磨料有序排布电镀砂轮的制备及其把持力研究

为解决电镀砂轮磨削加工中容屑空间不足的问题，采用点胶微粘接的方法制备了磨料有序排布的电镀砂轮，分析了磨料粘接效果和镀层力学性能。通过SEM分析了磨料/镀层/导电胶的结合界面，并进行了干磨削试验。研究结果表明，直径约为磨料粒径40%的胶点可粘接住磨料，单个胶点上粘接多颗磨料的占比小于6%；双脉冲电镀工艺制备的镀层显微硬度大于500HV，表层残余应力小于100MPa，磨料/镀层/导电胶之间的界面贴合紧密，无明显缺陷；砂轮在磨削时没有出现磨料脱落现象。     

Effects of sintering in a high magnetic field on properties of vitrified bond and vitrified CBN composites

Vitrified bond CBN grinding wheels are being widely used due to their superior performance. Also, advantages of vitrified grinding wheels are high elastic modulus, stable chemical property, and low thermal expansion coefficient. Brittleness and low strength are key factors restricting the development of vitrified bond CBN grinding wheels. In this paper, the sintering in a high magnetic field was innovatively introduced into the manufacturing of vitrified bond CBN grinding wheels, and the effects of sintering in a high magnetic field on properties on vitrified bond and vitrified CBN composites were systematically investigated. Vitrified bond was characterized using three-point bending, scanning electron microscopy, X-ray diffraction. It was observed that microstructure of vitrified bond could be changed, grain orientation could be controlled and average grain size could be decreased in a high magnetic field, while vitrified bond strength could be simultaneously improved. High quality vitrified bond could be obtained by appropriately adjusting the strength and direction of high magnetic field. Results demonstrated that vitrified bond properties were improved when the magnetic field strength was 6?T. In order to highlight the high magnetic field effect on the vitrified CBN composites, the ordinary CBN abrasives and nickel plated CBN abrasives were used respectively. Microstructures, bending strengths of vitrified CBN composites were compared in different high magnetic fields. When the magnetic field strength was appropriate (less than 6?T), the binding characteristic of vitrified bond CBN composites with nickel plated CBN abrasives was greatly improved. The highest bending strength value of vitrified CBN composites was 79.5?MPa in 6?T high magnetic field.     

在GPU上实现基于高斯映射的通用刀具扫描体建模

以针对数控加工仿真的需要,以高斯映射理论为基础、GPU为主要硬件平台,提出一种基于并行计算的快速通用刀具空间扫描体建模方法.首先结合通用刀具的数学模型,利用高斯映射理论分析刀具平动时的扫描体建模原理;然后分析刀具做任意空间运动时的刀具表面点法向量和对应的接触映射,推导求解扫描体包络边界的表达式;再根据GPU上的通用计算方法和GPU图形绘制管线设计基于GPU实现刀具空间扫描体建模的算法流程,并利用C++、Open GL和Open GL着色语言GLSL实现了该方法.通过刀具扫描体建模实例,验证了文中方法的正确性与实时性.     

采用旋转电极的金刚石表面镀镍方法及工艺

针对目前常用的固定电极滚镀法存在的镀覆效率低、镀层不均匀等问题,提出基于旋转电极的金刚石表面滚镀方法,并开发相应的滚镀装置。分析金刚石旋转电极滚镀法的镀覆机理,通过试验研究镀覆工艺参数对金刚石表面镀层沉积速率和镀层形貌的影响。结果表明:旋转电极可以驱动磨料堆增加其翻转频率和磨粒间的分散能力,提高磨粒堆与电极和镀液接触的均匀性,从而提高镀层的均匀性和表面质量。采用旋转电极滚镀法的最佳工艺参数为:镀覆电流为4 A,阴极转速为20 r/min,阴极转子直径为22.5 mm,金刚石粒度代号为70/80。增加磨粒堆的翻滚频率使磨粒间接触均匀性得到改善,增大滚镀空间和电极尺寸,进而增加单次镀覆的装载量。结果显示:采用旋转电极滚镀方法在2 L容量镀瓶中最大装载量可达700 g,约为相同条件下的固定电极装载量的2倍,显著提高了金刚石镀镍的生产效率。      

