30 mA,焊接速度100 mm/min,送丝速度1 m/min,束偏移量-0.3 mm。对优化后接头组织的分析结果表明,焊缝主要由树枝状α相与少量球形ε相组成;仅在焊缝区的上部出现铜的混合不均匀;而在铜侧熔合线附近存在一个铜的熔化但未混合区,该区域晶粒长大严重,是接头的最薄弱区。显微硬度测试结果显示,焊缝硬度随固溶体中铜含量的增加而减小。接头的最高抗拉强度为276 MPa。     

Investigation on diffusion bonding of TiAl intermetallic to Ti3AlC2 ceramic with Ni interlayer

In this study, vacuum atmosphere. The diffusion bonding of TiAI alloy and Ti3AlC2 ceramic was carried out using Ni foil as interlayer in a interfacial microstructures and the mechanical properties of the diffusion bonded joints were evaluated. Result showed that the interfacial microstructure of the joint from TiAl to Ti3AlC2 side could be divided into Al3NiTi2 , AlNi2 Ti , Ni3 （ Al, Ti） , Ni , Ni3 （ Al , Ti） , Ni （ Al , Ti ） , Ni3Al ＋ TiC~ ＋ Ti3AlC2 , respectively. The shear strength test showed that an average value of 45.9 MPa was achieved. The crack propagated along the interface between TiAl intermetallic and Ni interlayer during the shear test. The mechanisms f or formation of those compound layers during bonding process and the determinant of the fracture location were also discussed.     

铝合金复合板钎焊接头组织特征

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