Chatter stability of micro end milling by considering process nonlinearities and process damping

The micro end milling uses the miniature tools to fabricate complexity microstructures at high rotational speeds. The regenerative chatter, which causes tool wear and poor machining quality, is one of the challenges needed to be solved in the micro end milling process. In order to predict the chatter stability of micro end milling, this paper proposes a cutting forces model taking into account the process nonlinearities caused by tool run-out, trajectory of tool tip and intermittency of chip formation, and the process damping effect in the ploughing-dominant and shearing-dominant regimes. Since the elasto-plastic deformation of micro end milling leads to large process damping which will affect the process stability, the process damping is also included in the cutting forces model. The micro end milling process is modeled as a two degrees of freedom system with the dynamic parameters of tool-machine system obtained by the receptance coupling method. According to the calculated cutting forces, the time-domain simulation method is extended to predict the chatter stability lobes diagrams. Finally, the micro end milling experiments of cutting forces and machined surface quality have been investigated to validate the accuracy of the proposed model.     

电厂凝汽器黄铜管腐蚀机理研究

分析电厂凝汽器铜管腐蚀失效情况。全面探讨铝黄铜凝汽器铜管腐蚀机理,及其影响因素。提出一定的防护措施及方法。对于解决目前我国电厂仍然大量存在的铜管腐蚀现象及事故,电厂的安全、经济、高效的运行有着一定的作用。     

两步法快速分离纯化单宁酶的研究

首先采用正交试验法优化单宁酶高产黑曲霉的发酵条件,考察了单宁酸含量、KH2PO4含量、(NH4)2SO4含量、MgCl2·6H2O含量、温度、pH值、摇速7个因素对单宁酶产量的影响;再通过两步简便而有效的方法分离纯化出电泳纯的单宁酶,其纯度和分子量分别采用高效液相色谱(HPLC)和SDS-PAGE法测定.通过正交试验结果的方差分析,得出单宁酸含量对产酶量影响比较显著,并确定黑曲酶发酵产酶的最佳条件为:2%单宁酸,0.1%KH2PO4,0.7%(NH4)2SO4,0.1%MgCl2·6H2O,温度40℃,pH值5.6,摇速140r/min.SDS-PAGE法测定该酶的分子量为119ku.     

基于凸多面体碰撞检测的虚拟砂轮建模研究

虚拟砂轮建模时大多采用包围球对磨粒进行碰撞检测,而包围球相互接触时凸多面体磨粒之间仍存在间隙,导致虚拟砂轮表面与实际砂轮表面差异较大,影响后续磨削过程仿真的准确性.针对这一问题,提出了一种基于凸多面体碰撞检测的虚拟砂轮建模方法.推导了砂轮表面磨粒随机位置的数学模型,基于凸多面体碰撞检测判断磨粒干涉状况,最终生成虚拟砂轮...     

Instantaneous uncut chip thickness modeling for micro-end milling process

The prediction model of instantaneous uncut chip thickness is critical for micro-end milling process, which can directly affect the cutting forces, surface accuracy, and process stability of the micro-end milling process. This paper presents an instantaneous uncut chip thickness model systematically based on the actual trochoidal trajectory of tooth and the tool run-out in micro-end milling process. The variable entry and exit angles of tool, which are affected by the tool run-out, are concerned in the model. The related instantaneous uncut chip thickness is evaluated by considering the theoretical instantaneous uncut chip thickness and the minimum uncut chip thickness, which is formulated by two types of material removal mechanisms, in the elastic-plastic deformation region and the complete chip formation region, respectively. In comparison with the instantaneous chip thickness obtained from the conventional model, the feasibility of the proposed model can be proved by the related simulation results with variable process parameters including feed per tooth, radial depth of cut, and tool run-out. In addition, the predicted and measured cutting forces are compared with validate the accuracy of the proposed instantaneous uncut chip thickness model for the micro-end milling process.